DSPIC33FJ64GS406T-50I/MR - 16-bit DSC, 50 MIPS, 64KB | Microchip
MPN: DSPIC33FJ64GS406T-50I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.85 | $6.85 |
| 10 | $6.17 | $61.70 |
| 100 | $5.48 | $548.00 |
| 500 | $4.9 | $2,450.00 |
| 1,000 | $4.38 | $4,380.00 |
DSPIC33FJ64GS406T-50I/MR Overview
A digital signal controller combines the computational throughput of a DSP engine with the peripheral integration and ease of use of a microcontroller, sitting in the hierarchy between a general-purpose MCU and a dedicated DSP. Within Microchip's power-management-oriented portfolio, the dsPIC33FJ GS family is purpose-built for switch-mode power supplies (SMPS), digital power conversion, and motor control, where fast control loops and high-resolution PWM are essential.
Key features of this device include the 16-bit dsPIC33F core executing up to 50 MIPS, dedicated SMPS peripherals including high-resolution PWM modules with dead-time control, quadrature encoder interface (QEI) inputs, 4 DMA channels, 7 timers, and 2 serial I/O ports. The industrial temperature rating (-40C to +85C, suffix I) suits harsh operating environments, and the T suffix denotes tape-and-reel packaging for automated assembly.
The GS-series architecture integrates the SMPS PWM peripheral directly onto the core's internal bus, enabling sub-microsecond control-loop latency in peak-current-mode and voltage-mode converters. Fast ADC sampling synchronized to the PWM reduces jitter and improves transient response in digitally controlled power stages.
Typical applications include interleaved power factor correction (PFC) - as demonstrated by Microchip's 350W Interleaved PFC reference design - LLC and half-bridge converters, digital LED drivers, and BLDC/PMSM motor control. The QEI peripheral and PWM channels make it a natural fit for servo and traction drives.
Design consideration: place the ICSP (PGECx/PGEDx) traces as short as possible per Microchip's programming guidelines, and budget flash headroom - 64KB is sufficient for most control laws but tight for designs adding communication stacks and bootloaders.
This page synthesizes distributor data, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet. Pricing shown is as of 2026-09-27.
Drop-in alternatives for DSPIC33FJ64GS406T-50I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ64GS406T-50I/MR (same form factor and footprint) — differing in RAM, Core, Operating Temperature, Package, Packaging.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ64GS406-E/MR
✅ Drop-In✓ In Stock
$4.02 / Unit
View Datasheet →DSPIC33FJ64GS406-50I/MR
✅ Drop-In✓ In Stock
$4.45 / Unit
View Datasheet →DSPIC33FJ32GS406-50I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.44 / Unit
View Datasheet →DSPIC33FJ16GS406-50I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ64GS606-50I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.6 / Unit
View Datasheet →DSPIC33FJ64GS406T-50I/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33F 16-bit |
| Product Type | Digital Signal Controller (DSC) |
| Maximum Clock / Performance | 50 MIPS |
| Program Memory (FLASH) | 64KB (64K x 8) |
| RAM | 8KB |
| DMA Channels | 4 |
| Timers | 7 |
| Serial I/O Ports | 2 |
| Special Peripherals | SMPS PWM, QEI |
| Package | 64-VQFN (9x9 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Programming Interface | ICSP via PGECx/PGEDx pins |
| Packaging | Tape & Reel (T suffix) |
| Factory Pack Quantity | 40 |
| RoHS Status | Compliant |
DSPIC33FJ64GS406T-50I/MR 64-vqfn (9x9 mm) Pin Configuration Guide
Pin configuration for DSPIC33FJ64GS406T-50I/MR (64-vqfn (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ64GS406T-50I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ64GS406T-50I/MR is suitable for 6 applications: Interleaved Power Factor Correction, Digital LED Driver Power Supplies, BLDC / PMSM Motor Control, DC-DC Converter Control (LLC, Half-Bridge, Buck), Solar Micro-Inverters and Power Optimizers, Embedded Control with ICSP Field Updates.
