DSPIC33FJ64MC804T-I/ML - 16-bit 40MIPS DSC 64KB | Microchip
MPN: DSPIC33FJ64MC804T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.08 | $50.80 |
| 100 | $4.35 | $435.00 |
| 500 | $3.92 | $1,960.00 |
| 1,000 | $3.55 | $3,550.00 |
DSPIC33FJ64MC804T-I/ML Overview
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and ease of use of a microcontroller, sitting in the product hierarchy between a general-purpose MCU and a dedicated DSP. The dsPIC33F family implements a modified Harvard, 16-bit RISC architecture with DSP instructions, making it a staple of the power management IC ecosystem for embedded control systems.
Key features include 40 MIPS execution at 3.3V, dual program and data buses supporting simultaneous fetch and multiply-accumulate operations, 8 DMA channels for peripheral-to-memory transfers without CPU intervention, and 5 timers for motor-control and power-conversion timing. Peripheral integration covers the motor-control-oriented set expected of the MC family: high-speed PWM, ADC with simultaneous multi-channel sampling, and serial interfaces for industrial communication.
The MC804 variant is purpose-built for high-speed repetitive computation. Its architecture provides hardware multiply, divide, and barrel shifter support, plus modulo and bit-reversed addressing modes that accelerate FIR filters and PID loops. According to Microchip, the dsPIC33F family is pin compatible with the PIC24HJ family and shares a high degree of compatibility with dsPIC30F devices, enabling seamless migration paths.
Typical applications include precision motor control (BLDC, PMSM, stepper), digital power supplies and PFC stages, sensorless FOC drives, and industrial automation nodes where deterministic 16-bit control loops must run at tens of kHz. The 44-QFN exposed-pad package improves thermal and grounding performance for power electronics layouts.
Design consideration: the 3V to 3.6V operating window requires a clean 3.3V rail; the exposed pad must be soldered to a ground pour for thermal and signal-integrity reasons, and the DSC needs a proper decoupling network plus MCLR pull-up for reliable in-circuit programming (ICSP).
This page synthesizes distributor listings, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-27.
Drop-in alternatives for DSPIC33FJ64MC804T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ64MC804T-I/ML (same form factor and footprint) — differing in Operating Temperature, Core Architecture, I/O Ports, Package, Flash Program Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ64MC804T-H/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ32MC204-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.37 / Unit
View Datasheet →DSPIC33FJ32MC204-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.85 / Unit
View Datasheet →DSPIC33FJ64MC804T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33F RISC (DSP-enhanced) |
| Maximum CPU Speed | 40 MIPS (40 MHz FCY) |
| Program Memory | 64 KB (64K x 8) Flash |
| Supply Voltage Range | 3 V to 3.6 V |
| Package | 44-QFN (8x8 mm) with exposed pad |
| Mounting Type | Surface Mount |
| I/O Ports | 69 I/O (family-level, per datasheet listing) |
| DMA Channels | 8 |
| Timers | 5 |
| Serial I/O Ports | 2 |
| Operating Temperature | -40C to +85C (I grade) |
| Life Cycle Stage | Active |
| Packing | Tape and Reel (T suffix) |
| Technology | CMOS |
| RoHS / Lead Free | Lead-free per digchip package listing |
| Family Compatibility | Pin compatible with PIC24HJ; high compatibility with dsPIC30F |
DSPIC33FJ64MC804T-I/ML 44-qfn (8x8 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33FJ64MC804T-I/ML (44-qfn (8x8 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ64MC804T-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ64MC804T-I/ML is suitable for 6 applications: BLDC / PMSM Precision Motor Control, Digital Power Supplies and PFC, Industrial Automation and Sensing Nodes, Sensorless Control with Advanced Estimators, Embedded Signal Processing and Filtering, Robotics and Servo Drives.
