DSPIC33EV64GM002-I/SP - 16-bit 70 MIPS 5V DSC | Microchip
MPN: DSPIC33EV64GM002-I/SP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.72 | $5.72 |
| 10 | $5.3 | $53.00 |
| 100 | $4.85 | $485.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $4.1 | $4,100.00 |
DSPIC33EV64GM002-I/SP Overview
A digital signal controller combines the computational architecture of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, DSCs sit above generic MCUs for math-intensive real-time control loops, and the dsPIC33EV family extends this with a 5V-tolerant operating range that many competing 3.3V controllers cannot match directly.
Key features include the 16-bit DSP engine executing up to 70 MIPS, ECC-protected Flash for functional-safety (FuSa) oriented designs, and 5V I/O that simplifies interfacing with industrial sensors and automotive signal levels. The -I temperature suffix specifies industrial-grade operation from -40C to +85C. The part is supported by Microchip MPLAB X IDE and XC16 compiler toolchain plus MPLAB ICD/REAL ICE debug hardware.
Technically, the dsPIC33EV64GM002 pairs its modified Harvard 16-bit core with a barrel shifter and DSP multiply-accumulate hardware, supporting deterministic motor-control and power-conversion loops. The integrated ECC Flash reduces soft-error risk, a benefit in noisy 5V environments where the family is specifically positioned for harsh-environment reliability.
Typical applications include safety motor control, automotive and appliance control boards, and industrial power supplies and converters, where the combination of 70 MIPS DSP throughput, PWM peripherals, and 5V robustness directly addresses noise, vibration, and voltage-surge stress.
For design, note that the 2.54mm-pitch SPDIP package occupies substantial board area versus SMD variants; prototyping on SPDIP then transitioning to an SOIC or SSOP footprint sibling is a common workflow. Remember that ICSP programming requires using PGECx/PGEDx pairs as matched pairs.
This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EV64GM002-I/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV64GM002-I/SP (same form factor and footprint) — differing in Package, Operating Temperature, Programming Interface, RAM, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV64GM002-E/SP
✅ Drop-In✓ In Stock
$3.12 / Unit
View Datasheet →DSPIC33EV64GM002-M/SP
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV64GM002-H/SP
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV64GM002-I/SS
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV32GM002-I/SS
✅ Drop-In✓ In Stock
$2.78 / Unit
View Datasheet →DSPIC33EV64GM002-I/SP Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EV DSC |
| Maximum CPU Speed | 70 MIPS |
| Supply Voltage | 5 V |
| Flash Program Memory | 64 KB (22K x 24) with ECC |
| RAM | 8 KB |
| Package | 28-pin SPDIP (PDIP-28) |
| Mounting Type | Through-Hole |
| Pin Pitch | 2.54 mm |
| Operating Temperature | -40C to +85C (industrial, -I suffix) |
| Functional Safety Support | FuSa (ECC Flash) |
| DMA Channels | 4 |
| Timers | 7 |
| On-Chip Peripherals | PWM, SENT, Op Amps, Advanced Analog |
| Programming Interface | ICSP (PGECx/PGEDx pairs) |
| Family Technology | CMOS, 5V robust |
DSPIC33EV64GM002-I/SP 28-pin spdip (pdip-28) Pin Configuration Guide
Pin configuration for DSPIC33EV64GM002-I/SP (28-pin spdip (pdip-28) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV64GM002-I/SP.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV64GM002-I/SP is suitable for 6 applications: Safety Motor Control, Appliance Control Boards, Automotive Body and Control Units, Industrial Power Conversion, Sensor Signal Conditioning and Data Acquisition, Embedded Prototyping and Education.
Safety Motor Control
Microchip explicitly positions the dsPIC33EV family as a 5V robust DSC for safety motor control, and the DSPIC33EV64GM002-I/SP fits this role with its 70 MIPS DSP engine, PWM peripherals, and 4 DMA channels that keep field-oriented control loops deterministic under load. The 5V-rated I/O delivers superior noise immunity against PWM switching transients common in inverter stages, while ECC-protected Flash preserves program integrity in electrically harsh motor-drive enclosures. In a typical topology the DSC executes the current and speed control loops while gating the power stage via complementary PWM outputs, with the SENT peripheral available for safety-relevant sensor feedback. The FuSa (functional safety) designation from DigiKey classification supports certification-oriented motor-control designs.
Recommended
Appliance Control Boards
Home and commercial appliances expose controllers to line-voltage surges, vibration, and wide ambient swings, exactly the harsh environment Microchip targets with the dsPIC33EV family. The DSPIC33EV64GM002-I/SP operates natively at 5V, allowing direct connection to AC-zero-cross circuits, relay drivers, and legacy 5V sensors without level-shifting circuitry, which reduces BOM count on cost-sensitive appliance boards. Its 64KB ECC Flash provides headroom for feature-rich firmware including user interfaces, diagnostics, and connectivity stacks, while the 70 MIPS core handles simultaneous motor (compressor/fan) and UI control. The through-hole SPDIP package also simplifies service-friendly, hand-assemblable production runs typical of appliance subassemblies and repair parts.
