EPF8282ATI100-3NGZ - FLEX 8000 FPGA 78 I/O 100-TQFP | Altera
Référence : EPF8282ATI100-3NGZ ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.75 | $427,50 |
| 100 | $36.2 | $3 620,00 |
| 250 | $31.8 | $7 950,00 |
| 500 | $28.4 | $14 200,00 |
| 1 000 | $24.95 | $24 950,00 |
EPF8282ATI100-3NGZ Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing matrix. The FLEX 8000 family belongs to the first-generation SRAM-based programmable logic hierarchy, sitting between simple PLDs and modern high-density FPGAs. After Altera's 2015 acquisition by Intel, the family has been formally classified as mature/obsolete; the manufacturer recommends migration to MAX 10 or Cyclone IV families for new designs.
Key features of the EPF8282ATI100-3NGZ include SRAM-based configuration (allowing in-system re-programmability), 78 general-purpose I/Os, dedicated input registers, fast continuous interconnect (FastTrack), and JTAG-compliant boundary-scan test support per IEEE 1149.1. The device is well suited to glue-logic, bus-interface bridging, and state-machine consolidation tasks that previously required multiple 74-series TTL parts.
From an architectural standpoint, the FLEX 8000 LAB combines 8 logic cells with a local interconnect that feeds the row and column FastTrack routing. Each logic cell contains a 4-input LUT, a programmable flip-flop, and dedicated carry/cascade chains. Configuration bitstream is loaded from an external EPROM or via JTAG, with the device entering user mode once all frames are loaded.
Typical applications include industrial glue logic, legacy peripheral replacement (bus bridges such as ISA-to-local bus), prototyping of medium-complexity state machines, factory automation controllers, and educational FPGA platforms. The 100-pin TQFP footprint also makes the part attractive for hand-soldered prototypes and through-hole-friendly designs where a BGA would be impractical.
When designing with this part, supply decoupling is critical: place 0.1 µF ceramic capacitors on every VCCINT/VCCIO pin and use a bulk 33 µF tantalum near the package. PCB traces carrying high-speed clocks must be length-matched and isolated from switching I/O. Because the FLEX 8000 family is now NRND/obsolete, designers should verify long-term availability before committing to new production.
This page synthesizes distributor pricing, FLEX 8000 family positioning, and migration guidance to MAX 10/Cyclone IV alternatives not all collated in a single manufacturer document.
Alternatives de remplacement direct pour EPF8282ATI100-3NGZ — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8282ATI100-3NGZ (même facteur de forme et même empreinte) — différant par Configuration Memory, Operating Temperature, Usable Gates, Process Technology, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8282ATI100-3N
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EPF8282ATI100-3
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →EPF8282ATC100-3
✅ Remplacement direct✓ En stock
$10.25 / unité
Voir la fiche technique →EPF8282ATC100-4
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EPF8282ATC100-2
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF8282ATI100-3NGZ Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Logic Elements / Cells | 208 |
| Logic Array Blocks (LABs) | 26 |
| Usable Gates | ~2,500 |
| User I/Os | 78 |
| Process Technology | 0.42 µm CMOS |
| Configuration Memory | SRAM (volatile, requires external load) |
| Core Supply Voltage | 5 V |
| Maximum Toggle Frequency | 125 MHz |
| Boîtier | 100-pin TQFP |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
| Speed Grade | -3 |
Configuration des broches de EPF8282ATI100-3NGZ
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCINT — Core supply voltage (5 V) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | GND — Ground |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | VCCINT — Core supply voltage (5 V) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | VCCINT — Core supply voltage (5 V) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | VCCINT — Core supply voltage (5 V) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | GND — Ground |
| Broche 67 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche 68 | TMS — JTAG Test Mode Select |
| Broche 69 | TCK — JTAG Test Clock |
| Broche 70 | I/O — User I/O pin / dedicated clock input |
| Broche 71 | I/O — User I/O pin (bank 1) |
| Broche 72 | I/O — User I/O pin (bank 1) |
| Broche 73 | I/O — User I/O pin (bank 1) |
| Broche 74 | I/O — User I/O pin (bank 1) |
| Broche 75 | I/O — User I/O pin (bank 1) |
| Broche 76 | I/O — User I/O pin (bank 1) |
| Broche 77 | I/O — User I/O pin (bank 1) |
