DSPIC33EP64GP506T-E/MR - 16-bit 60MIPS DSC 64KB | Microchip
MPN: DSPIC33EP64GP506T-E/MR ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP64GP506T-E/MR Overview
A digital signal controller combines the compute architecture of a microcontroller (MCU) with DSP-class instruction extensions such as multiply-accumulate (MAC) and barrel shifting. Within the power-management hierarchy of embedded systems, a DSC occupies the space between a general-purpose MCU and a dedicated DSP: it executes deterministic control loops (PID, field-oriented control) while handling rich connectivity and analog integration. The dsPIC33E family from Microchip is the third generation of this architecture, targeting real-time control in automotive, industrial, and power-conversion domains.
Key features of this part include the 16-bit dsPIC RISC core running up to 60 MIPS, 4K x 16 of SRAM data memory, integrated CANbus, I2C, SPI, UART/USART, IrDA, and LINbus connectivity, and advanced analog and timing peripherals including the CTMU (Charge Time Measurement Unit) and PTG (Peripheral Trigger Generator). High-speed PWM output makes it suitable for motor control and digitally controlled power supplies.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with separate program and data buses, 24-bit instruction words, and DSP multiply/accumulate hardware. DMA channels offload data movement from the CPU, sustaining deterministic timing in control loops. The E-temperature grade guarantees operation from -40C to +125C, backed by AEC-Q100 and TS 16949-aligned manufacturing.
Typical applications include automotive body and powertrain auxiliary control, BLDC/ACIM motor drives, digital power supplies (AC-DC, DC-DC), and CAN-networked industrial sensors.
Design-wise, ensure the 3.0V to 3.6V supply rail is well decoupled at the exposed thermal pad, and budget CPU bandwidth carefully: at 60 MIPS, tight ISR latency requirements are achievable, but DMA should be used for high-rate ADC streams.
This page adds value beyond the datasheet by synthesizing drop-in replacement options, temperature-grade comparisons, distributor pricing context, and practical design notes in one citable reference.
Drop-in alternatives for DSPIC33EP64GP506T-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GP506T-E/MR (same form factor and footprint) — differing in Operating Temperature, Package, CAN, Core, Packaging.
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Request AlternativesDSPIC33EP64GP506T-E/MR Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33E (16-bit RISC) |
| Core Size | 16-bit |
| Instruction Rate | 60 MIPS |
| Program Memory Size | 64 KB (22K x 24) FLASH |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| Special Peripherals | CTMU, PTG, Hi-Speed PWM, Op Amps |
| DMA Channels | 4 |
| Operating Temperature | -40C to +125C (TA) |
| Qualification | Automotive, AEC-Q100 |
| Package | 64-VQFN (9x9 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Technology | CMOS |
DSPIC33EP64GP506T-E/MR 64-vqfn (9x9 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64GP506T-E/MR (64-vqfn (9x9 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GP506T-E/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GP506T-E/MR is suitable for 6 applications: Automotive Body and Auxiliary Control, BLDC and PMSM Motor Control, Digital Power Conversion (SMPS), CAN-Networked Industrial Sensors, Battery Management and Charging Systems, Embedded Control with Capacitive Touch UI.
Automotive Body and Auxiliary Control
The AEC-Q100 qualification and -40C to +125C E-grade make the DSPIC33EP64GP506T-E/MR directly suitable for automotive body modules such as window lifts, pump drivers, and lighting control. The integrated CANbus interface connects the module to vehicle networks without an external CAN transceiver-controller stack, and LINbus support covers cost-sensitive auxiliary links. The 60 MIPS core with DSP MAC instructions executes deterministic control loops, while the CTMU supports capacitive touch or precise time measurement for diagnostics. Firmware reliability is supported by Microchip's TS 16949-aligned manufacturing flow. For under-hood mounts exceeding +125C, specify the H/MR grade instead; for interior modules, this E/MR grade is the standard choice.
Recommended
BLDC and PMSM Motor Control
Motor drives need deterministic, fast control loops: the DSPIC33EP64GP506T-E/MR's 60 MIPS dsPIC33E core with hardware MAC executes field-oriented control (FOC) at switching frequencies in the 20-50 kHz class, while the high-speed PWM module generates complementary outputs with dead-time control. The Peripheral Trigger Generator (PTG) automates ADC sampling synchronized to the PWM carrier, and 4 DMA channels stream current measurements without CPU overhead. The integrated op amps and CTMU reduce external BOM in sensorless designs. Place the controller between gate-driver ICs and current-shunt amplifiers; expect quantifiable benefit from PWM-ADC hardware synchronization, which eliminates software jitter in the current loop.
Recommended
Digital Power Conversion (SMPS)
Digitally controlled AC-DC and DC-DC supplies benefit from the DSPIC33EP64GP506T-E/MR's combination of high-speed PWM, fast ADC triggering via PTG, and 60 MIPS headroom for voltage-mode or peak-current-mode compensation loops in software. The QFN exposed pad provides a low-impedance ground that helps contain switching-noise coupling on the mixed-signal PCB. The same-family dsPIC33EP64GS506 adds SMPS-specific PWM modes if your topology requires multi-loop phase-shifted control; the GP506 remains the right choice when general I/O and communication (CAN/I2C) coexist with power conversion, as in telecom rectifiers and battery chargers.
