DSPIC33FJ32GP101T-I/SS - 16-Bit 16 MIPS 32KB DSC | Microchip
MPN: DSPIC33FJ32GP101T-I/SS ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.74 | $1,870.00 |
| 1,000 | $3.32 | $3,320.00 |
DSPIC33FJ32GP101T-I/SS Overview
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. In the embedded hierarchy, this device sits between simple MCUs and full DSPs: its modified Harvard RISC core executes most instructions in a single cycle, making it well suited for digital filter algorithms and high-speed precision digital control loops that need to perform under pressure.
Key features include a 16-bit dsPIC core rated at 16 MIPS, 32KB of self-programmable FLASH organized as 11K x 24, 2KB of on-chip RAM, operation from a nominal 3.3V supply (3.0V to 3.6V), and industrial temperature support from -40C to +85C. The device supports In-Circuit Serial Programming (ICSP) and in-circuit debugging through tools such as the MPLAB SNAP, which connects via a simple interface using two device I/O pins plus the reset line.
The dsPIC33F architecture includes a DSP engine with hardware multiply-accumulate support, enabling efficient execution of FIR/IIR filters and PID control loops. Peripherals are arranged with Peripheral Pin Select (RPn remappable pins), letting designers route digital functions to available physical pins - valuable in compact 28-pin designs.
Typical applications include motor-adjacent general-purpose control, power-supply digital control loops, sensor conditioning with digital filtering, industrial automation nodes, and portable instrumentation where 3.3V low-power operation is required.
Design consideration: the dsPIC33FJ32GP101 family is a mature series; check lifecycle status for your production window and prefer the -E/SS extended-temperature variant when designs must span -40C to +125C.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33FJ32GP101T-I/SS — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ32GP101T-I/SS (same form factor and footprint) — differing in Operating Temperature, Package, Communication Interfaces, Core Architecture, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ32GP101-E/SS
✅ Drop-In✓ In Stock
$3.2 / Unit
View Datasheet →DSPIC33FJ32GP102-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.95 / Unit
View Datasheet →DSPIC33FJ16GP101-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.41 / Unit
View Datasheet →DSPIC33FJ16GP102-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.82 / Unit
View Datasheet →DSPIC33FJ32MC102-I/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.85 / Unit
View Datasheet →DSPIC33FJ32GP101T-I/SS Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33F RISC DSC |
| Performance | 16 MIPS |
| Program Memory Size | 32KB |
| Program Memory Organization | 11K x 24 FLASH |
| RAM Size | 2KB (1K x 16) |
| Supply Voltage | 3.0 V to 3.6 V (nominal 3.3 V) |
| Maximum Clock Frequency | 32 MHz |
| Operating Temperature | -40C to +85C |
| Package | 28-SSOP (0.209 in, 5.30 mm width) |
| Terminal Pitch | 0.65 mm |
| Mounting Type | Surface Mount |
| Programming/Debug | ICSP via MPLAB SNAP (2 I/O pins + reset) |
| Peripheral Pin Select | Yes (RPn remappable pins) |
| Packaging | Tape & Reel (T suffix) |
| Temperature Grade | I (Industrial) |
DSPIC33FJ32GP101T-I/SS 28-ssop (0.209 in, 5.30 mm width) Pin Configuration Guide
Pin configuration for DSPIC33FJ32GP101T-I/SS (28-ssop (0.209 in, 5.30 mm width) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ32GP101T-I/SS.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ32GP101T-I/SS is suitable for 6 applications: Digital Power Supply Control, Industrial Sensor Conditioning, Portable Battery-Powered Instrumentation, General-Purpose Embedded Control, Digital Audio and Signal Processing Nodes, Legacy Design Maintenance and Refresh.
Digital Power Supply Control
The DSPIC33FJ32GP101T-I/SS fits digital power supplies where control loops must execute at fixed, fast intervals: its 16 MIPS 16-bit core executes PID and compensator code deterministically, while 2KB RAM holds state variables and coefficient tables for FIR/IIR filtering of sampled voltages and currents. In a typical topology, the on-chip ADC samples the feedback divider and a remappable RPn pin outputs PWM to the power stage MOSFET driver, with loop rates in the tens of kHz achievable at 16 MIPS. Placed in a 3.3V domain with 0.1uF decoupling on each VDD pin and the bottom metal pad tied to VSS per the Microchip datasheet, the controller adds no switching noise of its own while providing precision regulation that analog-only control cannot match in programmability.
Recommended
Industrial Sensor Conditioning
For industrial sensor nodes, the DSPIC33FJ32GP101T-I/SS combines 16 MIPS of DSP-grade arithmetic with a 3.0V to 3.6V supply range, making it suitable for filtering and scaling signals from strain gauges, pressure sensors, and thermocouple front ends. The remappable Peripheral Pin Select (RPn) lets designers route UART or SPI to whatever physical pins remain free in a dense 28-pin layout, a key benefit when board space is constrained. Its 32KB (11K x 24) FLASH accommodates calibration tables and linearization code, and the -40C to +85C industrial rating matches factory-floor temperature envelopes. Because the die executes single-cycle multiply-accumulate operations, digital filtering of noisy sensor channels adds minimal loop latency compared to a general-purpose 8-bit MCU.
Recommended
Portable Battery-Powered Instrumentation
Handheld and portable instruments benefit from the DSPIC33FJ32GP101T-I/SS because it operates directly from a single 3.3V LDO rail within a 3.0V to 3.6V window, simplifying the power tree in battery designs. The 28-SSOP package with 0.65mm pitch and 5.30mm body width keeps the footprint compact for handheld PCBs, while the 16-bit core at 16 MIPS provides enough headroom for math-heavy measurement routines such as RMS computation and FFT-based analysis. The ICSP interface needs only two I/O pins plus MCLR, so a programming header adds negligible board area. Tape-and-reel delivery (T suffix) supports automated assembly for volume production of portable devices.
