Microchip Technology

DSPIC33EP512GM310T-I/PF - 70 MIPS DSC, 512KB Flash | Microchip

MPN: DSPIC33EP512GM310T-I/PF ✓ Active
In Stock Ships in 1-3 business days
3 V to 3.6 V Vdss 100-TQFP (14x14 mm) Package 70 MIPS Speed 512KB (170K x 24) Flash Memory
From $15.95 USD / Unit
MOQ: 1 |
Price updated: 2026-09-24
Volume Pricing
Qty Unit Price Extended
1 $23.21 $23.21
10 $20.95 $209.50
100 $18.65 $1,865.00
500 $17.2 $8,600.00
1,000 $15.95 $15,950.00
ℹ️ All prices are in USD

DSPIC33EP512GM310T-I/PF Overview

The Microchip Technology DSPIC33EP512GM310T-I/PF is a 16-bit digital signal controller (DSC) delivering up to 70 MIPS performance with 512KB (170K x 24) of Flash program memory and 48KB of RAM, housed in a 100-pin TQFP (14x14 mm) package rated for industrial temperatures of -40C to +85C.

A digital signal controller combines the compute architecture of a microcontroller with the mathematical acceleration of a DSP. Within the power management hierarchy, the DSC sits above a general-purpose MCU for control-loop applications such as digital power conversion, motor control, and precision sensing, where a classic MCU lacks multiply-accumulate throughput but a standalone DSP lacks integrated peripherals. The dsPIC33E family from Microchip occupies this intersection, integrating a DSP engine with rich analog and timing peripherals on a single die.

Key features of this device include 12 MCPWM (motor control PWM) channels, 8 input capture and 8 output compare channels, 2 quadrature encoder interfaces (QEI), and 4 integrated operational amplifiers for direct sensor signal conditioning. The Charge Time Measurement Unit (CTMU) enables capacitive touch and precise time measurement, while the Peripheral Trigger Generator (PTG) automates peripheral sequencing to offload the CPU.

Architecturally, the dsPIC33E core provides DSP instructions, a 17-bit by 17-bit single-cycle hardware multiplier, a barrel shifter, and four DMA channels that move data between peripherals and RAM without CPU intervention. The 3.0V to 3.6V supply range suits standard 3.3V systems, and 85 general-purpose I/O pins support dense board designs in the 14x14 mm TQFP footprint.

Typical applications include precision brushless DC and PMSM motor control (leveraging the MCPWM and QEI blocks), digital power supplies and solar inverters, and sensor fusion systems that use the on-chip op-amps and CTMU for direct analog front-end duties.

For design, budget the 3.3V rail decoupling with at least one 0.1uF capacitor per VDD pin pair placed close to the package, and plan the oscillator circuit early since 70 MIPS operation requires a 7.3728 MHz crystal with 15x PLL or an internal fast RC option with lower accuracy.

This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.

Drop-in alternatives for DSPIC33EP512GM310T-I/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33EP512GM310T-I/PF (same form factor and footprint) — differing in Package, Core, Operating Temperature, RAM Size, Packaging.

Microchip Technology
Package: 100-pin TQFP
Core: dsPIC33E 16-bit DSC
Operating Temperature: -40C to +125C (I grade)
Microchip Technology
Package: 100-TQFP (14 x 14 mm), 0.5 mm pitch
Core: dsPIC 33EP 16-bit
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Package: 100-TQFP (14x14 mm), 0.5 mm pitch
Core: dsPIC33E 16-bit DSC core
Operating Temperature: -40C to +125C (extended, E grade)
Microchip Technology
Package: 64-VQFN (9x9)
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Package: 100-pin TQFP (14x14 mm), 0.5 mm pitch
Core: dsPIC33E 16-bit DSC core with DSP engine
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Package: 100-pin TQFP (12x12 mm)
Operating Temperature: -40 C to +85 C
Microchip Technology
Package: 100-TQFP (14x14x1 mm)
Core: dsPIC33E (16-bit DSC)
Operating Temperature: -40C to +85C (I grade)
Microchip Technology
Package: 64-TQFP (10x10 mm)
Core: dsPIC33E 16-bit DSC
RAM Size: 48 KB
Microchip Technology
Package: 100-TQFP (12 x 12 mm)
Operating Temperature: -40C to +85C (I grade)
RAM Size: 52 KB

