DSPIC33EP32GP502T-E/MM - 16-bit 60MIPS DSC 32KB | Microchip
MPN: DSPIC33EP32GP502T-E/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.71 | $371.00 |
| 500 | $3.34 | $1,670.00 |
| 1,000 | $2.98 | $2,980.00 |
DSPIC33EP32GP502T-E/MM Overview
A digital signal controller combines the control peripherals and ease of use of a microcontroller with the math throughput of a DSP core. In the power-management hierarchy, the dsPIC33E sits above basic 8-bit MCUs and below application processors, occupying the embedded control tier where deterministic interrupt latency and fast multiply-accumulate operations matter most.
Key features include a 16-bit dsPIC33E core executing up to 60 MIPS, a 6-channel 10-bit or 12-bit ADC, multiple high-speed PWM modules suited to power conversion, 4-channel DMA, and on-chip POR, watchdog timer, and Brown-out Detect/Reset. These peripherals make the part well suited to closed-loop digital power and sensing systems without external analog components.
Architecturally, the dsPIC33EP core uses an enhanced Harvard structure with a 24-bit instruction word and DSP engine supporting single-cycle MAC operations. The code-dense instruction set and Hardware Barrel Shifter reduce cycle counts in filtering and control algorithms compared with generic MCUs.
Typical applications include digital power supplies, motor control, industrial automation, automotive subsystems (the device is AEC-Q100 listed per distributor data), and sensor signal conditioning.
Design consideration: at 60 MIPS the core is sensitive to supply ripple, so use a solid 3.3V rail with 0.1uF decoupling on every VDD pin plus bulk capacitance near the exposed pad.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP32GP502T-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32GP502T-E/MM (same form factor and footprint) — differing in Package, Operating Temperature, Core Architecture, Core, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GP502-I/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP32GP502T-E/MMVAO
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP64GP502T-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GP502T-I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.68 / Unit
View Datasheet →PIC24EP32GP202T-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32MC202T-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP502T-E/MM Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| CPU Speed | 60 MIPS (60 MHz) |
| Program Memory | 32 KB (10.7K x 24) FLASH |
| SRAM | 4 KB |
| ADC | 6-channel, 10-bit or 12-bit |
| PWM | Multiple PWM modules |
| DMA Channels | 4 |
| Operating Voltage | 3.3 V |
| Operating Temperature | -40C to +125C (E grade) |
| Package | 28-QFN-S (6x6 mm), exposed pad |
| Mounting Type | Surface Mount |
| Watchdog Timer | Yes (WDT) |
| Reset Sources | POR, BOR/BOR Reset |
| Qualification | AEC-Q100 (automotive eligible per distributor data) |
| Series | dsPIC33EP32GP50x (dsPIC 33EP) |
| Packaging Code | T (Tape & Reel), /E extended temperature |
DSPIC33EP32GP502T-E/MM 28-qfn-s (6x6 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP32GP502T-E/MM (28-qfn-s (6x6 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32GP502T-E/MM.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32GP502T-E/MM is suitable for 6 applications: Digital Power Supplies, Brushed and BLDC Motor Control, Automotive Body and Sensor Modules, Sensor Signal Conditioning and Data Acquisition, Industrial Automation and PLC I/O, LED Lighting and Electronic Ballasts.
Digital Power Supplies
The DSPIC33EP32GP502T-E/MM fits digital power conversion because its multiple high-speed PWM modules and 6-channel 12-bit ADC option provide the sampling and switching resources needed for voltage-mode and current-mode control loops. Running at 60 MIPS with a single-cycle MAC DSP engine, the core executes PID or 2P2Z compensators well within a 50-100 kHz control-loop budget, while 4 DMA channels move ADC results to RAM without CPU intervention. Placed as the supervisory controller on a 3.3V rail, it replaces analog compensators with firmware, enabling programmable soft-start and fault handling; the trade-off is that loop tuning shifts from hardware to software.
Recommended
Brushed and BLDC Motor Control
For motor control, the DSPIC33EP32GP502T-E/MM combines complementary PWM outputs with a fast 12-bit ADC for phase-current sensing, and its 60 MIPS core handles commutation math including Clarke/Park transforms for sensored or sensorless BLDC drives. The 4-channel DMA streams current samples into buffers while interrupts manage the control loop, and Brown-out Detect plus the watchdog timer protect against firmware lockup in torque-critical systems. The extended -40C to +125C grade suits motor-adjacent mounting where ambient temperatures rise. Compared with analog control, firmware-based commutation allows field updates and profile changes without PCB revision.
Recommended
Automotive Body and Sensor Modules
Distributor listings (Hotenda, Lisleapex) identify the DSPIC33EP32GP502T-E/MM family as automotive and AEC-Q100 listed, and the extended -40C to +125C temperature range covers under-hood and near-engine ambient conditions. The 12-bit ADC reads resistive and ratiometric sensors, PWM drives lamps or small actuators, and the on-chip POR/BOR/WDT set meets the reset-robustness expectations of vehicle electrical systems. In a 12V vehicle rail, the controller sits behind a 3.3V LDO or buck regulator; the QFN exposed pad provides a low-impedance ground reference that helps noisy automotive grounds. Use the MMVAO variant where formal automotive qualification documentation is required.