Recommended
General-Purpose Embedded Control
As a general-purpose DSC, the DSPIC33FJ32GP101T-I/SS serves embedded control tasks that outgrow 8-bit MCUs: appliances, chargers, lighting controllers, and industrial sub-systems needing deterministic loop timing plus modest DSP capability. Microchip positions the dsPIC33F family for designs needing to perform under pressure, with seamless migration options to PIC24F, PIC24H MCUs, and dsPIC30F DSCs, protecting long-term firmware investment. The 32KB FLASH holds substantial application code including communication stacks, and 2KB RAM supports modest buffering. Development uses MPLAB X with the XC16 compiler and MPLAB SNAP debugging over ICSP, giving teams a low-cost toolchain. Choosing the -E/SS variant extends temperature rating to +125C for harsh environments with no PCB change.
Recommended
Digital Audio and Signal Processing Nodes
The dsPIC DSP engine of the DSPIC33FJ32GP101T-I/SS, with single-cycle MAC instructions, makes it practical for embedded audio processing such as active crossover filters, tone control, and simple effects at modest sample rates. The 2KB (1K x 16) RAM constrains filter length and buffering, so designs should size IIR structures rather than long FIRs, but 16 MIPS sustains multi-channel processing at telephony-grade sample rates. The remappable RPn pins allow flexible placement of serial audio data clocks and UART control interfaces within the 28-pin budget. Operating from a clean 3.3V rail with per-pin 0.1uF decoupling, the digital core coexists with analog front ends on the same board without excessive noise coupling.
Recommended
Legacy Design Maintenance and Refresh
Many fielded products were built around the dsPIC33FJ32GP101 family, and the T-I/SS grade remains the stock-keeping choice for sustaining production lines. Because the entire 28-pin family shares the 28-SSOP footprint, a maintenance team can substitute the DSPIC33FJ32GP101-E/SS for extended temperature or move to a 16KB FLASH variant for cost recovery without PCB respin, provided the pin map is verified for GP102-class parts. Firmware remains compatible across the family through MPLAB X and the XC16 compiler, and ICSP-based field updates require only the standard two-pin programming interface. This makes the part a low-risk anchor for long-lifecycle industrial and medical-adjacent equipment where requalification of a new architecture is undesirable.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ32GP101T-I/SS — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ32GP101-E/SS | DSPIC33FJ32GP102-I/SS | DSPIC33FJ16GP101-I/SS | DSPIC33FJ16GP102-I/SS | DSPIC33FJ32MC102-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-SSOP (5.30 mm, 0.65 mm pitch) | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 16-bit dsPIC33F, 16 MIPS | 16-bit, 16 MIPS | 16-bit, 16 MIPS | 16-bit, 16 MIPS | 16-bit, 16 MIPS | 16-bit, 16 MIPS |
| FLASH Program Memory | 32KB (11K x 24) | 32KB (11K x 24) | 32KB (11K x 24) | 16KB (5.5K x 24) | 16KB (5.5K x 24) | 32KB (11K x 24) |
| RAM | 2KB (1K x 16) | 2KB | 2KB | 2KB | 2KB | 2KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Peripheral Family | General Purpose (GP) | General Purpose (GP) | General Purpose (GP), different pin allocation | General Purpose (GP) | General Purpose (GP), different pin allocation | Motor Control (MC) PWM set |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Key Differentiators
- Extended temperature option with zero PCB change (vs DSPIC33FJ32GP101-E/SS)
- Double the program memory at same footprint (vs DSPIC33FJ16GP101-I/SS)
- Deterministic DSP capability vs plain 8-bit MCUs (vs PIC18F2520-I/SO)
Design Notes
Per the Microchip family datasheet (document 70000652), the metal pad at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. Always provide a VSS-connected landing pad under the SSOP body to improve grounding and EMI behavior. Place one 0.1uF ceramic capacitor at each VDD pin, as close to the pin as possible, plus a bulk 4.7uF-10uF capacitor near the IC for supply transient support during FLASH write operations.
Keep the ICSP programming pins (PGD/PGC) and MCLR accessible via a header even in production boards. MCLR requires a pull-up resistor (typically 10k) to VDD; leaving it floating causes erratic resets. Additionally, remember that RPn pins are remappable only through the PPS unlock sequence in software - hardwiring a peripheral assumption onto a non-remappable pin during layout review prevents later fixes. Verify analog/digital pin assignments against the datasheet Table 1 before finalizing routing.
The device operates from 3.0V to 3.6V with 3.3V nominal. Estimated power budget: at 16 MIPS and typical dsPIC33F core current on the order of tens of milliamps, a 3.3V regulator sized at 100 mA per controller plus peripheral load margin is sufficient. Avoid powering the MCU directly from a noisy buck converter without post-filtering when using the ADC for precision sampling; an LDO or ferrite-plus-ceramic pi filter on AVDD improves ADC noise performance measurably.
Keep analog sense routing (VREF+/VREF- and ADC input pins RB0-RB5) away from PWM output traces and crystal/OSC lines. Use a solid ground plane beneath the device; since the exposed pad should be tied to VSS, stitching it into the ground plane with multiple vias reduces ground bounce. For 32 MHz oscillator operation, keep OSC1/OSC2 traces short and guard them with ground, matching the crystal load capacitors per the crystal manufacturer specification.
Compliance Information
RoHS/REACH/lead-free status not stated in retrieved web data; confirm via Microchip product page or distributor certificate of conformance. Automotive AEC-Q100 qualification is not claimed for this general-purpose dsPIC33FJ part.
