EP1AGX50CF484I6N - 3.125 Gbps, 50K FPGA | Altera
MPN: EP1AGX50CF484I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $504.158 | $504.16 |
| 10 | $504.158 | $5,041.58 |
| 100 | $504.158 | $50,415.80 |
| 500 | $504.158 | $252,079.00 |
| 1,000 | $504.158 | $504,158.00 |
Drop-in alternatives for EP1AGX50CF484I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1AGX50CF484I6N Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Arria GX |
| Programmable Logic Capacity | 2,475,072 bits |
| Number of Configurable Logic Blocks | 50,160 |
| Number of LABs | 2,508 |
| Number of User I/O | 229 |
| Maximum Serial Transceiver Data Rate | 3.125 Gbps |
| Package | 484-BBGA, FCBGA |
| Terminal Count | 484 |
| Package Body Width | 23 mm |
| Package Body Length | 23 mm |
| Terminal Pitch | 1 mm |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| Lead-Free | Yes |
| Core Clock | 640 MHz |
| Configuration Status | Not Verified |
| Product Status | Obsolete |
| Mounting Type | Surface Mount |
EP1AGX50CF484I6N 23 mm Pin Configuration Guide
Complete pinout information for EP1AGX50CF484I6N (23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50CF484I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50CF484I6N is suitable for 6 applications: Communications Equipment, Industrial Imaging and Video Processing, Test and Measurement Systems, Embedded Control Platforms, High-Speed Data Acquisition, Industrial Networking and Control.
Communications Equipment
EP1AGX50CF484I6N fits communications equipment that needs programmable parallel processing alongside serial links rated up to 3.125 Gbps. The FPGA can implement framing, packet handling, buffering, protocol adaptation, and control functions, while the 229 I/O provide access to external memory, management devices, and board-level data paths. Its 484-BBGA package concentrates those resources in a 23 mm by 23 mm footprint, but the 1 mm pitch requires controlled PCB escape routing, impedance planning, and thorough signal-integrity verification. The industrial temperature-grade designation is relevant for equipment exposed to wider environmental operating conditions. Because the device is listed as obsolete, the design team should also assess the availability of supported configuration tools, qualified transceivers, and a long-term sourcing strategy before committing to a new platform.
Recommended
Industrial Imaging and Video Processing
EP1AGX50CF484I6N can serve as a programmable processing and interface hub in industrial imaging, machine vision, or video systems. The listed 2,475,072 programmable logic bits, 50,160 configurable logic blocks, and 229 I/O support sensor aggregation, frame buffering, format conversion, filtering, timing generation, and control logic. A 3.125 Gbps serial capability can provide a high-speed path between processing boards, camera modules, or backplane equipment. The 484-BBGA package provides many I/O and power connections but places significant demands on PCB layout, thermal analysis, and assembly. Designers should preserve controlled-impedance differential routes, provide low-noise power, and verify I/O-bank constraints. The obsolete lifecycle listing means production teams should validate the availability of replacement devices and ensure that a new design is not unnecessarily dependent on a constrained supply chain.
Recommended
Test and Measurement Systems
EP1AGX50CF484I6N is suitable for test and measurement systems that need deterministic hardware processing, multiple external interfaces, and high-speed data movement. The FPGA fabric can implement trigger logic, counters, filters, encoders, decoders, and protocol-specific state machines, while the serial transceivers support links up to 3.125 Gbps where appropriate. Its 229 user I/O can interface with analog-to-digital converters, digital-to-analog converters, memory, clocks, and control circuitry. The 484-terminal 1 mm-pitch BGA package helps integrate a large number of signals but requires careful power-distribution-network design, signal return continuity, and thermal evaluation. The industrial-grade ordering code is useful for equipment operating outside benign commercial conditions. Since the part is listed as obsolete, any new test platform should pair the technical decision with a documented lifecycle and obsolescence-management plan.
Recommended
Embedded Control Platforms
EP1AGX50CF484I6N can provide the programmable control and real-time processing core in an embedded platform. The 2,508 LABs and 50,160 configurable logic blocks allow designers to implement custom register maps, motor or actuator control, safety interlocks, communication bridges, and deterministic timing functions. The 229 user I/O are valuable when the controller must coordinate sensors, memory, converters, and management buses, while the 3.125 Gbps serial capability can be used for inter-board or high-speed peripheral connections. The 484-BBGA package offers high connection density but makes package-aware PCB design essential. The industrial temperature-grade classification supports designs intended for wider environmental ranges, although the exact operating limits require manufacturer documentation. Before a new production launch, confirm the obsolete status, remaining stock, configuration support, and the risk profile of the selected supplier.