Interleaved Power Factor Correction
The DSPIC33FJ64GS406T-50I/MR is purpose-built for digitally controlled PFC stages: its dedicated SMPS PWM peripherals with high-resolution control and fast ADC synchronization deliver the sub-microsecond loop latency needed for interleaved boost converters. Microchip's own 350W Interleaved PFC reference design uses the dsPIC33FJ64GS406 with universal AC input to produce a regulated high-voltage DC output, validating the device in this exact topology. In a typical design, the controller samples the input current and bus voltage each PWM cycle, computes the duty command in peak-current-mode control, and drives two interleaved phases with programmable phase offset to cancel input ripple. The 50 MIPS core executes the compensation law with ample margin for housekeeping tasks such as inrush control and fault protection, while the 64KB flash accommodates the control firmware, nonvolatile parameters, and a communication interface.
Recommended
Digital LED Driver Power Supplies
Digital LED drivers benefit from the GS-family's high-resolution PWM, which enables precise dimming resolution and tightly regulated LED current across line and load variations. The DSPIC33FJ64GS406T-50I/MR controls flyback, buck, or boost LED stages using its SMPS-oriented peripherals, sampling current via the fast ADC synchronized to the PWM to minimize jitter-induced output ripple. Because the control law lives in firmware, dimming curves, thermal derating, and multi-channel sequencing can be changed without hardware redesign - a key advantage over analog LED driver ICs. The 50 MIPS core handles the power-control loop plus DALI/DMX-style communication concurrently, and the industrial -40C to +85C rating suits enclosed luminaires. The extended-temperature DSPIC33FJ64GS406-E/MR drop-in is recommended when the driver enclosure pushes ambient above 85C.
Recommended
BLDC / PMSM Motor Control
The DSPIC33FJ64GS406T-50I/MR fits brushless DC and permanent-magnet synchronous motor control through its quadrature encoder interface (QEI) for position feedback and its PWM modules for three-phase inverter drive with dead-time control. The 16-bit DSP core executes field-oriented control (FOC) mathematics at 50 MIPS, supporting fast current loops that improve torque ripple and efficiency compared to trapezoidal control on slower MCUs. The fast ADC is triggered by the PWM to sample phase currents at the optimal point in each switching period, reducing measurement noise. Four DMA channels offload data movement, freeing CPU cycles for the control algorithm. The industrial temperature rating and 64-pin QFN footprint suit compact servo drives, pumps, fans, and traction applications; the QEI input accepts incremental encoders directly without an external decoder.
Recommended
DC-DC Converter Control (LLC, Half-Bridge, Buck)
Isolated and non-isolated DC-DC topologies such as LLC resonant converters, half-bridges, and synchronous bucks are core applications for the GS-series SMPS DSC. The DSPIC33FJ64GS406T-50I/MR generates complementary PWM pairs with programmable dead time, and its firmware-based control enables adaptive frequency modulation for LLC burst mode and light-load efficiency schemes that fixed-function controllers cannot offer. The 50 MIPS core with DSP multiply-accumulate support executes the compensator each switching cycle, and synchronized ADC sampling keeps loop delay low for good transient response. With 64KB of flash, designers can implement the control law plus startup sequencing, fault handling (overcurrent, overvoltage), PMBus/I2C telemetry, and a bootloader with headroom. XAIPART lists same-footprint flash variants to optimize memory versus cost in this application.
Recommended
Solar Micro-Inverters and Power Optimizers
Panel-level power electronics such as micro-inverters and optimizers demand fast, precise digital control in a compact, thermally constrained package - requirements the DSPIC33FJ64GS406T-50I/MR meets with its integrated SMPS PWM, synchronized ADC, and 50 MIPS DSP core. MPPT algorithms run continuously on the core while the PWM peripherals handle the high-frequency power stage with hardware dead-time insertion, and the four DMA channels stream telemetry without CPU intervention. Firmware control allows the MPPT strategy and grid-interaction behavior to be tuned or updated in the field via the flash memory's self-programming capability. The industrial temperature rating covers rooftop environments, and the extended-temperature DSPIC33FJ64GS406-E/MR drop-in is available for designs with junction environments approaching +125C, using the identical 64-pin QFN footprint.