Recommended
Sensor Signal Conditioning and Data Acquisition
The DSPIC33EP32GP502T-E/MM serves compact DAQ nodes because its 6-channel 10/12-bit ADC samples multiple sensors sequentially under DMA control, and the DSP engine applies offset removal and FIR/IIR filtering in firmware using single-cycle MAC instructions. With 32KB FLASH and 4KB SRAM, a complete acquisition-plus-compensation firmware fits on-chip, and the 60 MIPS core leaves headroom for scaling and threshold logic. The 28-QFN 6x6 package enables dense multi-sensor PCBs, while the -40C to +125C range permits mounting directly inside enclosures with heated equipment. Trade-off: 4KB SRAM limits deep buffering, so stream data over UART/SPI rather than storing it locally.
Recommended
Industrial Automation and PLC I/O
In industrial automation nodes, the DSPIC33EP32GP502T-E/MM implements smart I/O functions: the 12-bit ADC monitors analog inputs, PWM generates dimming or actuator drive signals, and the core's 60 MIPS throughput executes communication stacks and state machines concurrently. The extended temperature grade tolerates cabinet environments, and the watchdog timer plus Brown-out Detect/Reset provide the self-recovery behavior expected in unattended installations. UART/SPI/I2C serial ports link the node to a PLC gateway; because 32KB FLASH accommodates a lean Modbus or proprietary protocol stack, external memory is unnecessary. DMA offloads serial data movement, keeping interrupt latency deterministic for time-critical I/O.
Recommended
LED Lighting and Electronic Ballasts
The DSPIC33EP32GP502T-E/MM suits digitally controlled LED drivers and ballasts: high-speed PWM outputs drive MOSFET or LED strings at switching frequencies from tens of kilohertz upward, the 12-bit ADC reads current shunts and temperature sensors, and the DSP engine maintains constant-current loops with firmware compensators. At 60 MIPS, cycle-by-cycle current limiting and phase dimming logic run comfortably in interrupts. The -40C to +125C rating matches luminaire driver enclosures, and the compact 28-QFN 6x6 footprint fits driver PCBs with tight space budgets. Firmware-based control enables dimming curves and fault derating to be tuned in production without hardware changes, a key advantage over fixed analog drivers.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GP502T-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GP502-I/MM | DSPIC33EP32GP502T-E/MMVAO | DSPIC33EP64GP502T-I/MM | PIC24EP32GP202T-I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | PQCC28 - same footprint | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MHz | 60 MIPS | 60 MIPS |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 32 KB |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C | -40C to +125C (E) | -40C to +85C | -40C to +85C |
| Qualification | AEC-Q100 listed per distributor data | Industrial | AEC-Q100 automotive | Industrial | Industrial |
| ADC | 6-channel, 10/12-bit | 6-channel, 10/12-bit | 6-channel, 10/12-bit | 6-channel, 10/12-bit | 6-channel, 10/12-bit |
| Typical Use Case | Digital power, motor control, harsh environments | Cost-optimized industrial control | Automotive modules with formal traceability | Firmware growth headroom | General MCU control tasks |
Key Differentiators
- Extended -40C to +125C temperature grade (vs DSPIC33EP32GP502-I/MM)
- Automotive-qualified sibling available on the same die (vs DSPIC33EP32GP502T-E/MMVAO)
- Same-pinout upgrade path within the footprint (vs DSPIC33EP64GP502T-I/MM)
Design Notes
Run the DSPIC33EP32GP502T-E/MM from a clean 3.3V rail with 0.1uF ceramic decoupling at each VDD pin plus 4.7-10uF bulk near the 28-QFN exposed pad. At 60 MIPS the core draws transient current bursts synchronized to the clock, and the dsPIC33E POR/BOR thresholds require a monotonic supply ramp - a soft-starting regulator is preferable to a raw RC ramp. Estimated: at roughly 30-60 mA typical operating current, a 3.3V rail dissipates only 0.1-0.2 W per device, so a 100 mA-class LDO suffices for single-chip designs.
Solder the QFN exposed pad to a grounded copper pour with an array of thermal vias; this is both the main heat path and the lowest-inductance ground reference for the ADC. Keep the VREF/AN0-AN5 traces short and away from PWM switching nodes, and route PGC/PGD programming pins to a 5-pin header (MCLR, VDD, GND, PGD, PGC) so ICSP debugging with PICkit/ICD/SNAP tools is possible without rework.
MCLR is also the ICSP high-voltage programming pin; do not load it with a strong pull-down or large capacitor that blocks VPP. Confirm the temperature suffix before release: /I parts stop at +85C while this /E part reaches +125C - substituting an I-grade in a hot enclosure will cause field failures. For the /MM QFN, note that pinout differs from SS/SP package variants of the same die, so always verify against the QFN-28 pin diagram in the device datasheet.
Compliance Information
Distributor listings (Hotenda, Lisleapex) describe the device family as Automotive, AEC-Q100. RoHS/REACH/lead-free status should be confirmed on the official Microchip product page certificate of conformance before release.