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC33EP512GM310-I/PF

✅ Drop-In
📦 100-TQFP (14x14)
identical die and footprint, tray packaging instead of tape and reel

📋 Reference alternative (not in catalog)

DSPIC33EP512GM310-E/PF

✅ Drop-In
Microchip Technology
📦 100-TQFP (14x14)
dsPIC33E 16-bit DSC core · 60 MIPS · 512 KB (170K x 24) Flash · 16 KB · 3.3 V · 85 · I2C, SPI, UART/USART, IrDA · ADC, integrated op-amps

✓ In Stock

$5.25 / Unit

View Datasheet →

DSPIC33EP256GM310T-I/PF

✅ Drop-In
Microchip Technology
📦 100-TQFP (14x14)
dsPIC33E 16-bit DSC · Up to 70 MIPS · 256 KB · 16 KB (32KB reported for -E variant per Microchip USA) · 3.3 V · 85.5K x 24 · 12 · 8 / 8

✓ In Stock

$4.9 / Unit

View Datasheet →

DSPIC33EP256GM710T-I/PF

✅ Drop-In
Microchip Technology
📦 100-TQFP (14x14)
dsPIC 33EP 16-bit · 70 MIPS · 256KB (85.5K x 24) Flash · 16KB · 3.3 V · 12 (MCPWM) · 8 / 8 · 2 (QEI)

✓ In Stock

$5.4 / Unit

View Datasheet →

DSPIC33EP512GM710T-I/PF

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 100-TQFP (14x14)
dsPIC33E (16-bit DSC) · 70 MIPS · 512 KB (170K x 24) Flash · 48 KB · 3 V to 3.6 V (3.3 V typical) · 100-TQFP (14x14x1 mm) · Surface Mount · 12

✓ In Stock

$6.8 / Unit

View Datasheet →

DSPIC33EP512GM604T-I/PT

✅ Drop-In ⚠️ Specs Unverified
📦 TQFP
same memory tier and peripherals, reduced pin count within TQFP family - verify footprint fit for designs not using all 85 I/O

📋 Reference alternative (not in catalog)

DSPIC33EP512GM310T-I/PF Maximum Ratings & Electrical Characteristics

Core dsPIC33E, 16-bit
Maximum CPU Speed 70 MIPS
Program Memory Size 512KB (170K x 24) Flash
RAM Size 48KB (48K x 8)
Supply Voltage Range 3 V to 3.6 V
General Purpose I/O 85 I/O
Motor Control PWM Channels 12 MCPWM
Input Capture / Output Compare 8 / 8 IC/OC
Quadrature Encoder Interfaces 2 QEI
Integrated Op-Amps 4
Charge Time Measurement Unit Yes (CTMU)
Peripheral Trigger Generator Yes (PTG)
DMA Channels 4
Operating Temperature -40C to +85C (Industrial)
Package 100-TQFP (14x14 mm)
Mounting Type Surface Mount
Packaging Tape & Reel (T)
RoHS Status Compliant

DSPIC33EP512GM310T-I/PF 100-tqfp (14x14 mm) Pin Configuration Guide

Pin configuration for DSPIC33EP512GM310T-I/PF (100-tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

100-tqfp (14x14 mm) package pinout diagram for DSPIC33EP512GM310T-I/PF

No detailed pinout data available for DSPIC33EP512GM310T-I/PF.

Refer to the datasheet for full pin configuration.

Typical Applications

DSPIC33EP512GM310T-I/PF is suitable for 6 applications: BLDC/PMSM Motor Control, Digital Power Conversion, Sensor Signal Conditioning and Data Acquisition, Industrial Automation and Robotics, Automotive-Adjacent Embedded Control, Portable Test and Measurement Instruments.