| Broche 78 | VCCINT — Core supply voltage (5 V) |
| Broche 79 | I/O — User I/O pin (bank 1) |
| Broche 80 | I/O — User I/O pin (bank 1) |
| Broche 81 | I/O — User I/O pin (bank 1) |
| Broche 82 | I/O — User I/O pin (bank 1) |
| Broche 83 | I/O — User I/O pin (bank 1) |
| Broche 84 | I/O — User I/O pin (bank 1) |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O pin (bank 2) |
| Broche 87 | I/O — User I/O pin (bank 2) |
| Broche 88 | I/O — User I/O pin (bank 2) |
| Broche 89 | I/O — User I/O pin (bank 2) |
| Broche 90 | I/O — User I/O pin (bank 2) |
| Broche 91 | I/O — User I/O pin (bank 2) |
| Broche 92 | I/O — User I/O pin (bank 2) |
| Broche 93 | I/O — User I/O pin (bank 2) |
| Broche 94 | I/O — User I/O pin (bank 2) |
| Broche 95 | I/O — User I/O pin (bank 2) |
| Broche 96 | VCCINT — Core supply voltage (5 V) |
| Broche 97 | TDO — JTAG Test Data Out |
| Broche 98 | nSTATUS — Configuration status (open drain) |
| Broche 99 | nCONFIG — Configuration start input (active low) |
| Broche 100 | DCLK — Configuration clock / dedicated clock input |
Applications typiques
EPF8282ATI100-3NGZ convient pour 6 applications: Industrial Glue Logic Consolidation, Legacy Peripheral / Bus Bridge, Factory Automation State Machine, Educational FPGA Platform, Test & Measurement Fixture, Avionics Legacy Subsystem Sustainment.
Industrial Glue Logic Consolidation
The EPF8282ATI100-3NGZ fits legacy industrial glue-logic consolidation where multiple discrete 74-series TTL/MSI chips can be replaced by a single re-programmable device. With 208 logic cells across 26 LABs and 78 user I/Os, it offers enough capacity to integrate address decoding, bus arbitration, and timing-control functions that previously consumed a square inch of board area. Its 5 V tolerant I/Os interface directly to older industrial buses (ISA, PC/104, VME), eliminating level shifters. The 100-TQFP package supports hand-prototyping for technicians servicing installed equipment, while the SRAM-based configuration allows on-site firmware updates via JTAG without removing the part from the board.
Recommandé
Legacy Peripheral / Bus Bridge
The EPF8282ATI100-3NGZ is well matched to legacy peripheral bridge applications such as ISA-to-local-bus conversion, parallel-port expansion, and 8-bit-to-16-bit bus widening. The 78 I/Os comfortably accommodate two full 8-bit buses plus control signals, and the 125 MHz internal toggle rate allows protocol translation at standard peripheral speeds. The industrial -40 to +85 °C temperature grade ensures reliable operation in factory-floor enclosures without active cooling. Engineers commonly use the JTAG boundary-scan feature to test solder joints on assembled bridge boards, dramatically reducing field return rates.
Recommandé
Factory Automation State Machine
In factory automation controllers, the EPF8282ATI100-3NGZ can replace discrete PLC-like relay ladder logic with a deterministic hardware state machine. Its 26 LABs each containing 8 logic cells provide ample headroom for sequencing conveyor motors, valve actuators, and safety interlocks. The 5 V supply matches legacy industrial backplanes, and the 100-TQFP package can be wave-soldered on standard FR-4 boards used in motor-control cabinets. The SRAM-based architecture enables last-minute logic revisions via JTAG during commissioning, a major advantage over hard-wired relay panels.
Recommandé
Educational FPGA Platform
The EPF8282ATI100-3NGZ, despite being mature, remains a cost-effective learning platform for students studying FPGA fundamentals. The 208 logic cells are sufficient for teaching combinational logic, finite state machines, and basic soft-core processors, while the 100-TQFP package is large enough to be probed by oscilloscope clips without specialized fine-pitch tooling. The Altera/Intel MAX+PLUS II and Quartus II design software still supports the FLEX 8000 family, so students can develop real bitstreams on modern PCs. Breadboarding-friendly 5 V I/Os let beginners interface directly to LEDs, switches, and simple sensors without level translation.
Recommandé
Test & Measurement Fixture
The EPF8282ATI100-3NGZ serves well as the configurable pattern-generation heart of custom test fixtures used in ATE stations and bench-top characterization rigs. Its 78 I/Os can be routed to DUT sockets, while the 125 MHz internal rate supports medium-speed serial protocols like I²C, SPI, and UART emulation. The SRAM configuration allows quick test-pattern changes between device-under-test variants - simply re-load the bitstream over JTAG without removing the FPGA. Industrial temperature rating and 5 V tolerance simplify integration with legacy ATE backplanes that predate low-voltage FPGA generations.
