DSPIC33EV256GM002-I/MM - 16-Bit 5V 70MIPS DSC 256KB | Microchip
MPN: DSPIC33EV256GM002-I/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.52 | $4.52 |
| 10 | $4.15 | $41.50 |
| 100 | $3.78 | $378.00 |
| 500 | $3.42 | $1,710.00 |
| 1,000 | $3.1 | $3,100.00 |
DSPIC33EV256GM002-I/MM Overview
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, a DSC sits above a general-purpose MCU for control-loop-intensive tasks such as field-oriented motor control, digital power conversion, and sensor fusion, where multiply-accumulate (MAC) operations and fast interrupt response are essential.
Key features of the DSPIC33EV256GM002 include 5V operation for high-noise robustness, a 16-bit dsPIC DSC core with DSP engine and barrel shifter, CAN 2.0B, LIN and SENT communication interfaces, and Peripheral Pin Select (PPS) that lets designers remap digital peripherals onto available RPn/RPIn pins. The ECC Flash protects program memory against single-bit errors, improving reliability in harsh environments.
Architecturally, the device runs at up to 70 MIPS with a 40 MHz external clock option or internal FRC oscillator, operates from a 4.5V to 5.5V single supply, and supports multiple low-power modes plus in-circuit serial programming (ICSP) via any PGECx/PGEDx pin pair. The -I temperature option covers -40C to +85C; the wider family supports operation up to 150C (E variants).
Typical applications include automotive sensing nodes, appliance motor control (BLDC/PMSM/ACIM), industrial power supplies, CAN/LIN networked actuators, and precision sensor interfaces that benefit from direct 5V connection without level shifting.
Design consideration: use any PGECx/PGEDx pair for ICSP but never mix pairs - ICSPCLK must pair with the ICSPDAT of the same PGEx index - and connect all VDD/VSS pins as specified in the family data sheet.
This page adds value beyond the manufacturer data sheet by synthesizing distributor pricing, drop-in same-package alternatives, design notes, and AEO-optimized FAQs in one reference.
Drop-in alternatives for DSPIC33EV256GM002-I/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV256GM002-I/MM (same form factor and footprint) — differing in Package, Core Architecture, RAM, Packaging, Peripheral Pin Select.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV256GM002-H/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV128GM002-I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EV128GM102T-I/MM
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →DSPIC33EV64GM002-I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.4 / Unit
View Datasheet →DSPIC33EV32GM002-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV256GM002-I/MM Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC DSC (DSP engine) |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 256KB (85.5K x 24), ECC Flash |
| RAM | 16KB |
| Supply Voltage Range | 4.5 V to 5.5 V (5V class) |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 28-QFN-S (6x6 mm), exposed pad |
| Mounting Type | Surface Mount |
| Communication Interfaces | CAN 2.0B, LIN, SENT, UART, SPI, I2C |
| Peripheral Pin Select (PPS) | Yes (remappable RPn/RPIn pins) |
| Clock Source | Internal FRC and external clock, 40 MHz input supported |
| Programming / Debug | ICSP via PGECx/PGEDx pin pairs |
| DSP Features | DSP engine, barrel shifter, MAC instructions |
| Family Temperature Support | Up to 150C available in family (E grade variants) |
| Target Applications | Automotive, appliance, industrial motor control |
DSPIC33EV256GM002-I/MM Pin Configuration
| Pin 1 | MCLR — Master clear reset input (active low), programming voltage pin |
| Pin 2 | AN0/VREF+/CN0/RB0 — Analog input 0 / positive voltage reference / change notification / port B bit 0 |
| Pin 3 | AN1/VREF-/CN1/RB1 — Analog input 1 / negative voltage reference / change notification / port B bit 1 |
| Pin 4 | AN2/SS1/CN2/RB2 — Analog input 2 / SPI slave select / change notification / port B bit 2 |
| Pin 5 | AN3/CN3/RB3 — Analog input 3 / change notification / port B bit 3 |
| Pin 6 | VSS — Ground reference |
| Pin 7 | VDD — Power supply (4.5V to 5.5V) |
| Pin 8 | AN4/C1IN+/CN4/RB4 — Analog input 4 / comparator 1 input / change notification / port B bit 4 |
| Pin 9 | AN5/C1IN-/CN5/RB5 — Analog input 5 / comparator 1 input / change notification / port B bit 5 |
| Pin 10 | OSC1/CLKI/RC12 — Oscillator crystal input / external clock input / port C bit 12 |
| Pin 11 | OSC2/CLKO/RC15 — Oscillator crystal output / clock output / port C bit 15 |
| Pin 12 | VCAP/VDDCORE — CPU core voltage regulator capacitor connection |
| Pin 13 | VSS — Ground reference |
