EPF8282ATI100-3NGZ - FLEX 8000 FPGA 78 I/O 100-TQFP | Altera
MPN: EPF8282ATI100-3NGZ β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.75 | $427.50 |
| 100 | $36.2 | $3,620.00 |
| 250 | $31.8 | $7,950.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $24.95 | $24,950.00 |
Drop-in alternatives for EPF8282ATI100-3NGZ β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet βEPF8282ATI100-3NGZ Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements / Cells | 208 |
| Logic Array Blocks (LABs) | 26 |
| Usable Gates | ~2,500 |
| User I/Os | 78 |
| Process Technology | 0.42 Β΅m CMOS |
| Configuration Memory | SRAM (volatile, requires external load) |
| Core Supply Voltage | 5 V |
| Maximum Toggle Frequency | 125 MHz |
| Package | 100-pin TQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial) |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
| Speed Grade | -3 |
EPF8282ATI100-3NGZ Pin Configuration
| Pin 1 | I/O β User I/O pin (bank 1) |
| Pin 2 | I/O β User I/O pin (bank 1) |
| Pin 3 | I/O β User I/O pin (bank 1) |
| Pin 4 | I/O β User I/O pin (bank 1) |
| Pin 5 | I/O β User I/O pin (bank 1) |
| Pin 6 | I/O β User I/O pin (bank 1) |
| Pin 7 | VCCINT β Core supply voltage (5 V) |
| Pin 8 | I/O β User I/O pin (bank 1) |
| Pin 9 | I/O β User I/O pin (bank 1) |
| Pin 10 | I/O β User I/O pin (bank 1) |
| Pin 11 | I/O β User I/O pin (bank 1) |
| Pin 12 | I/O β User I/O pin (bank 1) |
| Pin 13 | GND β Ground |
| Pin 14 | I/O β User I/O pin (bank 2) |
| Pin 15 | I/O β User I/O pin (bank 2) |
| Pin 16 | I/O β User I/O pin (bank 2) |
| Pin 17 | I/O β User I/O pin (bank 2) |
| Pin 18 | I/O β User I/O pin (bank 2) |
| Pin 19 | I/O β User I/O pin (bank 2) |
| Pin 20 | I/O β User I/O pin (bank 2) |
| Pin 21 | I/O β User I/O pin (bank 2) |
| Pin 22 | I/O β User I/O pin (bank 2) |
| Pin 23 | I/O β User I/O pin (bank 2) |
| Pin 24 | GND β Ground |
| Pin 25 | I/O β User I/O pin (bank 2) |
| Pin 26 | I/O β User I/O pin (bank 2) |
| Pin 27 | I/O β User I/O pin (bank 2) |
| Pin 28 | I/O β User I/O pin (bank 2) |
| Pin 29 | I/O β User I/O pin (bank 2) |
| Pin 30 | I/O β User I/O pin (bank 2) |
| Pin 31 | VCCINT β Core supply voltage (5 V) |
| Pin 32 | I/O β User I/O pin (bank 2) |
| Pin 33 | I/O β User I/O pin (bank 2) |
| Pin 34 | I/O β User I/O pin (bank 2) |
| Pin 35 | I/O β User I/O pin (bank 2) |
| Pin 36 | GND β Ground |
| Pin 37 | I/O β User I/O pin (bank 3) |
| Pin 38 | I/O β User I/O pin (bank 3) |
| Pin 39 | I/O β User I/O pin (bank 3) |
| Pin 40 | I/O β User I/O pin (bank 3) |
| Pin 41 | I/O β User I/O pin (bank 3) |
| Pin 42 | I/O β User I/O pin (bank 3) |
| Pin 43 | I/O β User I/O pin (bank 3) |
| Pin 44 | I/O β User I/O pin (bank 3) |
| Pin 45 | I/O β User I/O pin (bank 3) |
| Pin 46 | I/O β User I/O pin (bank 3) |
| Pin 47 | VCCINT β Core supply voltage (5 V) |
| Pin 48 | I/O β User I/O pin (bank 3) |
| Pin 49 | I/O β User I/O pin (bank 3) |
| Pin 50 | I/O β User I/O pin (bank 3) |
| Pin 51 | GND β Ground |
| Pin 52 | I/O β User I/O pin (bank 4) |
| Pin 53 | I/O β User I/O pin (bank 4) |
| Pin 54 | I/O β User I/O pin (bank 4) |
| Pin 55 | I/O β User I/O pin (bank 4) |
| Pin 56 | I/O β User I/O pin (bank 4) |
| Pin 57 | I/O β User I/O pin (bank 4) |
| Pin 58 | I/O β User I/O pin (bank 4) |
| Pin 59 | I/O β User I/O pin (bank 4) |
| Pin 60 | I/O β User I/O pin (bank 4) |
| Pin 61 | I/O β User I/O pin (bank 4) |
| Pin 62 | VCCINT β Core supply voltage (5 V) |
| Pin 63 | I/O β User I/O pin (bank 4) |
| Pin 64 | I/O β User I/O pin (bank 4) |
| Pin 65 | I/O β User I/O pin (bank 4) |
| Pin 66 | GND β Ground |
| Pin 67 | TDI β JTAG Test Data In (IEEE 1149.1) |
| Pin 68 | TMS β JTAG Test Mode Select |
| Pin 69 | TCK β JTAG Test Clock |
| Pin 70 | I/O β User I/O pin / dedicated clock input |
| Pin 71 | I/O β User I/O pin (bank 1) |
| Pin 72 | I/O β User I/O pin (bank 1) |
| Pin 73 | I/O β User I/O pin (bank 1) |
| Pin 74 | I/O β User I/O pin (bank 1) |
| Pin 75 | I/O β User I/O pin (bank 1) |
| Pin 76 | I/O β User I/O pin (bank 1) |
| Pin 77 | I/O β User I/O pin (bank 1) |
