DSPIC33EP64GP503-I/TL - 16-bit 70 MIPS DSC 64KB Flash | Microchip
부품 번호: DSPIC33EP64GP503-I/TL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.87 | $48.70 |
| 100 | $4.35 | $435.00 |
| 500 | $3.92 | $1,960.00 |
| 1,000 | $3.51 | $3,510.00 |
DSPIC33EP64GP503-I/TL 개요
A digital signal controller combines the computational throughput of a DSP engine with the peripheral integration and control peripherals of a microcontroller. Within the semiconductor hierarchy, the dsPIC33EP sits under Microchip's 16-bit MCU/DSC portfolio, which in turn belongs to the broader class of embedded processors. DSCs are widely used wherever deterministic real-time control, fast interrupt response and math acceleration must coexist with rich analog peripherals on a single chip.
Key features include the 70 MIPS dsPIC33E core with DSP instruction extensions, up to 64KB self-programming Flash with ECC-class endurance, hi-speed PWM modules for motor control and power conversion, on-chip operational amplifiers that reduce external BOM count in current-sense loops, and a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement. The CAN 2.0B module makes the device directly suitable for automotive body and industrial fieldbus nodes.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with a 24-bit instruction word, single-cycle MAC and dual operand fetch, supported by the PTG, which can trigger ADC conversions and PWM updates in hardware without CPU intervention. This offloading yields deterministic sampling latencies critical for digital power loops and sensor fusion.
Typical applications include brushless DC and PMSM motor control, digital power supplies and LED drivers, automotive CAN gateways and body modules, industrial sensors, and capacitive touch interfaces.
Design consideration: at 70 MIPS the core draws significant dynamic current, so a solid VDD/VSS decoupling network and careful grounding of the on-chip op-amps are essential to preserve analog accuracy.
This page synthesizes distributor pricing context, drop-in alternatives from the same dsPIC33EP family, and practical design notes not found on a single datasheet page. Pricing shown is as of 2026-09-25.
드롭인 대체품: DSPIC33EP64GP503-I/TL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP64GP503-I/TL (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, RAM, Core, CAN.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP64GP503-E/TL
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.48 / 개
데이터시트 보기 →DSPIC33EP32GP503-I/TL
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EP32MC203T-I/TL
✅ 드롭인✓ 재고 있음
$1.65 / 개
데이터시트 보기 →DSPIC33EP256MC504T-I/TL
✅ 드롭인✓ 재고 있음
$3.32 / 개
데이터시트 보기 →DSPIC33EP64GP503-I/TL 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| RAM | 8 KB |
| 패키지 | 36-VTLA (5x5 mm) |
| Operating Voltage | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +125C (I grade) |
| CAN | CAN 2.0B module |
| On-chip Op-Amps | 3 |
| Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| Hi-Speed PWM | Yes (motor control / digital power) |
| 실장 유형 | Surface Mount |
| 수명 주기 상태 | In Production (per Microchip) |
| Packaging Suffix | /TL (Tape and Reel) |
DSPIC33EP64GP503-I/TL 36-vtla (5x5 mm) 핀 구성 가이드
DSPIC33EP64GP503-I/TL(36-vtla (5x5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP64GP503-I/TL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP64GP503-I/TL 적합 용도: 6 애플리케이션s: BLDC/PMSM Motor Control, Automotive CAN Body Modules, Digital Power Supplies and LED Drivers, Industrial Sensors and Instrumentation, Capacitive Touch Interfaces, Embedded Networking Gateways.
BLDC/PMSM Motor Control
The DSPIC33EP64GP503-I/TL fits motor-control applications through its 70 MIPS DSP core, hi-speed PWM with complementary outputs and dead-time insertion, and three on-chip op-amps that amplify shunt current signals before the ADC - removing external amplifier ICs from the drive board. In a typical sensorless FOC loop, the PTG triggers ADC sampling synchronized to the PWM center, achieving deterministic current sampling without CPU-triggered jitter. The four on-chip comparators support hardware overcurrent protection that trips PWM outputs faster than any software path. Firmware complexity, including Clarke/Park transforms and PI loops, fits comfortably in the 64KB (22K x 24) Flash with margin for communication stacks.
추천
Automotive CAN Body Modules
The integrated CAN 2.0B module with 8-frame buffers makes the DSPIC33EP64GP503-I/TL well suited for body-control nodes, sensor hubs and gateway sub-functions in vehicles. The -40C to +125C I-grade rating covers under-hood-adjacent and interior electronics environments, and the 5x5 mm 36-VTLA package conserves PCB area in compact modules. The CTMU supports capacitive touch interfaces for human-machine controls such as steering-wheel buttons, while comparators provide lamp-load diagnostics. With 64KB Flash, a full CAN stack plus application logic and diagnostic services (UDS-style) fit in a single chip, and its low-power sleep modes suit modules that must meet key-off quiescent current budgets.