| Pin 14 | VDD — Power supply (4.5V to 5.5V) |
| Pin 15 | AN6/RP0/CN8/RB6 — Analog input 6 / remappable peripheral pin / change notification / port B bit 6 |
| Pin 16 | AN7/RP1/CN9/RB7 — Analog input 7 / remappable peripheral pin / change notification / port B bit 7 |
| Pin 17 | AN8/RP2/CN10/RB8 — Analog input 8 / remappable peripheral pin / change notification / port B bit 8 |
| Pin 18 | AN9/RP3/CN11/RB9 — Analog input 9 / remappable peripheral pin / change notification / port B bit 9 |
| Pin 19 | AN10/RP4/CN12/RB10 — Analog input 10 / remappable peripheral pin / change notification / port B bit 10 |
| Pin 20 | AN11/RP5/CN13/RB11 — Analog input 11 / remappable peripheral pin / change notification / port B bit 11 |
| Pin 21 | VSS — Ground reference |
| Pin 22 | VDD — Power supply (4.5V to 5.5V) |
| Pin 23 | TCK/RP6/CN14/RB12 — Test clock / remappable peripheral pin / change notification / port B bit 12 |
| Pin 24 | TDI/RP7/CN15/RB13 — Test data input / remappable peripheral pin / change notification / port B bit 13 |
| Pin 25 | TDO/RP8/CN16/RB14 — Test data output / remappable peripheral pin / change notification / port B bit 14 |
| Pin 26 | PGED3/RP9/CN17/RB15 — ICSP data channel 3 / remappable peripheral pin / change notification / port B bit 15 |
| Pin 27 | PGEC3/AN12/RP11 — ICSP clock channel 3 / analog input 12 / remappable peripheral pin |
| Pin 28 | AVSS/EP — Analog ground / exposed thermal pad (connect to VSS) |
Typical Applications
DSPIC33EV256GM002-I/MM is suitable for 6 applications: Automotive Sensing Nodes, Appliance Motor Control (BLDC/PMSM/ACIM), Industrial Power Supplies and Digital Power, CAN/LIN Networked Actuators, Precision Sensor Interfaces, Test and Measurement Instrumentation.
Automotive Sensing Nodes
The DSPIC33EV256GM002-I/MM fits automotive sensing directly: its 5V operation tolerates the noisy 12V-load-dump-ridden vehicle electrical environment, and native SENT and LIN interfaces connect to standard automotive sensors and body-network buses without external translators. The 70 MIPS DSP engine filters raw signals (crank, wheel-speed, pressure) in real time, while ECC Flash safeguards code integrity against single-bit upsets from electrical stress. The -I grade covers underhood-adjacent zones at -40C to +85C; choose E or H variants for hotter locations. Firmware of up to 256KB supports full diagnostic stacks and OTA-ready bootloaders in the same 28-QFN footprint.
Recommended
Appliance Motor Control (BLDC/PMSM/ACIM)
Appliance motor drives benefit from the DSPIC33EV256GM002's combination of 70 MIPS DSP throughput and 5V noise immunity in environments with relay switching and compressor transients. The DSP engine executes field-oriented-control multiply-accumulate loops with headroom to spare, and the barrel shifter accelerates scaling operations in current-loop code. ECC Flash protects the control algorithm over the product's lifetime, and Peripheral Pin Select lets PWM, ADC, and UART pins route to the most convenient 28-QFN locations for the inverter layout. The 16KB RAM holds current/firmware state machines and fault logs; CAN or LIN links the drive to the main appliance controller.
Recommended
Industrial Power Supplies and Digital Power
In digitally controlled AC/DC and DC/DC converters, the DSPIC33EV256GM002 provides the fast control-loop math (70 MIPS, DSP MAC) needed for peak-current-mode and digital PFC stages, while 5V I/O interfaces cleanly with gate-driver logic levels common in industrial power boards. The 12-bit-grade analog inputs handle voltage/current feedback sampling, and ECC Flash ensures the converter firmware survives years of thermal cycling in sealed enclosures. Peripheral Pin Select permits adaptive pin mapping across power-board revisions without respinning the PCB. The 28-QFN-S 6x6 package with exposed pad gives a compact, thermally efficient controller footprint beside the magnetics.
Recommended
CAN/LIN Networked Actuators
For industrial and vehicular actuator modules, the DSPIC33EV256GM002-I/MM offers an on-chip CAN 2.0B controller plus LIN support, eliminating external communication ICs and freeing the 70 MIPS core for motion sequencing. 5V GPIO drives optocouplers, relays, and sensor rails directly, reducing component count in harsh cabinets. The 256KB ECC Flash accommodates large command tables, parameter stores, and field-update bootloaders, while the 16KB RAM buffers CAN messages and state history. Peripheral Pin Select adapts the 28-pin budget across actuator variants; the I-grade range of -40C to +85C covers factory-floor and cabin environments reliably.