🏭

BLDC/PMSM Motor Control

The DSPIC33EP512GM310T-I/PF is purpose-built for precision motor control: its 12 MCPWM channels generate complementary PWM pairs with hardware dead-time insertion, its 2 QEI modules decode quadrature encoder feedback, and its 4 on-chip op-amps amplify shunt-resistor current signals without external amplifiers. The 70 MIPS core executes field-oriented control (FOC) loops at switching frequencies of 20 kHz or more with ample cycle budget. Firmware uses the DMA channels to stream ADC results from current-sense conversions into RAM, keeping the ISR footprint small. Because PWM, ADC, and encoder peripherals are tightly coupled on-chip, control-loop latency is deterministic - a key benefit over MCU-plus-DSP two-chip solutions.

⚡

Digital Power Conversion

In digital power supplies, solar inverters, and PFC stages, the 70 MIPS dsPIC33E core closes voltage and current loops with sub-switching-period latency. The MCPWM modules support complementary and push-pull modes with programmable dead time, while high-speed ADCs sample feedback through the internal op-amps for average-current-mode control. The Peripheral Trigger Generator (PTG) sequences ADC triggers from PWM events in hardware, eliminating software jitter that degrades THD in inverter outputs. With 512KB of Flash, the controller retains multi-mode firmware - soft start, fault handling, and communication protocols - with room for field updates. Deterministic interrupt latency and 3.0-3.6V operation on standard digital rails simplify integration into existing power-stage boards.

🧩

Sensor Signal Conditioning and Data Acquisition

The four integrated operational amplifiers let the DSPIC33EP512GM310T-I/PF condition bridge, shunt, and microphone-level signals directly on-chip, cutting BOM cost and board area. The Charge Time Measurement Unit (CTMU) measures capacitance with sub-picofarad resolution for capacitive touch, humidity, and level-sensing interfaces. The 8 input-capture channels timestamp external events for time-of-flight and flow measurement, and the DSP engine applies FIR/IIR filtering in real time using single-cycle MAC instructions. With 512KB of Flash, calibration tables, compensation curves, and multi-protocol communication stacks coexist with the acquisition firmware. The 85 I/O pins support dense multi-sensor boards in the compact 14x14 mm TQFP footprint.

🏭

Industrial Automation and Robotics

For industrial controllers, the DSC combines real-time control with system management: dual QEI modules track two encoder axes simultaneously, the 12 MCPWM channels drive multi-axis servo or stepper outputs, and the 4 DMA channels stream UART/SPI traffic without CPU load. The 70 MIPS DSP core handles trajectory interpolation and motion profiles, while 512KB Flash stores multi-recipe firmware and parameter tables. The remappable Peripheral Pin Select system lets the same PCB serve multiple product variants by reassigning UART, SPI, and capture pins in firmware, reducing PCB SKU count. Industrial -40C to +85C rating and 3.3V noise margins support factory-floor environments, and CAN/SPI expansion links the controller to PLC backbones and HMI panels.

🚗

Automotive-Adjacent Embedded Control

While the I-grade device is not AEC-Q100 qualified, the dsPIC33EP platform with CTMU touch sensing and robust MCPWM outputs fits off-road equipment, accessory modules, and motorsport telemetry where industrial grade suffices. The CTMU provides capacitive touch buttons sealed behind plastic panels - resistant to dirt and moisture in vehicle cabins. The 2 QEI modules read throttle and position sensors, the DSP core runs filters for noisy analog channels, and 512KB Flash supports OTA-style field updates via CAN or UART bootloaders. Designers needing full automotive qualification should move to the Microchip automotive-qualified variants of the family, keeping firmware largely portable since peripherals and the core architecture remain identical across temperature grades.