추천
Digital Power Supplies and LED Drivers
For digital AC/DC and DC/DC converters and high-power LED drivers, the DSPIC33EP64GP503-I/TL offers the deterministic control granularity that switching converters demand: hi-speed PWM with nanosecond-class resolution adjustments, hardware-triggered ADC sampling aligned to switching instants via the PTG, and fast comparator-based cycle-by-cycle current limiting. The 70 MIPS core executes compensator math (2P2Z or PID) within each switching period even at hundreds of kilohertz. On-chip op-amps condition current-shunt feedback, cutting component count in compact power stages, while the 64KB Flash accommodates multi-mode control firmware including soft-start, burst mode and fault management state machines without external memory.
추천
Industrial Sensors and Instrumentation
Industrial sensing nodes benefit from the DSPIC33EP64GP503-I/TL combination of DSP math capability and integrated analog. The CTMU provides precise time-interval and charge measurement for capacitive and resistive sensing, while the three op-amps and four comparators condition signals from bridges and current sensors on-chip. The 70 MIPS core applies digital filtering (IIR/FIR) and FFT-based diagnostics locally, enabling condition-monitoring endpoints that send processed results over CAN or UART rather than raw data. Operating from 3.0V to 3.6V with sleep currents suited to battery-backed nodes, the device supports retrofit sensor deployments where 5x5 mm board space and 64KB of calibration plus protocol code are sufficient.
추천
Capacitive Touch Interfaces
The CTMU (Charge Time Measurement Unit) on the DSPIC33EP64GP503-I/TL implements robust capacitive touch sensing with hardware-based charge measurement, freeing CPU cycles for debounce, filtering and application logic. In appliances, control panels and white goods, the four on-chip comparators and configurable scan sequencing allow multi-key touch arrays to be sampled deterministically, and the 64KB Flash supports gesture processing and firmware-update bootloaders in the same image. The 5x5 mm 36-VTLA package suits compact glass-over-panel designs. Noise robustness is enhanced by firmware-controlled frequency hopping of the touch scan, an approach documented in Microchip's CTMU touch-sensing application notes.
추천
Embedded Networking Gateways
The DSPIC33EP64GP503-I/TL serves as a protocol-conversion node between CAN fieldbuses and serial links (UART, SPI, I2C) in industrial equipment. The 70 MIPS core runs dual protocol stacks concurrently with headroom for data transformation, while the 64KB Flash holds both stacks plus configuration storage. Multiple UARTs and the PPS (Peripheral Pin Select) system let firmware route communication peripherals to the pins routed on a given PCB, simplifying hardware reuse across product variants. Deterministic interrupt latency and hardware DMA-class data movement via the PTG keep message turnaround times bounded, which matters in synchronized distributed-control systems such as conveyors, pumps and building automation networks.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP64GP503-I/TL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP64GP503-E/TL | DSPIC33EP32GP503-I/TL | DSPIC33EP32MC203T-I/TL | DSPIC33EP256MC504T-I/TL |
|---|---|---|---|---|---|
| Package | 36-VTLA (5x5 mm) | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB (22K x 24) | 64 KB | 32 KB | 32 KB | 256 KB |
| Temperature Grade | -40C to +125C (I) | -40C to +150C class (E, verify datasheet) | -40C to +125C (I) | -40C to +125C (I) | -40C to +125C (I) |
| Family / Peripheral Focus | GP: CAN, op-amps, CTMU, PTG | GP: identical peripheral set | GP: identical peripheral set | MC: motor-control focus | MC: motor-control focus |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production |
주요 차별점
- Three on-chip op-amps reduce external BOM (vs DSPIC33EP32MC203T-I/TL)
- Extended-temperature sibling available in same footprint (vs DSPIC33EP64GP503-E/TL)
- 64KB Flash headroom for stacks and bootloaders (vs DSPIC33EP32GP503-I/TL)
설계 노트
At 70 MIPS the dsPIC33EP core draws significant dynamic current; place 0.1uF ceramic decoupling capacitors at every VDD/VSS pin pair plus one bulk 4.7-10uF capacitor per supply domain. Estimated: dynamic supply current scales roughly linearly with Fcy, so reducing core frequency in idle phases (doze mode) directly reduces rail noise on mixed-signal grounds shared with the on-chip op-amps.
The 36-VTLA (5x5 mm) QFN package requires an exposed thermal/electrical pad; connect it to a solid ground plane with an array of thermal vias (typically 3x3). Because pin functions are assignable via PPS, route UART/SPI/PWM to the pins that minimize crossovers with analog traces - define the PPS mapping to match your PCB, not the reverse.
Verify the RAM budget against the current Microchip data sheet revision before freezing linker scripts, since distributor summaries disagree (8KB vs 4KB) for this MPN. Also, the CTMU and on-chip op-amps share pins with general-purpose I/O; confirm alternate-pin assignments in the datasheet pin diagram before layout sign-off to avoid a respin.
Keep the PWM outputs and gate-driver traces physically separated from the op-amp input traces used for current sensing. The on-chip op-amps have finite PSRR; switching-edge coupling into the current-sense loop causes ADC readings offset by switching noise. Route sense lines as short differential pairs and filter at the ADC input as recommended in Microchip's digital-power reference designs.
규정 준수 정보
In Production per Microchip product page; standard -I/TL production parts are lead-free/RoHS per Microchip policy. Not AEC-Q100 qualified as a standard part - verify with Microchip for automotive qualification options.