EP1AGX20CF780I6N - Arria GX FPGA 20K LE 780-FBGA | Intel
MPN: EP1AGX20CF780I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $407.52 | $407.52 |
| 10 | $380 | $3,800.00 |
| 100 | $345 | $34,500.00 |
| 250 | $318 | $79,500.00 |
| 500 | $295 | $147,500.00 |
Drop-in alternatives for EP1AGX20CF780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX20CF780C6N
✅ Drop-In✓ In Stock
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View Datasheet →EP1AGX20CF780I6
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX20CF780C6
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View Datasheet →EP1AGX20CF780C5N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP1AGX35CF780I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$278.75 / Unit
View Datasheet →EP1AGX20CF780I6N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements / Cells | 21,580 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Transceivers | 4 channels, up to 3.125 Gbps |
| Maximum User I/O | 341 |
| Package | 780-pin FC-FBGA |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Lead Free | Yes |
| Mounting Type | Surface Mount (BGA) |
| Configuration | Field-Programmable Gate Array |
| RoHS Status | Compliant |
EP1AGX20CF780I6N 29 x 29 mm Pin Configuration Guide
Complete pinout information for EP1AGX20CF780I6N (29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF780I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF780I6N is suitable for 6 applications: Telecommunications Line Cards, Video Broadcast Equipment, Industrial Imaging and Machine Vision, Wireless Base Station Baseband, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP1AGX20CF780I6N is well-suited for telecom line card designs requiring integrated multi-gigabit serial connectivity. Its 4 transceivers at 3.125 Gbps natively support PCIe Gen1, Gigabit Ethernet, and Serial RapidIO protocols commonly found in ATCA/AMC backplanes. The 21,580 logic elements provide sufficient capacity for packet classification, traffic shaping, and SERDES bridging functions, while the 780-FBGA package supports the high signal count required for multi-channel baseband interfaces. Designers benefit from hard PCIe IP cores that simplify protocol compliance verification.
Recommended
Video Broadcast Equipment
Broadcast video routers, format converters, and SDI distribution amplifiers benefit from the EP1AGX20CF780I6N's SDI-capable transceivers and DSP blocks. The integrated multiplier blocks accelerate colour-space conversion and scaling operations typical in broadcast processing pipelines. The 1.2 V core and industrial temperature range enable deployment in studio equipment racks with ambient temperatures exceeding commercial spec. Combined with external DDR2 memory controllers, the device handles real-time uncompressed SDI routing across multiple feeds.
Recommended
Industrial Imaging and Machine Vision
Machine vision systems use the EP1AGX20CF780I6N to aggregate multiple Camera Link or CoaXPress channels and preprocess frames before forwarding to a host processor. The 341 user I/O pins support wide parallel sensor interfaces (LVDS, sub-LVDS, SLVS), and the transceiver channels enable CoaXPress uplink to industrial PCs. The Arria GX fabric delivers deterministic latency required for synchronised multi-camera capture in automated optical inspection (AOI) stations, while the industrial temperature grade supports factory floor deployment.
Recommended
Wireless Base Station Baseband
Wireless base-station baseband cards leverage the EP1AGX20CF780I6N for CPRI/OBSAI fronthaul serial links (1.2288 Gbps, 2.4576 Gbps, 3.072 Gbps) connecting the radio unit to the baseband unit. The hard transceivers and on-chip DSP blocks handle channel coding, rate matching, and IQ sample processing for LTE and WiMAX. The device's industrial temperature grade and lead-free packaging support outdoor cabinet deployment and RoHS compliance for carrier-grade equipment.
Recommended
Military and Aerospace Signal Processing
Defense applications such as radar front-end preprocessing, electronic warfare receivers, and secure communications use the EP1AGX20CF780I6N for high-throughput DSP and cryptographic offload. The 4 integrated transceivers handle multi-channel IF digitisation links to ADC/DAC converters, while the logic fabric implements FFT, beamforming, and encryption algorithms in parallel. Industrial temperature range supports MIL-STD-810 environment requirements when paired with conformal coating and ruggedised PCB design.