🔧

Portable Test and Measurement Instruments

Handheld meters, dataloggers, and bench instruments benefit from the DSC's blend of analog integration and math throughput. The on-chip op-amps buffer high-impedance inputs ahead of the ADC, the CTMU performs precision timing and capacitance measurement, and DSP instructions compute RMS, FFT, and statistical processing on captured waveforms at 70 MIPS. Four DMA channels move samples to 48KB of RAM for block processing without CPU stalls, and 512KB Flash stores calibration constants, multi-language UI assets, and communication firmware (USB-serial, SPI, UART). The 3.0-3.6V supply and surface-mount 14x14 mm TQFP suit compact, battery-operated enclosures, while the industrial temperature rating keeps handheld instruments accurate across job-site conditions.

Recommended Products Summary

MCP2515 CAN interface for motor-network communication Used in: BLDC/PMSM Motor Control MCP3208 Auxiliary ADC for extended sensing channels Used in: BLDC/PMSM Motor Control MCP1630 High-speed PWM/peak-current controller companion Used in: Digital Power Conversion MCP79410 RTCC for energy logging and event timestamps Used in: Digital Power Conversion MCP3421 18-bit delta-sigma ADC for precision slow channels Used in: Sensor Signal Conditioning and Data Acquisition MCP9808 Digital temperature sensor for cold-junction compensation Used in: Sensor Signal Conditioning and Data Acquisition MCP2562 CAN transceiver for industrial fieldbus Used in: Industrial Automation and Robotics MCP23S17 SPI GPIO expander for additional digital I/O Used in: Industrial Automation and Robotics MCP2551 CAN transceiver for vehicle networks Used in: Automotive-Adjacent Embedded Control MCP9700 Analog temperature sensor for thermal monitoring Used in: Automotive-Adjacent Embedded Control MCP3551 22-bit delta-sigma ADC for high-resolution measurement Used in: Portable Test and Measurement Instruments MCP4921 12-bit DAC for analog reference and stimulus output Used in: Portable Test and Measurement Instruments
What are the key specifications of DSPIC33EP512GM310T-I/PF?
The DSPIC33EP512GM310T-I/PF is a 16-bit dsPIC33E digital signal controller from Microchip Technology running at up to 70 MIPS. It offers 512KB (170K x 24) Flash program memory, 48KB RAM, 12 motor-control PWM channels, 8 input captures and 8 output compares, 2 quadrature encoder interfaces, 4 integrated op-amps, a CTMU, PTG, and 4 DMA channels in a 100-pin TQFP (14x14 mm) package operating from 3V to 3.6V at -40C to +85C. According to Microchip product data, this member targets precision motor control and digital power designs.
What is the price of DSPIC33EP512GM310T-I/PF?
The DSPIC33EP512GM310T-I/PF lists at approximately $23.21 for quantity 1 as of 2026-09-25, based on Microchip USA authorized-distributor data. Pricing typically steps down at volume breaks, reaching roughly $16-$18 per unit at 500-1000 pieces from authorized channels. For current real-time pricing, compare quotes on XAIPART, DigiKey, Mouser, and Octopart, since lead time and allocation can shift unit costs. Tape-and-reel (T suffix) versions may carry slightly different pricing than tray-packed units.
Where to buy DSPIC33EP512GM310T-I/PF online?
You can buy the DSPIC33EP512GM310T-I/PF from XAIPART as well as authorized distributors including DigiKey (product page 6131151), Mouser, Newark, and Microchip USA, which reported 3091 units in stock at approximately $23.21 as of 2026-09-25. For production volumes, request quotes through trustedparts.com, which aggregates authorized-distributor inventory only and avoids broker-sourced counterfeit risk. Always verify that the suffix matches: T = tape and reel, I = industrial temperature, PF = 100-pin TQFP.
What is the difference between DSPIC33EP512GM310T-I/PF and DSPIC33EP256GM310T-I/PF?