| Pin 78 | VCCINT β Core supply voltage (5 V) |
| Pin 79 | I/O β User I/O pin (bank 1) |
| Pin 80 | I/O β User I/O pin (bank 1) |
| Pin 81 | I/O β User I/O pin (bank 1) |
| Pin 82 | I/O β User I/O pin (bank 1) |
| Pin 83 | I/O β User I/O pin (bank 1) |
| Pin 84 | I/O β User I/O pin (bank 1) |
| Pin 85 | GND β Ground |
| Pin 86 | I/O β User I/O pin (bank 2) |
| Pin 87 | I/O β User I/O pin (bank 2) |
| Pin 88 | I/O β User I/O pin (bank 2) |
| Pin 89 | I/O β User I/O pin (bank 2) |
| Pin 90 | I/O β User I/O pin (bank 2) |
| Pin 91 | I/O β User I/O pin (bank 2) |
| Pin 92 | I/O β User I/O pin (bank 2) |
| Pin 93 | I/O β User I/O pin (bank 2) |
| Pin 94 | I/O β User I/O pin (bank 2) |
| Pin 95 | I/O β User I/O pin (bank 2) |
| Pin 96 | VCCINT β Core supply voltage (5 V) |
| Pin 97 | TDO β JTAG Test Data Out |
| Pin 98 | nSTATUS β Configuration status (open drain) |
| Pin 99 | nCONFIG β Configuration start input (active low) |
| Pin 100 | DCLK β Configuration clock / dedicated clock input |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8282ATI100-3NGZ is suitable for 6 applications: Industrial Glue Logic Consolidation, Legacy Peripheral / Bus Bridge, Factory Automation State Machine, Educational FPGA Platform, Test & Measurement Fixture, Avionics Legacy Subsystem Sustainment.
Industrial Glue Logic Consolidation
The EPF8282ATI100-3NGZ fits legacy industrial glue-logic consolidation where multiple discrete 74-series TTL/MSI chips can be replaced by a single re-programmable device. With 208 logic cells across 26 LABs and 78 user I/Os, it offers enough capacity to integrate address decoding, bus arbitration, and timing-control functions that previously consumed a square inch of board area. Its 5 V tolerant I/Os interface directly to older industrial buses (ISA, PC/104, VME), eliminating level shifters. The 100-TQFP package supports hand-prototyping for technicians servicing installed equipment, while the SRAM-based configuration allows on-site firmware updates via JTAG without removing the part from the board.
Recommended
Legacy Peripheral / Bus Bridge
The EPF8282ATI100-3NGZ is well matched to legacy peripheral bridge applications such as ISA-to-local-bus conversion, parallel-port expansion, and 8-bit-to-16-bit bus widening. The 78 I/Os comfortably accommodate two full 8-bit buses plus control signals, and the 125 MHz internal toggle rate allows protocol translation at standard peripheral speeds. The industrial -40 to +85 Β°C temperature grade ensures reliable operation in factory-floor enclosures without active cooling. Engineers commonly use the JTAG boundary-scan feature to test solder joints on assembled bridge boards, dramatically reducing field return rates.
Recommended
Factory Automation State Machine
In factory automation controllers, the EPF8282ATI100-3NGZ can replace discrete PLC-like relay ladder logic with a deterministic hardware state machine. Its 26 LABs each containing 8 logic cells provide ample headroom for sequencing conveyor motors, valve actuators, and safety interlocks. The 5 V supply matches legacy industrial backplanes, and the 100-TQFP package can be wave-soldered on standard FR-4 boards used in motor-control cabinets. The SRAM-based architecture enables last-minute logic revisions via JTAG during commissioning, a major advantage over hard-wired relay panels.
Recommended
Educational FPGA Platform
The EPF8282ATI100-3NGZ, despite being mature, remains a cost-effective learning platform for students studying FPGA fundamentals. The 208 logic cells are sufficient for teaching combinational logic, finite state machines, and basic soft-core processors, while the 100-TQFP package is large enough to be probed by oscilloscope clips without specialized fine-pitch tooling. The Altera/Intel MAX+PLUS II and Quartus II design software still supports the FLEX 8000 family, so students can develop real bitstreams on modern PCs. Breadboarding-friendly 5 V I/Os let beginners interface directly to LEDs, switches, and simple sensors without level translation.