Recommended
Automotive Body and Control Units
The dsPIC33EV GM family is marketed by Microchip for automotive sensors, touch and control units operating reliably amid noise and vibration. The DSPIC33EV64GM002-I/SP contributes 5V-tolerant I/O that matches standard automotive 12V-derived signal rails through simple conditioning, SENT peripheral support for automotive sensor interfaces, and ECC Flash that mitigates soft errors in high-vibration, wide-temperature cabin and chassis environments. Its 70 MIPS DSP engine supports sensor signal processing such as filtering and demodulation at line rates, and the 7-timer suite manages time-critical I/O. For extended under-hood zones, substitute the drop-in DSPIC33EV64GM002-E/SP variant rated to +125C without any PCB change.
Recommended
Industrial Power Conversion
Switch-mode power supplies, solar micro-inverters, and industrial DC-DC stages require fast, deterministic control loops; the DSPIC33EV64GM002-I/SP delivers with its 70 MIPS core, DSP multiply-accumulate instructions for compensator math, and PWM peripherals with fine edge control. The 5V supply rail matches gate-driver and optocoupler logic thresholds common in isolated power topologies, and ECC Flash keeps firmware safe in high-dV/dt switch-node environments. Four DMA channels offload ADC result transfers so the CPU sustains loop rates without interrupt latency spikes. Prototyping on the 2.54mm SPDIP package accelerates bench iteration on power stages before migrating to an SMD footprint family member for production.
Recommended
Sensor Signal Conditioning and Data Acquisition
The dsPIC33EV64GM002 integrates on-chip op amps, advanced analog peripherals, and a SENT interface, making the DSPIC33EV64GM002-I/SP a compact single-chip front end for industrial sensor nodes. The 70 MIPS DSP engine executes digital filtering, RMS computation, and calibration math on sampled channels, while DMA moves ADC results without CPU intervention. Native 5V analog rails improve signal-to-noise headroom for bridges, potentiometers, and ratiometric sensors compared with 3.3V systems, and the SENT peripheral decodes automotive sensor streams directly. This makes the part well suited to pressure, position, and flow sensor interfaces where signal conditioning, computation, and communications must coexist on one low-cost controller.
Recommended
Embedded Prototyping and Education
The 2.54mm-pitch 28-pin SPDIP package of the DSPIC33EV64GM002-I/SP is ideal for breadboards, sockets, and hand-soldered prototype boards, which is why through-hole DSCs remain popular in labs, education, and low-volume industrial builds. Engineers can iterate firmware quickly using MPLAB X IDE, the XC16 compiler, and low-cost ICSP programmers, needing only a matched PGECx/PGEDx pair for programming. The full dsPIC33EV feature set - 70 MIPS, ECC Flash, 8KB RAM, DSP engine - is available on the breadboard exactly as it will behave in the final SMD design, since the die and firmware are identical across package variants. This shortens the path from concept sketch to validated production firmware.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV64GM002-I/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV64GM002-E/SP | DSPIC33EV64GM002-M/SP | DSPIC33EV64GM002-H/SP | DSPIC33EV32GM002-I/SS |
|---|---|---|---|---|---|
| Package | 28-SPDIP | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | SSOP-28 (verify before swap) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Performance | 16-bit dsPIC33EV, 70 MIPS | 16-bit dsPIC33EV, 70 MIPS | 16-bit dsPIC33EV, 70 MIPS | 16-bit dsPIC33EV, 70 MIPS | 16-bit dsPIC33EV, 70 MIPS |
| Flash Memory | 64 KB (22K x 24) ECC | 64 KB ECC | 64 KB ECC | 64 KB ECC | 32 KB ECC (-50%) |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | -40C to +85C (-I) | Extended grade (-E) | -M grade | -H grade | -40C to +85C (-I) |
Key Differentiators
- Extended-temperature drop-in upgrade path (vs DSPIC33EV64GM002-E/SP)
- Native 5V operation with ECC Flash (vs DSPIC33EV32GM002-I/SS)
- Through-hole SPDIP serviceability (vs DSPIC33EV64GM002-I/SS)
Design Notes
The 28-pin SPDIP (2.54mm pitch) through-hole package is breadboard-friendly but occupies roughly 35 x 10 mm of board area - several times the footprint of the SOIC or SSOP family members. For production designs where space matters, prototype on this SPDIP part and lay out the final PCB for a same-pin-count SMD sibling such as DSPIC33EV64GM002-I/SO, then move firmware unchanged. Verify pin function mapping between packages in the Microchip datasheet pin diagrams before committing the layout, since multiplexed pin functions must be checked per package.
ICSP programming on the dsPIC33EV64GM002 requires using PGECx/PGEDx pins as matched pairs: if PGEC2 carries ICSPCLK, then PGED2 must carry ICSPDAT - mixing pairs across different numbers will fail programming, per the documented ICSP connection guidance. Also reserve MCLR (pin 1) access with a 10k pull-up and programming header on every board, even production units, so field firmware updates remain possible. Do not exceed the 5V supply specification; although the family is 5V-robust, inputs tied to external 12V-derived signals still need conditioning.
Design a clean 5V rail with local 0.1uF ceramic decoupling on each VDD pin pair plus bulk capacitance (10uF) near the controller, especially when the same rail feeds relay coils or gate drivers in motor-control and appliance applications. The 5V I/O structure offers strong noise immunity, but supply dip during PWM bursts can still cause brown-out resets - enable the internal brown-out detector in configuration words and verify the rail with an oscilloscope under worst-case load. Extended-temperature designs should budget derating for the -E grade variant instead of the -I part.
Compliance Information
Compliance status not present in the provided verified web data; confirm RoHS/REACH status on the Microchip product page or distributor compliance documents before release.
