DSPIC33EP512GP506-H/PT - 16-bit DSC 70 MIPS 512KB Flash | Microchip
MPN: DSPIC33EP512GP506-H/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.35 | $63.50 |
| 100 | $5.8 | $580.00 |
| 500 | $5.25 | $2,625.00 |
| 1,000 | $4.8 | $4,800.00 |
DSPIC33EP512GP506-H/PT Overview
A digital signal controller is a hybrid device that combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and control architecture of a microcontroller. DSCs sit within the broader hierarchy of embedded processors - microcontroller unit (MCU) family, digital signal controller subfamily, digital signal processor category, and semiconductor - and are used where deterministic control loops and math-intensive signal processing must coexist in a single chip.
Key features of this general purpose (GP) family member include integrated operational amplifiers and comparators (per Microchip product data: 'Op Amps, Comparators'), a high-speed PWM module for motor control and power conversion, a CAN 2.0B controller for industrial networking, and the Peripheral Trigger Generator (PTG) for autonomous hardware-task scheduling. Operating voltage is 3.3V, and the -H suffix denotes the extended temperature variant of the standard industrial part.
Architecturally, the dsPIC33E core executes DSP instructions such as multiply-accumulate (MAC) with a hardware barrel shifter and dual address generation, achieving 70 MIPS peak throughput. The single-supply on-chip regulator simplifies power design, and boundary-scan/JTAG-style programming via ICSP interfaces to MPLAB X IDE and the MPLAB Snap or ICD 3/4 programmers.
Typical applications include BLDC and PMSM motor control (using the high-speed PWM), digital power supplies and inverters, industrial automation nodes with CAN bus, and sensor signal conditioning leveraging the on-chip op amps before the ADC pipeline.
Design consideration: the -H temperature option differs from the -I option in operating range; confirm the required grade before qualifying alternates, and verify that the 64-TQFP footprint (0.5 mm lead pitch) and pin assignment match when swapping family variants.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP512GP506-H/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP506-H/PT (same form factor and footprint) — differing in Package, Operating Temperature, Core, Packaging, RAM.
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DSPIC33EP512GP506-I/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP512GP504T-E/PT
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View Datasheet →DSPIC33EP512GM306T-I/PT
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$5.31 / Unit
View Datasheet →DSPIC33EP512GM310T-I/PF
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$15.95 / Unit
View Datasheet →DSPIC33EP512MC506T-I/PT
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$5.55 / Unit
View Datasheet →DSPIC33EP256MC206T-I/PT
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$4.2 / Unit
View Datasheet →DSPIC33EP512GP506T-I/PT
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View Datasheet →DSPIC33EP512GP506-H/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 512 KB (170K x 24) Flash |
| RAM Size | 48 KB |
| Supply Voltage | 3.3 V |
| Package | 64-TQFP (10x10 mm) |
| Mounting Type | Surface Mount |
| On-chip Peripherals | Op Amps, Comparators, High-Speed PWM, PTG |
| CAN Controller | Yes (CAN 2.0B) |
| Number of Pins | 64 |
| Series | dsPIC 33EP |
| Applications Grade | Automotive, Industrial, AEC-Q100 (per Hotenda listing) |
| RoHS Status | Compliant |
| Lifecycle Status | In Production |
| Programming/Debug Interface | ICSP (MPLAB Snap / ICD 3/4, MPLAB X IDE) |
DSPIC33EP512GP506-H/PT 64-tqfp (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512GP506-H/PT (64-tqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GP506-H/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GP506-H/PT is suitable for 6 applications: BLDC/PMSM Motor Control, Digital Power Supplies and Inverters, Industrial Automation with CAN Bus, Sensor Signal Conditioning and Data Acquisition, Automotive Body and Control Modules, Embedded Control with Autonomous Peripheral Operation.