Recommended
Precision Sensor Interfaces
The dsPIC33EV family sell sheet highlights easy connection to precision sensors, and the DSPIC33EV256GM002 delivers: 5V analog inputs give a wide ADC span for bridge and ratiometric sensors, improving SNR roughly 3.5 dB over 3.3V systems at the same noise floor. The 70 MIPS DSP core performs real-time averaging, IIR/FIR filtering, and calibration math on-chip, while SENT and UART outputs stream results to higher-level controllers. ECC Flash protects calibration constants, and the 16KB RAM supports multi-channel buffering. The 28-QFN-S 6x6 footprint integrates the sensor-conditioning controller directly on compact sensor PCBs.
Recommended
Test and Measurement Instrumentation
Handheld and embedded measurement instruments exploit the DSPIC33EV256GM002's 70 MIPS DSP engine for FFTs, RMS computation, and trigger detection, while 5V logic simplifies interfacing with industrial signal levels and relay front ends. The 256KB ECC Flash stores instrument firmware, lookup tables, and logging space, and the 16KB RAM holds waveform buffers for short captures. Peripheral Pin Select routes UART/SPI to panel components across board revisions without layout changes, and ICSP over any PGECx/PGEDx pair enables field reprogramming through a service header. The compact 28-QFN-S 6x6 exposed-pad package suits dense handheld PCB stacks.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV256GM002-I/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM002-H/MM | DSPIC33EV128GM002-I/MM | DSPIC33EV128GM102T-I/MM | DSPIC33EV64GM002-I/MM | DSPIC33EV32GM002-I/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm), exposed pad | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (ECC Flash) | 256KB (85.5K x 24) | 256KB | 128KB | 128KB | 64KB | 32KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB | 16KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (H grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Communication Interfaces | CAN 2.0B, LIN, SENT, UART, SPI, I2C | CAN 2.0B, LIN, SENT, UART, SPI, I2C | CAN 2.0B, LIN, SENT, UART, SPI, I2C | CAN 2.0B, LIN, SENT, UART, SPI, I2C | CAN 2.0B, LIN, SENT, UART, SPI, I2C | CAN 2.0B, LIN, SENT, UART, SPI, I2C |
Key Differentiators
- Maximum 256KB ECC Flash in the 28-pin footprint (vs DSPIC33EV128GM002-I/MM)
- Extended temperature option on the same die (vs DSPIC33EV256GM002-H/MM)
- 5V operation with native CAN/LIN/SENT (vs DSPIC33EV64GM002-I/MM)
- Trade-off: higher unit cost than memory-reduced siblings (vs DSPIC33EV128GM102T-I/MM)
Design Notes
Supply the DSPIC33EV256GM002-I/MM from a single 4.5V to 5.5V rail and decouple every VDD pin (pins 7, 14, 22) with 100nF ceramic capacitors placed within 2 mm of each pin, plus one bulk 4.7uF-10uF per board. Fit the VCAP/VDDCORE capacitor (pin 12) exactly as specified in the family data sheet DS70005144H - an incorrect or missing core capacitor causes unreliable startup and intermittent resets. Connect the exposed pad (pin 28 / AVSS) to a solid ground plane for both grounding and thermal relief.
ICSP pairing errors are the most common bring-up failure on this device. Per Microchip programming documentation (northernsoftware.com dsPIC33EV256GM002 support notes), the device has more than one PGECx/PGEDx pair and you must use the pair together: if PGEC3 is used for ICSPCLK, ICSPDAT must be on PGED3 - never mix channels. Additionally, all VDD and VSS pins must be connected during programming. For ICCD/NSDSP tool selection, all NSDSP-1/2/3 probes support this device.
Use Peripheral Pin Select (PPS) deliberately: route high-frequency PWM outputs and ADC-critical remappable RPn pins away from the crystal traces at OSC1/OSC2 (pins 10-11) and keep analog input traces (AN0-AN11) short with a local analog ground island tied to AVSS/exposed pad. Reserve both a PGECx/PGEDx pair and MCLR on a 5-pin programming header in every layout - retrofitting a debug header after PCB release is the most expensive mistake possible on a 28-pin part.
Estimated: a 70 MIPS 5V DSC dissipates on the order of 0.15-0.35W under typical load (based on the 5V supply and typical DSC operating current class). The 6x6 mm QFN exposed pad must be soldered to a ground area of at least 4-6 via-connected cm2 to keep junction temperature well below limits; at the +85C maximum ambient of the I grade, thermal margin is modest and E or H grade variants (family supports up to 150C) should be evaluated for hotter environments.
Compliance Information
Compliance statuses were not present in the provided verified web data; confirm on Microchip's official product status page before release to regulated markets. The dsPIC33EV family sell sheet documents automotive-oriented features, but AEC-Q100 qualification for this specific ordering code was not stated in the provided data.