The primary difference is program memory: the GM310 part has 512KB (170K x 24) of Flash while the GM256 variant provides 256KB. Both share the same 70 MIPS dsPIC33E core, identical peripheral sets (12 MCPWM, 4 op-amps, 2 QEI, CTMU, PTG), and the same 100-pin TQFP (PF) footprint, making the 256KB version a pin-compatible drop-in when firmware fits within 256KB. RAM also differs across family members, so verify your linker map before swapping. According to Microchip family documentation, peripherals are consistent across the GM310/GM306 memory tiers.
What is the best drop-in replacement for DSPIC33EP512GM310T-I/PF?
The best drop-in replacement is the non-tape dsPIC33EP512GM310-I/PF, which is the identical die in the same 100-TQFP (PF) package with only the packaging format differing. For extended-temperature environments, the DSPIC33EP512GM310-E/PF is pin-to-pin compatible and rated to +125C. If your firmware fits in 256KB, the DSPIC33EP256GM310T-I/PF is also footprint-identical. All are Microchip same-family parts, so toolchain (MPLAB X) and programming setup remain unchanged, minimizing redesign risk to zero at the board level.
Can DSPIC33EP256GM710T-I/PF replace DSPIC33EP512GM310T-I/PF?
Yes, in most cases. The DSPIC33EP256GM710T-I/PF uses the same 100-pin TQFP footprint and dsPIC33E core, so it drops onto the same PCB. However, it has 256KB of Flash instead of 512KB and a different RAM configuration (the GM710 tier provides more RAM than GM310). Verify that your application fits the smaller program memory and that any peripheral-count differences in your specific variant usage are acceptable. It is best treated as a code-fit-dependent drop-in rather than a guaranteed one-to-one swap.
Is DSPIC33EP512GM310T-I/PF suitable for BLDC motor control?
Yes, this device is specifically optimized for motor control. It provides 12 MCPWM channels with complementary outputs and dead-time control, 2 quadrature encoder interfaces for rotor position feedback, and 4 on-chip operational amplifiers that can condition shunt-resistor current signals without external op-amps. The 70 MIPS core executes field-oriented control (FOC) loops well within budget, and the 4 DMA channels offload ADC result transfers. According to Microchip, the dsPIC33E family is designed explicitly for high-performance, precision motor control systems such as BLDC and PMSM drives.
Is DSPIC33EP512GM310T-I/PF the same as DSPIC33EP512GM310-I/PF?
Functionally yes; they differ only in packaging format. The 'T' in DSPIC33EP512GM310T-I/PF denotes tape-and-reel delivery for automated assembly, while the non-T part ships in trays. Both are the same 16-bit 70 MIPS die with 512KB Flash, 48KB RAM, and identical peripheral sets in the 100-TQFP (PF) industrial package. Firmware, programmer settings, and PCB footprint are fully interchangeable. Choose the T version when placing high-volume reel orders and the tray version for prototypes or low-volume hand placement.
What is the best cross-brand equivalent for DSPIC33EP512GM310T-I/PF?
There is no verified cross-brand pin-to-pin equivalent in the searched web data for this part; competing 16-bit DSP/DSC devices from other vendors use different pinouts and require board redesign. Microchip's own dsPIC33E family members are the only verified drop-in options. If you must migrate to a cross-brand architecture, treat it as a redesign project: map the 12 MCPWM channels, 4 op-amps, 2 QEI modules, and CTMU against the target vendor's peripherals, and re-verify the 100-pin TQFP land pattern. Pin-compatible cross-brand swaps for this class of DSC do not exist in practice.
When should I choose DSPIC33EP512GM310T-I/PF over the GM306 variant?
Choose the GM310 when your firmware and data tables exceed the smaller program memory of the GM306 tier, or when you want headroom for future feature additions such as field-upgradable firmware images. Both are 70 MIPS dsPIC33E devices with equivalent peripherals; the GM310 provides 512KB of Flash. If your compiled application fits comfortably under the GM306's program memory with at least 30% margin, the smaller variant saves cost. Note the GM306 uses a different package (PT), so it is not footprint-compatible with this PF part - verify package requirements first.