BLDC/PMSM Motor Control
The DSPIC33EP512GP506-H/PT fits motor-control designs that combine sensor conditioning with high-resolution PWM generation. Its 70 MIPS dsPIC33E core executes field-oriented control (FOC) loops with hardware MAC and barrel-shifter support, while the high-speed PWM module generates complementary outputs with dead-time control for three-phase inverters. The integrated op amps amplify current-shunt or back-EMF signals directly before the ADC, removing external amplifier stages, and comparators support hardware overcurrent trip. In a typical topology the DSC reads phase currents through its ADC, runs FOC at several kHz update rates, and drives gate drivers via PWM. The CAN interface links the drive to industrial fieldbus supervisory systems. The trade-off versus GM/MC family members is a less specialized PWM feature set, so high-end drives may prefer DSPIC33EP512GM306, which shares this 64-TQFP footprint for easy migration.
Recommended
Digital Power Supplies and Inverters
For digitally controlled AC/DC and DC/DC converters, the DSPIC33EP512GP506-H/PT provides the fast control-loop execution and PWM resolution needed for voltage-mode or current-mode regulation. The 70 MIPS core closes current loops at tens of kHz while the high-speed PWM delivers fine duty-cycle resolution essential for converter stability and efficiency. On-chip comparators implement cycle-by-cycle overcurrent limiting in hardware with no CPU latency, and the PTG (Peripheral Trigger Generator) orchestrates ADC sampling and PWM updates autonomously, reducing interrupt jitter. Placed between the feedback dividers and gate-driver inputs, the DSC replaces discrete analog compensators and adds programmable soft-start, telemetry over CAN/UART, and field firmware updates. The -H temperature grade supports elevated ambient conditions inside sealed power enclosures where fanless designs push local temperatures above standard industrial ranges.
Recommended
Industrial Automation with CAN Bus
The integrated CAN 2.0B controller makes the DSPIC33EP512GP506-H/PT well suited for factory automation nodes, sensor concentrators, and distributed I/O that communicate on CAN or CANopen networks. The 70 MIPS core handles protocol stacks plus application logic concurrently, while 512 KB Flash leaves ample room for bootloader, protocol, and application firmware with room for field updates. The on-chip op amps and comparators condition analog sensor signals (pressure, level, temperature bridges) into the ADC without external amplification, cutting BOM cost per node. The -H grade covers control cabinets in hot industrial environments. Typical architecture: sensor front-end into ADC, control/decision logic in software, diagnostic and command traffic over CAN to a PLC backbone. Compared with a plain MCU plus external CAN transceiver and op-amp array, this single-chip integration shrinks board area and qualification effort.
Recommended
Sensor Signal Conditioning and Data Acquisition
The DSPIC33EP512GP506-H/PT is a strong fit for multi-channel data-acquisition front ends because it integrates operational amplifiers, comparators, and the ADC on one die. Sensor outputs from thermocouples, RTDs, strain gauges, or microphones can be amplified by the on-chip op amps and delivered straight to the ADC, while the 70 MIPS DSP engine applies digital filtering (FIR/IIR) using MAC instructions in real time. The 48 KB RAM buffers acquisition windows for peak detection, FFT analysis, or condition-monitoring algorithms. Hardware comparators provide threshold alarms independent of software. The PTG automates scan sequencing so sampling stays deterministic even with a busy CPU. This makes the part suitable for portable instrumentation, vibration monitors, and process transmitters. The extended -H temperature range benefits outdoor or engine-bay-adjacent sensing where ambient temperatures exceed standard industrial limits.
Recommended
Automotive Body and Control Modules
Listed under 'Automotive, AEC-Q100' by distributors, the DSPIC33EP512GP506-H/PT addresses automotive auxiliary control modules - lighting controllers, pump drivers, valve control, and sub-network gateways - that need robust 16-bit control plus CAN connectivity. The high-speed PWM drives LED strings or solenoid loads with dimming/soft-start profiles, the on-chip comparators implement lamp open/short diagnostics in hardware, and the CAN 2.0B controller integrates the module into in-vehicle networks via an external transceiver. The -H grade supports elevated under-dash and engine-compartment-adjacent ambient temperatures. The 512 KB Flash accommodates diagnostic stacks (UDS-style bootloaders) alongside application code. For formally qualified automotive production, confirm the exact AEC-Q100 qualification and PPAP support for your specific ordering code with Microchip, as qualification coverage is tied to the correct automotive ordering suffix rather than the generic GP506 base part.
