DSPIC33EP64GP503-I/M5 - 16-bit 70 MIPS DSC | Microchip
MPN: DSPIC33EP64GP503-I/M5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.12 | $5.12 |
| 10 | $4.61 | $46.10 |
| 100 | $4.1 | $410.00 |
| 500 | $3.69 | $1,845.00 |
| 1,000 | $3.32 | $3,320.00 |
DSPIC33EP64GP503-I/M5 Overview
A digital signal controller is a hybrid device that merges the deterministic control of a microcontroller with the mathematical throughput of a DSP. Within the power-management hierarchy, the dsPIC33EP family sits above simple MCUs (such as the PIC16) and below application processors, making it a voltage-regulator-and-control-loop workhorse in the semiconductor product taxonomy for real-time embedded control.
Key differentiating features include three on-chip operational amplifiers, four comparators, a Charge Time Measurement Unit (CTMU), CAN 2.0B communication, a Peripheral Trigger Generator (PTG), and high-speed PWM outputs. The integrated op amps and advanced analog peripherals allow sensor signal conditioning to be performed on-chip, reducing external component count and BOM cost.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP instructions, a barrel shifter, four DMA channels, and five timers, achieving excellent code density and deterministic interrupt latency at 70 MIPS. The industrial-grade I-temp variant operates from -40C to +85C on a single 3.0V to 3.6V supply.
Typical applications include digital power supplies, motor control (PMSM, BLDC), battery management systems, and industrial sensor interfaces, where the high-speed PWM, CAN bus, and on-chip analog align directly with the control-loop requirements.
A key design consideration: the 3.6V absolute supply ceiling means the I/O is not 5V tolerant, so level shifting is required when interfacing to legacy 5V systems.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64GP503-I/M5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GP503-I/M5 (same form factor and footprint) — differing in Package, Operating Temperature, RAM, Comparators, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GP503-E/M5
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EP64GP503-H/M5
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP64GP503-I/TL
✅ Drop-In✓ In Stock
$3.51 / Unit
View Datasheet →DSPIC33EP32GP503-I/M5
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.27 / Unit
View Datasheet →DSPIC33EP128GP503-I/M5
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP503-I/M5 Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E, 16-bit |
| Max CPU Speed | 70 MIPS (60 MHz) |
| Program Memory | 64KB (22K x 24) Flash |
| RAM | 8KB (8192 bytes) |
| Supply Voltage | 3 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 36-VTLA (UQFN, 5x5 mm) with exposed pad |
| CAN | Yes (CAN 2.0B) |
| On-chip Op Amps | 3 |
| Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator | Yes (PTG) |
| High-Speed PWM | Yes |
| DMA Channels | 4 |
| Timers | 5 |
| Mounting Type | Surface Mount |
| Technology | CMOS |
| RoHS Status | Compliant |
DSPIC33EP64GP503-I/M5 36-vtla (uqfn, 5x5 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64GP503-I/M5 (36-vtla (uqfn, 5x5 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GP503-I/M5.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GP503-I/M5 is suitable for 6 applications: Digital Power Supplies, BLDC and PMSM Motor Control, Battery Management Systems, Industrial Sensor Interfaces, Embedded Control and IoT Nodes, UPS and Power Conversion Systems.
Digital Power Supplies
The DSPIC33EP64GP503-I/M5 fits digitally controlled AC/DC and DC/DC converters because its high-speed PWM block generates phase-shifted or complementary switching waveforms while the 70 MIPS DSP core executes voltage- and current-loop compensation in real time. The three on-chip op amps can amplify shunt or current-transformer feedback without external amplifiers, and the four comparators provide hardware cycle-by-cycle overcurrent protection with latency far below any software trip. Used between the feedback divider and the power stage gate drivers, the device closes control loops at tens to hundreds of kilohertz. The trade-off versus a dedicated digital power controller is more firmware effort, offset by full flexibility of topology and protection schemes in one 3.0V to 3.6V, 36-pin 5x5 mm device.
Recommended
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EP64GP503-I/M5 provides field-oriented control (FOC) capability on its 70 MIPS DSP-enhanced core with single-cycle MAC instructions, while high-speed PWM outputs drive a three-phase inverter with programmable dead time. The four on-chip comparators implement hardware overcurrent trips independent of the CPU, and the three integrated op amps condition low-side shunt currents for the control loop. The CAN 2.0B interface links the drive to a higher-level controller in industrial and automotive-adjacent systems. Relative to a general MCU plus external analog front end, this device reduces BOM count and board area; the key consideration is the 3.6V supply ceiling, requiring gate drivers with compatible logic thresholds.
Recommended
Battery Management Systems
In battery pack management, the DSPIC33EP64GP503-I/M5 monitors cell voltages, executes state-of-charge and state-of-health algorithms, and manages charge/discharge FETs via PWM. Its CTMU (Charge Time Measurement Unit) supports precise time-domain measurements useful for impedance and capacitance sensing, while the 12-bit-capable ADC inputs, four comparators, and three op amps handle per-cell voltage conditioning and overcurrent detection. The CAN interface provides the standard BMS-to-vehicle or BMS-to-inverter communication link with hardware filtering offloading the CPU. Operating from 3.0V to 3.6V matches single-cell lithium logic rails, and the -40C to +85C I-grade covers typical battery environments; the E-grade variant extends to +125C for under-hood packs.