Where can I download the DSPIC33EP512GM310T-I/PF datasheet PDF?
The manufacturer datasheet for the dsPIC33EP512GM310 family is available from the Microchip product page at microchip.com/en-us/product/dsPIC33EP512GM310, which links the current PDF revision along with family reference manuals. Distributors such as DigiKey, Mouser, Newark, and onlinecomponents.com also host datasheet downloads linked to this MPN. For design-critical parameters like peripheral register maps and electrical characteristics, always work from the Microchip-hosted revision and cross-check the family reference manual sections, since the dsPIC33EP series shares documentation across many memory and package variants.
Where can I find the pinout of the DSPIC33EP512GM310T-I/PF?
The complete 100-pin pinout for the TQFP (PF) package is documented in the dsPIC33EP512GM310 datasheet available on the Microchip product page. The pin map includes 85 general-purpose I/O pins, multiple VDD/VSS pairs distributed around the 14x14 mm package for power integrity, dedicated oscillator pins (OSC1/OSC2), and remappable peripheral pins configured via the PPS (Peripheral Pin Select) system, which lets you route UART, SPI, and other digital functions to many physical pins in firmware rather than being fixed in silicon.
What supply voltage does the DSPIC33EP512GM310T-I/PF require?
The DSPIC33EP512GM310T-I/PF operates from a 3.0V to 3.6V single supply, targeting standard 3.3V rails. According to distributor-listed specifications, this range must be maintained across all VDD pins, and VDDCORE requires its own regulated domain per the datasheet's power architecture. For battery or wide-input systems, precede the DSC with a 3.3V LDO or buck converter. The industrial temperature grade (I suffix) guarantees electrical parameters from -40C to +85C, so derate nothing within that envelope at nominal 3.3V operation.
Is DSPIC33EP512GM310T-I/PF RoHS compliant and lead-free?
Yes, distributor listings for the DSPIC33EP512GM310T-I/PF, including DigiKey and PCB Electronics product data, mark the part as RoHS compliant. The TQFP package is a lead-free surface-mount construction suitable for standard reflow profiles. For REACH, halogen-free, and conflict-minerals declarations, request the official Microchip compliance certificate or check the product page's environmental documents, since distributor snippets do not state those statuses explicitly. The industrial (I) temperature grade does not affect environmental compliance classifications.
What is the lead time for DSPIC33EP512GM310T-I/PF?
Lead time varies by channel: distributors reporting stock, such as Microchip USA with 3091 units listed as of 2026-09-25, can ship same-day or next-day. DigiKey also lists the part with ships-today availability for stocked quantities. For factory direct orders or large reel quantities beyond distributor stock, Microchip standard lead times typically run several weeks to months depending on demand cycles. Confirm current stock and lead time on the XAIPART product page or directly with authorized distributors before committing to a production schedule.
Should I choose DSPIC33EP512GM310T-I/PF or DSPIC33EP512GM310T-E/PT for my design?
Choose the T-I/PF for standard industrial applications from -40C to +85C in the 100-pin TQFP (PF) package. Choose the E-temperature variant only if your ambient environment exceeds +85C, such as under-hood, industrial oven-adjacent, or high-power-inverter enclosures - note the E variant's package suffix differs (PT vs PF), so confirm pin count compatibility with your PCB before substituting. The PF 100-pin package gives you 85 I/O and the full peripheral set; if your design needs fewer pins, smaller GM3xx members reduce cost. Temperature grade, not performance, should drive the choice.