Recommended
Test and Measurement Instrumentation
High-end test instruments (BERT, protocol analysers, oscilloscopes with serial decoding) use the EP1AGX20CF780I6N to implement pattern generation, error injection, and protocol-aware triggering. The Arria GX transceivers drive and receive high-speed serial test signals (PCIe, USB 3.0, SATA, SAS) up to 3.125 Gbps, while the logic fabric implements custom protocol state machines. The 780-FBGA package supports the high pin density required for parallel acquisition memory interfaces in mid-range instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF780C6N | EP1AGX20CF780I6 | EP1AGX20CF780C6 | EP1AGX20CF780C5N | EP1AGX35CF780I6N |
|---|---|---|---|---|---|---|
| Package | 780-pin FC-FBGA (29x29 mm) | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 21,580 | 21,580 - same | 21,580 - same | 21,580 - same | 21,580 - same | ~33,000 |
| Transceivers | 4 channels, 3.125 Gbps | 4 channels, 3.125 Gbps - same | 4 channels, 3.125 Gbps - same | 4 channels, 3.125 Gbps - same | 4 channels, 3.125 Gbps - same | 8 channels, 3.125 Gbps |
| User I/O | 341 | 341 - same | 341 - same | 341 - same | 341 - same | 341 - same |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial - same |
| Speed Grade | 6 | 6 - same | 6 - same | 6 - same | 5 (slower) | 6 - same |
| Lead Free (N suffix) | Yes | Yes | No (non-N suffix) | No (non-N suffix) | Yes | Yes |
| Core Voltage | 1.2 V | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same |
Key Differentiators
- Industrial temperature grade with lead-free finish (vs EP1AGX20CF780C6N)
- Drop-in compatible across all temperature and speed grades (vs EP1AGX35CF780I6N)
- Speed grade 6 offers highest transceiver performance in family (vs EP1AGX20CF780C5N)
Design Notes
The 780-FBGA package with 1.0 mm pitch demands a minimum of 6 PCB layers with controlled impedance for transceiver channels. Use a stack-up with dedicated ground planes adjacent to high-speed signal layers, and place AC-coupling capacitors (0.01 uF to 0.1 uF) within 1 cm of each transceiver differential pair. Microvia or via-in-pad technology is strongly recommended for BGA break-out routing to maintain signal integrity on multi-gigabit links.
Estimated: With 21,580 LE at full utilisation and 4 transceivers at 3.125 Gbps, the EP1AGX20CF780I6N dissipates approximately 3-5 W typical. Industrial-grade FC-FBGA-780 packages rely on PCB copper pour for cooling - allocate at least 4 square inches of unbroken inner-plane copper connected to the package thermal balls. For sealed enclosures, derate maximum ambient by 10C to account for reduced convective cooling.
The 'N' suffix indicates lead-free (Pb-free) finish; using the non-N variant in RoHS-compliant designs is a common compliance violation. Verify the exact ordering code matches your BOM requirement before PCB assembly. Additionally, the Arria GX family is in NNRD status - confirm supply availability with the distributor before committing to new production runs.
Place configuration EEPROM (EPCS16 or compatible) within 5 cm of the FPGA DATA, DCLK, nCS, and ASDO pins to ensure reliable AS configuration mode boot. Decouple each transceiver supply pin (VCCRT, VCCT) with 0.1 uF and 10 uF capacitors placed as close as physically possible to the BGA balls. Avoid routing any high-speed signals across BGA break-out vias to minimise crosstalk.
Compliance Information
Lead-free per Altera/Intel product page (N suffix). RoHS compliant per FindIC listing. AEC-Q100 not applicable (FPGA is not an automotive-qualified discrete). REACH, halogen-free, and conflict minerals compliance not explicitly stated in verified web data.