BLDC / PMSM Precision Motor Control
The DSPIC33FJ64MC804T-I/ML was positioned by Microchip as a 16-bit DSC for precision motor control, and its parameter set aligns directly with BLDC and PMSM field-oriented control requirements. The 40 MIPS core executes Park/Clarke transforms, PI current loops, and observer-based position estimation in single-cycle MAC operations, sustaining 20 kHz control-loop rates with headroom. The 8 DMA channels move ADC phase-current samples to RAM without CPU intervention, reducing loop jitter. Place the DSC between the current-shunt conditioning op-amps and the gate-driver inputs; the ADC triggers from the PWM center point to sample currents at zero-vector instants, eliminating switching-noise artifacts. Its 3-3.6V digital domain separates cleanly from the 12-48V power stage via the gate driver, and the 64KB Flash holds FOC firmware plus communication stacks with room for OTA growth.
Recommended
Digital Power Supplies and PFC
In digital switch-mode power supplies, AC-DC PFC stages, and LLC resonant converters, the DSPIC33FJ64MC804T-I/ML provides the deterministic timing needed for voltage-mode and current-mode control. The 40 MIPS throughput supports control-loop update rates well above 100 kHz for PFC, and DSP instructions execute the compensation-filter arithmetic with single-cycle MACs. High-resolution PWM generation with edge dead-time control drives the half-bridge MOSFET pair safely, while 5 timers coordinate soft-start, burst mode, and fault blanking. The DSC sits between the output-voltage sense divider and the gate-driver PWM inputs; firmware-based control eliminates analog compensation drift across temperature. Choose the -I grade for ventilated power supplies or the -H grade (+125C) when mounted near hot power components such as PFC inductors and primary-side MOSFETs.
Recommended
Industrial Automation and Sensing Nodes
For factory automation nodes - encoders, actuators, process transmitters - the DSPIC33FJ64MC804T-I/ML combines 16-bit signal processing with the serial interfaces needed on industrial buses. Its 40 MIPS core runs sensor-linearization filters and FFT-based vibration diagnostics locally, while 2 serial I/O ports support RS-485/Modbus or CAN transceiver attachments through the peripheral set. The 8 DMA channels sustain continuous ADC streaming from multi-channel analog inputs without CPU loading, enabling oversampled, noise-filtered measurement chains. The -40C to +85C industrial grade covers unconditioned cabinet environments, and the 44-QFN (8x8) exposed-pad package keeps the board compact. Place a 3.3V LDO or DC-DC upstream of the 3-3.6V supply pin, with isolated interfaces between the controller ground domain and field wiring for robustness.
Recommended
Sensorless Control with Advanced Estimators
Sensorless PMSM and induction drives replace position sensors with software observers (SMO, MRAS, sliding-mode, or high-frequency injection), and the DSPIC33FJ64MC804T-I/ML has the compute profile these estimators demand: 40 MIPS, hardware MAC, and bit-reversed/modulo addressing for filter and FFT kernels. The 64KB Flash accommodates both the estimator math and the full FOC pipeline plus startup routines without external memory. ADC triggering synchronized to PWM minimizes estimator error from current-sample noise, and the DMA engine buffers phase currents into circular buffers at fixed sample instants. Typical implementation: a 10-20 kHz current loop nested inside a 1 kHz speed loop, with the observer executing every PWM cycle. The result is a drive with no encoder, reduced BOM cost, and improved reliability in sealed motor assemblies.
Recommended
Embedded Signal Processing and Filtering
Applications requiring moderate DSP throughput - active noise cancellation inputs, vibration monitoring, ultrasonic processing, biopotential front ends - fit the DSPIC33FJ64MC804T-I/ML as a single-chip solution combining acquisition and computation. Its DSP-enhanced 16-bit core executes FIR/IIR filters at 40 MIPS, sufficient for multiple cascaded filter stages at audio-band sample rates, and the integrated ADC with DMA handles continuous sampling into ping-pong buffers. Compared to a separate MCU-plus-DSP two-chip design, the single-chip DSC reduces board area, BOM count, and inter-chip latency, with 64KB Flash storing coefficients, firmware, and calibration data. Keep analog grounds clean via the exposed-pad ground pour and separate AVDD filtering to preserve ADC accuracy; a 0.1uF capacitor at the analog supply pin with a ferrite from the digital rail is the standard arrangement.