Recommandé
Avionics Legacy Subsystem Sustainment
The EPF8282ATI100-3NGZ continues to play a sustainment role in older avionics LRUs (Line Replaceable Units) where re-engineering is cost-prohibitive but where form-fit-function replacement is required. The 100-TQFP footprint, 5 V supply, and 78 I/Os match the original Avionics Standard design, and the -40 to +85 °C industrial temperature range satisfies cabin-electronics environments. Because the part is obsolete, sustainment programs typically stock pile inventory or use aftermarket brokers; the EPF8282ATI100-3N drop-in is preferred for new LRU builds because of its Pb-free lead finish aligned with modern aerospace environmental regulations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8282ATI100-3NGZ — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8282ATI100-3N | EPF8282ATI100-3 | EPF8282ATC100-3 | EPF8282ATC100-4 | EPF8282ATC100-2 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 100-TQFP | 100-TQFP | 100-TQFP | 100-TQFP | 100-TQFP | 100-TQFP |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Logic Cells | 208 | 208 | 208 | 208 | 208 | 208 |
| User I/Os | 78 | 78 | 78 | 78 | 78 | 78 |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Speed Grade | -3 (~125 MHz) | -3 (~125 MHz) | -3 (~125 MHz) | -3 (~125 MHz) | -4 (~100 MHz, slower) | -2 (~150 MHz, faster) |
| Temperature Grade | Industrial (-40 to +85 °C) | Industrial (-40 to +85 °C) | Industrial (-40 to +85 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Pin-compatible with multiple FLEX 8000 family siblings (vs EPF8282ATI100-3N)
- Faster speed grade vs -4 variant (vs EPF8282ATC100-4)
- Industrial temperature range vs commercial siblings (vs EPF8282ATC100-3)
Notes de conception
The EPF8282ATI100-3NGZ requires a clean 5 V core supply on each VCCINT pin (7, 31, 47, 62, 78, 96). Place a 0.1 µF ceramic decoupling capacitor within 5 mm of every VCCINT pin and a single 33 µF tantalum bulk capacitor near the package. The device draws higher inrush current during configuration; ensure the 5 V regulator can supply at least 500 mA peak. Power-rail sequencing must hold the nCONFIG pin low until VCCINT is stable to avoid spurious configuration attempts.
The 100-pin TQFP has a 0.5 mm pitch, which is hand-solderable with fine-tip tools but requires careful paste-stencil design for reflow (150 µm aperture is typical). Use 4-layer PCB stack-up with continuous ground plane under the device to provide low-impedance return paths for the 78 I/Os. Match length on the global clock nets (DCLK, dedicated clock inputs) within 1 mm to avoid skew; place series-termination resistors within 5 mm of the FPGA clock pins.
Do not assume the FLEX 8000 family supports modern 3.3 V LVCMOS I/O standards - the EPF8282A I/Os are 5 V TTL-compatible only. Driving 3.3 V signals directly is fine, but applying 5 V to a downstream 3.3 V device will damage it. Configuration bitstreams must be loaded from an Altera-format .sof or .pof file generated by MAX+PLUS II or Quartus II; older MAX+PLUS II version differences can render bitstreams non-portable. Finally, always verify silicon date codes - pre-2005 production batches may have mask revisions with subtle timing differences.
Because the EPF8282ATI100-3NGZ is now obsolete, design for second-source replacement: leave a footprint compatible with the MAX 10 (10M02SCE144) 144-pin TQFP option for future migration, even if the FLEX 8000 is populated initially. Route JTAG signals (TCK, TMS, TDI, TDO, nSTATUS, nCONFIG, DCLK) to a 2×5 0.1-inch header so the board can be re-programmed in-circuit. Avoid routing sensitive analog signals near the 78 I/O banks to minimize simultaneous-switching noise (SSN) coupling into the 5 V supply.
Informations de conformité
The -NGZ suffix implies Pb-free lead finish (Altera's -N suffix notation for the FLEX 8000 family). RoHS and REACH compliance status could not be confirmed from the verified distributor data; check the Altera/Intel legacy product page or request a manufacturer certificate of compliance (CoC) for production use. AEC-Q100 qualification is not applicable for industrial-grade FPGAs in this package.