Recommended
Embedded Control with Autonomous Peripheral Operation
Designs that need low-latency, low-jitter sequencing benefit from the PTG (Peripheral Trigger Generator) on the DSPIC33EP512GP506-H/PT. The PTG executes small trigger programs in hardware, stepping the ADC, PWM, timers, and output-compare modules through complex scan/act cycles without CPU intervention - freeing the 70 MIPS core for host communication, protocol stacks, or math. This suits battery chargers with staged charge profiles, adaptive lighting, and test-instrument front ends where deterministic timing matters more than raw throughput. The 3.3V single-supply operation with on-chip regulator simplifies power-tree design, and ICSP programming through MPLAB X IDE with MPLAB Snap provides an inexpensive firmware-update path for fielded units. Compared with a standard MCU requiring software-driven sequencing, the PTG reduces interrupt load measurably and eliminates software-timing jitter in mixed ADC/PWM workflows.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP506-H/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP506-I/PT | DSPIC33EP512GP504T-E/PT | DSPIC33EP512GM306T-I/PT | DSPIC33EP512MC506T-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Memory | 512 KB Flash | 512 KB Flash | 512 KB Flash (GP504 family) | 512 KB Flash | 512 KB Flash |
| Temperature Grade | -H (extended) | -I (industrial) | -E (extended) | -I (industrial) | -I (industrial) |
| Peripheral Family | GP (op amps, comparators, HS PWM, PTG) | GP - identical peripheral set | GP - identical peripheral set | GM - motor-control PWM emphasis | MC - motor control family |
Key Differentiators
- Extended -H temperature grade in the GP family (vs DSPIC33EP512GP506-I/PT)
- On-chip op amps and comparators in a 70 MIPS DSC (vs DSPIC33EP512GM306T-I/PT)
- 512 KB Flash code headroom (vs DSPIC33EP512GP504T-E/PT)
Design Notes
The -H/-I/-E suffix encodes the temperature grade, not a different die. Qualifying DSPIC33EP512GP506-I/PT in a design validated at -H limits may fail at high ambient; conversely the -I variant is usually cheaper and more widely stocked. When allocating alternates in your AVL, group all grades of the same base MPN and re-verify the derating tables in the family datasheet for the selected grade before release. Also confirm the /PT code implies tray packaging - tape-and-reel variants (T-suffix) need different reel quantities for pick-and-place lines.
The device operates from a single 3.3V supply; decouple each VDD pin pair with 100 nF ceramic capacitors placed within 2 mm of the pins, plus one bulk 10 uF capacitor near the package. VDDCORE/VDD regulator circuits per the dsPIC33E family datasheet require the specified external capacitor on the regulator output - omitting it is the most common cause of erratic startup on this family. Sequence power so VDD ramps monotonically; hold MCLR low through an RC (typ. 10 kΩ / 0.1 uF) or supervisor until the supply is stable to guarantee a clean reset.
Use the standard 64-TQFP (10x10 mm, 0.5 mm pitch) land pattern from the SnapEDA footprint for DSPIC33EP512GP506-H/PT. Route the PGD/PGC ICSP pair on accessible test points or a 5-pin header to retain in-field programming with MPLAB Snap. Keep the high-speed PWM outputs as short, matched groups to gate drivers, and isolate the analog ground under the op-amp/ADC pins with a solid return plane. The CAN TX/RX pair should route to the transceiver with a stub under 30 mm for signal integrity at 1 Mbps.
Compliance Information
RoHS compliant per Radwell product record ('ROHS COMPLIANT: YES'). Automotive/AEC-Q100 classification per Hotenda listing for this MPN. REACH, halogen-free and conflict-minerals declarations should be confirmed via Microchip compliance documentation.