Recommended
Robotics and Servo Drives
Robot joint servo drives require tight, multi-axis coordinated current loops with fast communication, and the DSPIC33FJ64MC804T-I/ML serves as a per-axis controller in such architectures. The 40 MIPS core runs 20 kHz FOC current loops per joint while the 2 serial I/O ports connect to command buses (RS-485/CAN via transceiver), and 5 timers coordinate PWM, dead-time, and safety watchdog functions. Trajectory interpolation, encoder interpolation, and torque ripple compensation all execute within the 64KB Flash footprint. The -40C to +85C grade tolerates actuator-housing temperatures, and the compact 44-QFN (8x8 mm) EP package suits dense multi-axis driver boards where each joint PCB must be small. Supply the DSC from a local 3.3V regulator with the exposed pad stitched to the servo-drive ground plane for clean ADC references.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ64MC804T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ64MC804T-H/ML | DSPIC33FJ32MC204-I/ML | DSPIC33FJ32MC204-E/ML |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) EP | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 64 KB | 64 KB | 32 KB | 32 KB |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (H grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Drop-in on 44-QFN PCB | Reference footprint | Yes - identical die and footprint | Yes - pin-to-pin, verify 32KB Flash fit | Yes - pin-to-pin, verify 32KB Flash fit |
Key Differentiators
- Largest Flash in same 44-QFN MC804 footprint (vs DSPIC33FJ32MC204-I/ML)
- Same silicon available at +125C (vs DSPIC33FJ64MC804T-H/ML)
- DSP-enhanced 16-bit core vs general-purpose MCUs (vs PIC18F27K42-I/ML)
Design Notes
Solder the 44-QFN exposed pad to a via-stitched ground pour on the top layer. On this 8x8 mm QFN the exposed pad is the principal ground return for the digital core and the thermal path; leaving it floating or using an insufficient stencil aperture causes intermittent ground-bounce faults and elevated junction temperature. Use an array of 3x3 or more vias (0.3 mm drill) under the pad to tie into internal ground planes, following Microchip's QFN PCB layout guidance in the family reference manual.
The DSPIC33FJ64MC804T-I/ML operates from 3V to 3.6V and is commonly driven from a 3.3V LDO or buck regulator. Place 0.1uF ceramic decoupling capacitors at every VDD/VDDCORE pin pair within 2 mm of the pin, plus one 4.7-10uF bulk capacitor near the device. If the board also carries a switching power stage, add a ferrite bead or PI filter on the DSC supply so PWM switching ripple does not appear on the ADC reference and cause current-loop measurement noise.
Do not confuse package suffixes: DSPIC33FJ64MC804T-I/PT is the same silicon in TQFP-44, which cannot be soldered to a QFN land pattern; DSPIC33FJ64MC802 family members use different pin counts. Also verify the MCLR pin has a 10k pull-up and is routed to the ICSP connector for in-circuit programming - leaving MCLR floating produces random resets. Confirm configuration bits (oscillator source, watchdog, code protection) in the .c file rather than relying on IDE defaults.
Route the PWM outputs to gate drivers with short, matched traces and place a small series resistor (10-22 ohm, estimated value - tune on the bench) at each gate-driver input to damp ringing. Keep phase-current sense lines routed as a differential pair away from switch nodes, and sample via the synchronized ADC trigger rather than free-running conversions to reject switching transients. Tie analog ground to digital ground at a single star point beneath the exposed pad.
Compliance Information
Package specification from digchip explicitly states 'lead free, plastic'. RoHS compliance inferred from current Microchip lead-free ordering code; REACH/halogen-free/conflict-minerals declarations not present in provided data.