Recommended
CAN-Networked Industrial Sensors
In CANopen/DeviceNet-style industrial nodes, the integrated CAN peripheral plus UART, SPI, and I2C on the DSPIC33EP64GP506T-E/MR let one chip handle network traffic, sensor acquisition, and local actuation. The CTMU enables precise RC-time or capacitive measurements for proximity and level sensing, and the 12-bit ADC streams data through DMA at rates that do not burden the 60 MIPS core. The -40C to +125C range suits sensors mounted near motors or heating elements. Use the PTG to build autonomous acquisition sequences that continue running during CAN handling, a concrete mechanism that improves loop determinism in field deployments.
Recommended
Battery Management and Charging Systems
Battery chargers and BMS slave boards require synchronized current/voltage sampling, precise timing, and communication. The DSPIC33EP64GP506T-E/MR provides PTG-driven ADC sampling synchronized to PWM phases for coulomb counting and control loops, CTMU for cell-balancing diagnostics, and CAN for pack-level communication in automotive or telecom batteries. The 3.0-3.6V supply and AEC-Q100 E-grade fit 12-48V systems with isolated bias. A practical design pattern places this DSC as the charge-control engine while a companion controller supervises safety cutoffs; the quantified benefit is a single-chip control-plus-communications solution that shrinks BOM versus discrete MCU-plus-CAN-controller architectures.
Recommended
Embedded Control with Capacitive Touch UI
The Charge Time Measurement Unit (CTMU) on the DSPIC33EP64GP506T-E/MR implements Microchip's capacitive touch sensing, letting a single DSC run both the application control loop and a touch-button or slider user interface. This is valuable in appliances, industrial panels, and automotive interior controls where sealed, no-mechanical-switch front panels are required. The 64-pin QFN offers enough I/O for multi-button arrays plus segment-free indicator drive, while UART/I2C link the UI board to a host controller. Combined with the 60 MIPS core, touch scanning in the PTG leaves substantial CPU budget for the main application, a measurable efficiency gain over polling-based software touch implementations.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GP506T-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GP506T-I/MR | DSPIC33EP64GP506-E/MR | DSPIC33EP64GP506T-H/MR | DSPIC33EP128GP506-E/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) Exposed Pad | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| FLASH Memory | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 128 KB |
| Operating Temperature | -40C to +125C (E-grade) | industrial grade (-40C to +85C class) | -40C to +125C (E-grade) | -40C to +150C (H-grade) | -40C to +125C (E-grade) |
| AEC-Q100 Qualification | Qualified (automotive) | standard grade | Qualified (automotive) | Qualified, plus TS 16949 | Qualified (E-grade) |
| Connectivity | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN | CAN, I2C, SPI, UART, IrDA, LIN |
| Packaging Format | Tape & Reel (T suffix) | Tape & Reel | Tube/Tray (non-T) | Tape & Reel | Tube/Tray (non-T) |
Key Differentiators
- Extended automotive temperature range (vs DSPIC33EP64GP506T-I/MR)
- Highest thermal margin in family (vs DSPIC33EP64GP506T-H/MR)
- Production packaging format (vs DSPIC33EP64GP506-E/MR)
Design Notes
The 64-VQFN (9x9) exposed pad is the primary ground and thermal path. Connect the EPAD to a solid ground plane through a 4x4 (or larger) array of vias directly under the pad; do not float it. Place 0.1uF ceramic decoupling capacitors within 2 mm of every VDD pin pair, plus one bulk 10uF per supply rail. Keep the crystal/r oscillator traces short and guarded by ground. QFN packages also need careful stencil design for the EPAD - typically 60-70% coverage with segmented apertures to avoid voiding during reflow.
Do not interchange temperature grades without checking the worst-case ambient: the E/MR is rated to +125C, the I/MR only to the industrial limit, and the H/MR to +150C. Also verify the RAM budget against the current Microchip datasheet, since distributor listings conflict (4KB vs 8KB) - datasheets.com data is dated 16-FEB-2025. Finally, when porting firmware from other dsPIC33 families, confirm device ID and configuration-word settings for the 60 MHz-class oscillator; PLL misconfiguration is a common bring-up failure on dsPIC33EP parts.
For CAN and motor-control PWM applications, route CANH/CANL as a tightly coupled 120-ohm differential pair and keep PWM outputs away from analog inputs. Use the PTG to hardware-synchronize ADC sampling to the PWM center rather than sampling in ISRs, reducing noise pickup at switching edges. Estimated: at 3.3V and moderate I/O toggling, ground bounce on the exposed-pad QFN is minimized by at least 8-12 return vias under the pad - verify with your stack-up impedance calculator rather than treating this as a datasheet figure.
Compliance Information
AEC-Q100 automotive qualification and TS 16949-aligned manufacturing are explicitly stated in distributor data (datasheets.com, Microchip USA). RoHS/REACH/lead-free status not stated in provided data - verify on Microchip's product page.