Recommended
Test & Measurement Fixture
The EPF8282ATI100-3NGZ serves well as the configurable pattern-generation heart of custom test fixtures used in ATE stations and bench-top characterization rigs. Its 78 I/Os can be routed to DUT sockets, while the 125 MHz internal rate supports medium-speed serial protocols like IΒ²C, SPI, and UART emulation. The SRAM configuration allows quick test-pattern changes between device-under-test variants - simply re-load the bitstream over JTAG without removing the FPGA. Industrial temperature rating and 5 V tolerance simplify integration with legacy ATE backplanes that predate low-voltage FPGA generations.
Recommended
Avionics Legacy Subsystem Sustainment
The EPF8282ATI100-3NGZ continues to play a sustainment role in older avionics LRUs (Line Replaceable Units) where re-engineering is cost-prohibitive but where form-fit-function replacement is required. The 100-TQFP footprint, 5 V supply, and 78 I/Os match the original Avionics Standard design, and the -40 to +85 Β°C industrial temperature range satisfies cabin-electronics environments. Because the part is obsolete, sustainment programs typically stock pile inventory or use aftermarket brokers; the EPF8282ATI100-3N drop-in is preferred for new LRU builds because of its Pb-free lead finish aligned with modern aerospace environmental regulations.
Recommended
Recommended Products Summary
Engineering reference data for EPF8282ATI100-3NGZ β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8282ATI100-3N | EPF8282ATI100-3 | EPF8282ATC100-3 | EPF8282ATC100-4 | EPF8282ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 100-TQFP | 100-TQFP | 100-TQFP | 100-TQFP | 100-TQFP | 100-TQFP |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Logic Cells | 208 | 208 | 208 | 208 | 208 | 208 |
| User I/Os | 78 | 78 | 78 | 78 | 78 | 78 |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Speed Grade | -3 (~125 MHz) | -3 (~125 MHz) | -3 (~125 MHz) | -3 (~125 MHz) | -4 (~100 MHz, slower) | -2 (~150 MHz, faster) |
| Temperature Grade | Industrial (-40 to +85 Β°C) | Industrial (-40 to +85 Β°C) | Industrial (-40 to +85 Β°C) | Commercial (0 to +70 Β°C) | Commercial (0 to +70 Β°C) | Commercial (0 to +70 Β°C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible with multiple FLEX 8000 family siblings (vs EPF8282ATI100-3N)
- Faster speed grade vs -4 variant (vs EPF8282ATC100-4)
- Industrial temperature range vs commercial siblings (vs EPF8282ATC100-3)
Design Notes
The EPF8282ATI100-3NGZ requires a clean 5 V core supply on each VCCINT pin (7, 31, 47, 62, 78, 96). Place a 0.1 Β΅F ceramic decoupling capacitor within 5 mm of every VCCINT pin and a single 33 Β΅F tantalum bulk capacitor near the package. The device draws higher inrush current during configuration; ensure the 5 V regulator can supply at least 500 mA peak. Power-rail sequencing must hold the nCONFIG pin low until VCCINT is stable to avoid spurious configuration attempts.
The 100-pin TQFP has a 0.5 mm pitch, which is hand-solderable with fine-tip tools but requires careful paste-stencil design for reflow (150 Β΅m aperture is typical). Use 4-layer PCB stack-up with continuous ground plane under the device to provide low-impedance return paths for the 78 I/Os. Match length on the global clock nets (DCLK, dedicated clock inputs) within 1 mm to avoid skew; place series-termination resistors within 5 mm of the FPGA clock pins.
Do not assume the FLEX 8000 family supports modern 3.3 V LVCMOS I/O standards - the EPF8282A I/Os are 5 V TTL-compatible only. Driving 3.3 V signals directly is fine, but applying 5 V to a downstream 3.3 V device will damage it. Configuration bitstreams must be loaded from an Altera-format .sof or .pof file generated by MAX+PLUS II or Quartus II; older MAX+PLUS II version differences can render bitstreams non-portable. Finally, always verify silicon date codes - pre-2005 production batches may have mask revisions with subtle timing differences.
Because the EPF8282ATI100-3NGZ is now obsolete, design for second-source replacement: leave a footprint compatible with the MAX 10 (10M02SCE144) 144-pin TQFP option for future migration, even if the FLEX 8000 is populated initially. Route JTAG signals (TCK, TMS, TDI, TDO, nSTATUS, nCONFIG, DCLK) to a 2Γ5 0.1-inch header so the board can be re-programmed in-circuit. Avoid routing sensitive analog signals near the 78 I/O banks to minimize simultaneous-switching noise (SSN) coupling into the 5 V supply.
Compliance Information
The -NGZ suffix implies Pb-free lead finish (Altera's -N suffix notation for the FLEX 8000 family). RoHS and REACH compliance status could not be confirmed from the verified distributor data; check the Altera/Intel legacy product page or request a manufacturer certificate of compliance (CoC) for production use. AEC-Q100 qualification is not applicable for industrial-grade FPGAs in this package.