Recommended
High-Speed Data Acquisition
EP1AGX50CF484I6N can coordinate acquisition, formatting, and transport in a high-speed data-acquisition system. The FPGA fabric can process parallel converter data, apply real-time filtering, manage buffers, and generate timing or trigger controls, while the 3.125 Gbps serial transceivers provide a potential path for transmitting processed data to another board or processing subsystem. The listed 229 user I/O support interfaces to converters, memories, clocks, and control devices, but the designer must verify bank availability, voltage compatibility, and pin multiplexing. The 484-BBGA, 23 mm by 23 mm package is suitable for high-density systems when the PCB can support 1 mm-pitch escape and robust power delivery. A 640 MHz core-clock listing indicates a verified summary value, not a substitute for checking the full timing specification. For new products, obsolete status should be treated as a design constraint requiring supply-chain review.
Recommended
Industrial Networking and Control
EP1AGX50CF484I6N fits industrial networking and control platforms that combine serial connectivity with deterministic programmable logic. Its Arria GX architecture supports custom packet processing, protocol conversion, traffic shaping, and control-state machines, while the 3.125 Gbps transceiver capability can connect to compatible high-speed links. The 229 I/O allow the FPGA to connect with Ethernet controllers, management processors, memory, sensors, and other industrial devices. The 484-BBGA package is dense and well suited to complex boards, but designers must plan power integrity, thermal paths, controlled-impedance routing, and assembly inspection from the earliest schematic stage. The industrial temperature-grade code is relevant to factory and automation environments, subject to confirmation of the exact operating range. Since the verified data labels the device obsolete, engineering and procurement teams should jointly review alternative family devices and the impact of availability on product support.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50CF484I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50CF484I6 | EP1AGX50CF484C6N | EP1AGX50CF484C6 | EP1AGX50CF484C5N | EP1AGX50CF484C4N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Product Status | Obsolete | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Number of LABs | 2,508 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Programmable Logic Capacity | 2,475,072 bits | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 229 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Serial Transceiver Data Rate | 3.125 Gbps | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Terminal Pitch | 1 mm | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher listed logic-resource count than the comparison candidate (vs EP1AGX20CF484C6N)
- High-speed serial capability (vs EP1AGX20CF484C6N)
- High-density 484-terminal integration (vs EP1AGX20CF484C6N)
Design Notes
Design the 484-BBGA footprint with the 1 mm ball pitch, 23 mm by 23 mm package dimensions, and the manufacturer's land-pattern recommendations. Use a controlled PCB stack-up, verify via and escape rules, and route high-speed differential pairs with continuous reference planes. The package contains 484 terminals, so an incomplete escape strategy can force a board revision. Confirm the exact land pattern and pin assignments from the official package drawing before releasing the PCB.
Build the power-distribution network from the complete FPGA power-supply requirements rather than assigning a single rail. Separate core, I/O, auxiliary, and transceiver supplies where required, and place local decoupling close to the relevant package balls. Validate regulator stability, current capability, startup sequencing, and load transients against the selected design configuration. Use the reference-design power sequence and the datasheet limits; a general FPGA decoupling rule is not a substitute for the device-specific values.
Estimate thermal performance from the actual logic utilization, toggle rate, I/O loading, transceiver activity, and board airflow because the supplied data does not provide a verified junction-temperature or thermal-resistance value. A dense 484-BBGA assembly can still be reliable when the PCB provides solid thermal paths, but a high-utilization design may require additional copper, thermal vias, airflow, or a board-level heat spreader. Perform worst-case analysis and verify the resulting temperature with the production configuration and enclosure conditions.
Do not assume that a similar Arria GX ordering code is a drop-in replacement without checking the complete part-number decoding, package drawing, pin table, transceiver resources, speed grade, temperature grade, configuration interface, and timing limits. The supplied data identifies the target as obsolete and lists nearby same-package options, but it does not provide their full electrical specifications. Treat procurement alternatives as engineering candidates until equivalence is documented, sampled, and validated on the target PCB.
Compliance Information
Lead-free is explicitly listed in the verified FindIC result. RoHS, REACH, halogen-free, and conflict-minerals statuses are not stated in the supplied data and remain unknown. AEC-Q100 is not applicable to the supplied evidence for this industrial-grade FPGA.