Engineering reference data for DSPIC33EP512GM310T-I/PF — comparison, design guidance, and compliance information.

Selection Guide

Choose the DSPIC33EP512GM310T-I/PF when your motor control, digital power, or instrumentation firmware needs 512KB of Flash with headroom for field updates, and you need the full 85 I/O count and 12 MCPWM channels in a 100-TQFP. If your compiled application fits in 256KB with margin, the DSPIC33EP256GM310T-I/PF offers the same footprint and peripherals at lower cost - a pure firmware-size decision. Select the DSPIC33EP512GM310-E/PF for ambients above +85C; it is pin-identical. Move to GM710-tier parts (DSPIC33EP256GM710T-I/PF or DSPIC33EP512GM710T-I/PF) when your design needs more RAM in the same footprint. For prototypes and hand assembly, the tray-packed DSPIC33EP512GM310-I/PF is the identical die without reel minimums. All options share the MPLAB X toolchain and dsPIC33E peripherals, so switching cost is firmware-linking effort only - no board redesign. There is no verified cross-brand pin-compatible alternative; cross-architecture migration requires full redesign.

Comparison with Alternatives

Parameter This Product DSPIC33EP512GM310-I/PF DSPIC33EP256GM310T-I/PF DSPIC33EP256GM710T-I/PF DSPIC33EP512GM710T-I/PF
Package 100-TQFP (14x14 mm) 100-TQFP (14x14 mm) - same 100-TQFP (14x14 mm) - same 100-TQFP (14x14 mm) - same 100-TQFP (14x14 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory (Flash) 512KB (170K x 24) 512KB 256KB 256KB 512KB
RAM 48KB (48K x 8) 48KB 48KB Higher RAM tier per GM710 family data Higher RAM tier per GM710 family data
CPU Speed 70 MIPS 70 MIPS 70 MIPS 70 MIPS 70 MIPS
Operating Temperature -40C to +85C (I) -40C to +85C -40C to +85C -40C to +85C -40C to +85C
MCPWM Channels 12 12 12 12 12
Supply Voltage 3.0 V to 3.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V
Packaging Format Tape & Reel (T) Tray Tape & Reel Tape & Reel Tape & Reel

Key Differentiators

  • Maximum program memory in the GM310 tier (vs DSPIC33EP256GM310T-I/PF)
  • Cost-efficient footprint-compatible option (vs DSPIC33EP256GM310T-I/PF)
  • Extended-temperature pin-compatible sibling exists (vs DSPIC33EP512GM310-E/PF)
  • Higher RAM tier within same footprint (vs DSPIC33EP512GM710T-I/PF)

Design Notes

Place a 0.1uF ceramic decoupling capacitor at every VDD/VSS pin pair, as close to the package as possible, plus bulk 10uF near the supply entry. The dsPIC33E core requires the VDDCORE rail to be decoupled per the datasheet power architecture - follow the recommended capacitor value and ESR range exactly, as an incorrectly decoupled core rail is the most common cause of erratic reset behavior on this family. Keep the 14x14 mm TQFP's thermal pad region (if used on your variant) connected to a ground pour with multiple vias.

Use the Peripheral Pin Select (PPS) feature to route high-speed digital peripherals away from analog pins during layout rather than after; reassigning UART/SPI pins in firmware lets you physically separate switching noise from the op-amp and ADC inputs. Route the MCPWM outputs to the gate drivers with series resistors to control edge rates, and keep current-sense feedback traces differential and short to the on-chip op-amp input pins to preserve signal integrity in motor drive environments.

Do not assume the tape-and-reel (T) and tray versions differ electrically - they do not - but do confirm the temperature suffix: E extends to +125C while I stops at +85C. When substituting within the family, always re-run the MPLAB linker map: program memory shrinks from 512KB on the GM310 tier to 256KB on the GM256 tier, and RAM allocation changes across GM3xx/GM6xx/GM7xx variants. Finally, the flash write-erase endurance specification in the datasheet must be respected for any in-field parameter logging design.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliant per DigiKey and PCB Electronics distributor listings. The I-grade device is not AEC-Q100 qualified; for automotive-qualified operation use Microchip automotive variants of the dsPIC33E family. REACH, halogen-free, and conflict-minerals declarations should be confirmed via Microchip official environmental documentation.

Data verified on: 2026-09-25 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology DSPIC33EP512GM310T-I/PF dsPIC33E digital signal controller DSC digital signal processor DSP 16-bit microcontroller 100-TQFP TQFP family surface mount MPLAB X MCPWM QEI CTMU PTG DMA RoHS field-oriented control motor control digital power conversion Peripheral Pin Select DSPIC33EP256GM310T-I/PF DSPIC33EP512GM310-E/PF
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