Recommended
Industrial Sensor Interfaces
The DSPIC33EP64GP503-I/M5 serves as an intelligent sensor node front end: the three on-chip op amps amplify bridge, thermocouple, or CT-coil signals, the CTMU supports capacitive and time-domain sensing, and the 70 MIPS core performs filtering, linearization, and compensation in software. CAN 2.0B connects the node to factory fieldbus segments, while four DMA channels stream ADC results without CPU intervention, preserving headroom for the signal-processing pipeline. Compared with an MCU plus discrete analog chain, integration reduces calibration drift and board size. Design note: at 3.0V to 3.6V supply the ADC full-scale is limited, so scale and protect inputs appropriately for industrial 24V-domain signals using dividers and clamping.
Recommended
Embedded Control and IoT Nodes
As a general-purpose embedded controller, the DSPIC33EP64GP503-I/M5 combines 64KB of self-programmable Flash, 8KB of RAM, and rich connectivity in a compact 5x5 mm UQFN, suiting networked control nodes, lighting controllers, and smart devices. The Peripheral Trigger Generator (PTG) offloads sequenced tasks from the CPU, enabling low-jitter peripheral orchestration for tasks like LED dimming or sensor polling, while five timers and four DMA channels support multi-task real-time behavior. The 36-pin footprint keeps two-layer PCB designs achievable. Relative to 8-bit PIC alternatives, the 16-bit DSP core delivers an order-of-magnitude more arithmetic throughput for FFT-based analytics or control filtering at similar cost and power.
Recommended
UPS and Power Conversion Systems
Uninterruptible power supplies and inverters require simultaneous multi-rate control: fast inner current loops and slower outer voltage/battery-charge loops. The DSPIC33EP64GP503-I/M5 handles this with its 70 MIPS core scheduling nested interrupts, high-speed PWM generating the inverter switching pattern, and the three op amps conditioning AC current and voltage sense signals. Four comparators provide instantaneous hardware fault trips for shoot-through and overload protection, and CAN links the UPS to facility monitoring. Using one DSC instead of an MCU plus dedicated PFC controller reduces component count and firmware surface; the main trade-off is that all protection firmware must be validated thoroughly, since it is software-defined rather than fixed-function silicon.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GP503-I/M5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GP503-E/M5 | DSPIC33EP64GP503-H/M5 | DSPIC33EP64GP503-I/TL | DSPIC33EP32GP503-I/M5 | DSPIC33EP128GP503-I/M5 |
|---|---|---|---|---|---|---|
| Package | 36-VTLA (UQFN, 5x5 mm) | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (UQFN) - same footprint family | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) |
| Flash Memory | 64KB (22K x 24) | 64KB | 64KB | 64KB | 32KB (-50%) | 128KB (+100%) |
| On-chip Op Amps / Comparators | 3 / 4 | 3 / 4 | 3 / 4 | 3 / 4 | 3 / 4 | 3 / 4 |
| CAN | Yes (CAN 2.0B) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Three integrated op amps reduce external analog BOM (vs DSPIC33EP128GP503-I/M5)
- Extended-temperature drop-in available (vs DSPIC33EP64GP503-E/M5)
- 36-pin UQFN density vs 28-pin GP502 sibling (vs DSPIC33EP64GP502-I/SP)
- Honest trade-off: Flash headroom limit (vs DSPIC33EP32GP503-I/M5)
Design Notes
Supply the DSPIC33EP64GP503-I/M5 from a 3.0V to 3.6V rail (3.3V nominal). Estimated: at 70 MIPS with all analog blocks active, core plus I/O current is on the order of 60-80 mA, so a 300 mA LDO such as the MCP1700-class (upgraded for headroom) or a small buck suffices. Decouple VDD with 0.1 uF ceramic at each pin plus 4.7-10 uF bulk. The exposed pad of the 36-VTLA package must be soldered to a grounded copper pour - it is both thermal and electrical (VSS) connection, and omitting it degrades analog performance and reliability.
The dsPIC33EP family is not 5V tolerant on any pin. Interfacing legacy 5V sensors, CAN transceivers, or RS-232 lines directly can damage the device - use level shifters or 3.3V-native peripherals (e.g., MCP2562 CAN transceiver). Also verify peripheral pin mapping in MPLAB X PPS (Peripheral Pin Select): many digital functions are remappable, and an incorrect PPS assignment is the most common bring-up failure. Configure oscillator (FRC vs external crystal) before relying on precise PWM timing; PLL setup requires unlock sequence per family reference manual.
For the 5x5 mm UQFN layout, use a 3x3 via array (or minimum 4 vias) in the exposed pad to ground plane, keeping inductance low for analog returns of the three on-chip op amps. Route PWM outputs away from ADC/op-amp input traces to prevent switching noise coupling into the ADC; the CTMU and op-amp inputs are especially sensitive. Place a guard ground trace around high-impedance analog nodes. Keep CAN differential pair at 100-120 ohm controlled impedance with a common-mode choke near the connector per typical CAN physical-layer design practice.
Estimated: at VDD = 3.3V and approximately 70 mA typical active current, power dissipation is about 0.23W. With the exposed pad properly soldered to a multi-layer ground pour, junction temperature rise stays modest (roughly 20-30C above ambient depending on board copper), comfortably within the -40C to +85C I-grade envelope for most enclosures. For sustained operation near +70C ambient or with heavy I/O sourcing, choose the -E/M5 variant rated to +125C or improve copper area rather than relying on the package alone.
Compliance Information
DigiKey/Mouser listings categorize the part as RoHS compliant in the standard lead-free M5 package. REACH, halogen-free, and conflict-minerals certificate documents were not present in the retrieved data - request formal CoC from Microchip.