Recommended
Embedded Control with ICSP Field Updates
General embedded control designs that require in-field firmware updates benefit from the device's In-Circuit Serial Programming (ICSP) interface on the PGECx/PGEDx pins, which allows reprogramming the 64KB flash without removing the part from the board. According to the Microchip family datasheet, keeping ICSP trace lengths short preserves programming reliability, a layout constraint that should be planned at PCB design time. The 50 MIPS core, 7 timers, 2 serial ports, and 4 DMA channels provide ample general-purpose embedded control capability for instrumentation, building automation, and industrial monitoring nodes, while the SMPS PWM peripherals double as high-resolution arbitrary PWM generators for heater, valve, or actuator control. The 64-pin QFN offers enough GPIO for display, keypad, and sensor interfaces in a 9x9 mm footprint.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ64GS406T-50I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ64GS406-E/MR | DSPIC33FJ64GS406-50I/MR | DSPIC33FJ32GS406-50I/MR | DSPIC33FJ64GS606-50I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 16-bit, 50 MIPS | 16-bit, 50 MIPS | 16-bit, 50 MIPS | 16-bit, 50 MIPS | 16-bit, 50 MIPS |
| Program Memory (Flash) | 64KB | 64KB | 64KB | 32KB | 64KB |
| RAM | 8KB | 8KB | 8KB | 8KB | 8KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| DMA Channels / Timers | 4 DMA / 7 timers | 4 DMA / 7 timers | 4 DMA / 7 timers | 4 DMA / 7 timers | 4 DMA / 7 timers |
Key Differentiators
- Extended temperature availability on the same footprint (vs DSPIC33FJ64GS406-E/MR)
- SMPS-dedicated peripherals vs general-purpose dsPIC33F (vs DSPIC33FJ64GP206T-I/PT)
- Flash headroom for bootloader plus control firmware (vs DSPIC33FJ32GS406-50I/MR)
Design Notes
Route the ICSP programming traces (PGECx/PGEDx) as short and direct as possible from the programming connector to the device pins. Microchip's family datasheet (70000591f) explicitly recommends minimizing trace length between the ICSP connector and the ICSP pins to preserve programming and debugging reliability. Reserve a standard 5-pin or 6-pin programming header footprint on production boards even if programming is done via bed-of-nails, and avoid loading PGEC/PGED lines with large pull-downs or capacitors that slow edges during ICSP.
Estimated: the 64-pin VQFN (9x9) is thermally manageable for digital power designs, but verify total power dissipation by summing core current at 50 MIPS plus I/O and PWM driver currents from the datasheet electrical characteristics tables, then multiply by the supply voltage. Provide a solid ground plane under the QFN and tie any exposed pad (per the datasheet's package drawing) to ground with an array of vias to reduce thermal resistance and ground bounce. Decouple each VDD pin with 0.1uF ceramics placed within 2 mm of the pin, plus one bulk 4.7uF-10uF capacitor per supply rail.
For SMPS designs, synchronize ADC sampling to the PWM period using the peripheral's trigger features rather than free-running the ADC; sampling mid-off-time in peak-current-mode or at counter-zero in voltage-mode eliminates switching-noise pickup in current measurements. Keep PWM output traces away from analog sense lines and route the analog reference (VREF+/AVSS) as a Kelvin connection to the measurement point. The 4 DMA channels should handle telemetry and logged data so the CPU never stalls the control loop with data-movement instructions.
The 64KB flash is shared with any bootloader, self-programming routines, and EEPROM emulation. Budget flash before selecting a flash-down variant: code that links in 40KB cannot migrate to the 32KB DSPIC33FJ32GS406 even though it is pin-to-pin identical. Also note that PGEC/PGED pins are multiplexed with general-purpose I/O - if firmware drives them as outputs during programming attempts, ICSP can fail; keep any attached circuitry high-impedance on these pins or gate it with the MCLR state.
Compliance Information
RoHS compliance noted in distributor data (digchip listing). REACH, halogen-free, and conflict-minerals declarations not stated in provided web data.
