EPM7256BFC256-10 - MAX 7000B CPLD 256MC 10ns FBGA-256 | Intel
MPN: EPM7256BFC256-10 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.1 | $421.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $28.9 | $28,900.00 |
Drop-in alternatives for EPM7256BFC256-10 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM7256BFC256-10N
β Drop-Inπ Reference alternative (not in catalog)
EPM7256BFC256-7
β Drop-Inπ Reference alternative (not in catalog)
EPM7256BFC256-7N
β Drop-Inπ Reference alternative (not in catalog)
EPM7256BFC256-5N
β Drop-Inπ Reference alternative (not in catalog)
EPM7256AEFC256-7
β Drop-Inπ Reference alternative (not in catalog)
EPM7256AEFC256-5N
β Drop-Inβ In Stock
$23.1 / Unit
View Datasheet βEPM7256BFC256-10 Maximum Ratings & Electrical Characteristics
| Series | MAX 7000B |
| Programmable Type | In System Programmable |
| Number of Macrocells | 256 |
| Number of Logic Elements / Blocks | 16 Logic Array Blocks |
| Gate Count | 5000 |
| Number of I/O | 164 |
| Propagation Delay (tPD) | 10 ns |
| Maximum Operating Frequency | 94.3 MHz |
| Supply Voltage - Internal | 2.375 V to 2.625 V (core 2.5 V) |
| I/O Voltage Tolerance | 5 V tolerant |
| Package / Case | 256-FBGA (17 x 17 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +90C (commercial) |
| Configuration Memory | EEPROM (non-volatile, 100 cycles min) |
| Programming Interface | IEEE 1149.1 JTAG, in-system |
| RoHS Status | unknown |
| Lead-Free | unknown |
EPM7256BFC256-10 256-fbga (17 x 17 mm) Pin Configuration Guide
Complete pinout information for EPM7256BFC256-10 (256-fbga (17 x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM7256BFC256-10.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7256BFC256-10 is suitable for 6 applications: Bus Interface Bridging, Glue-Logic Consolidation, Industrial Control I/O Expansion, Telecom Backplane Control, Legacy Peripheral Replacement, Embedded CPU Board Hub Logic.
Bus Interface Bridging
The EPM7256BFC256-10's 164 user I/Os, 5V-tolerant I/O cells, and 10 ns tPD make it well suited for bridging legacy 5V peripheral buses to 3.3V CPU buses in industrial embedded systems. Its 256 macrocells can absorb wide multiplexers, address decoders, and wait-state generators that previously required multiple 74-series TTL parts. The 5V tolerance eliminates external level-shifters when interfacing to ISA, PC/104, or 5V PCI bus segments, while the JTAG in-system programming simplifies field firmware updates on assembled backplanes.
Recommended
Glue-Logic Consolidation
The EPM7256BFC256-10 collapses dozens of discrete 74HC/74FTTL gates, muxes, and latches onto a single 256-FBGA device, reducing board area and improving reliability in industrial controller designs. With 256 macrocells and 16 logic array blocks, the device absorbs complex address decoding, chip-select generation, and interrupt-priority encoding that previously populated several square inches of board. The EEPROM-based configuration provides instant-on deterministic timing critical for control-plane logic.
Recommended
Industrial Control I/O Expansion
In PLC and process-control backplanes, the EPM7256BFC256-10's 164 I/Os drive opto-isolated 24V industrial I/O modules while its 5V tolerance interfaces directly to legacy 5V sensor buses. The 0C to +90C commercial operating range covers most factory-floor enclosure environments. The MAX 7000B architecture's deterministic timing ensures control-loop signals propagate without place-and-route jitter, critical for hard-real-time industrial Ethernet and Profibus implementations.
Recommended
Telecom Backplane Control
The EPM7256BFC256-10 handles backplane control-plane functions in legacy telecom equipment, including clock distribution steering, hot-swap control logic, and alarm-status aggregation. The 10 ns propagation delay supports 100 MHz H.110 bus implementations common in CompactPCI and AdvancedTCA designs. The non-volatile EEPROM configuration provides instant operation at power-up with no external boot PROM, simplifying board design and reducing bill-of-materials cost.
Recommended
Legacy Peripheral Replacement
For board-repair and end-of-life system support, the EPM7256BFC256-10 directly replaces multiple obsolete 74-series TTL/MSI logic parts in legacy industrial PC, point-of-sale, and test equipment designs. The 256-FBGA footprint matches original board pads, and the 10 ns tPD preserves timing margins in replacement scenarios. This application is particularly valuable for long-lifecycle industrial, medical, and aerospace systems where original PCB layouts must be preserved.
Recommended
Embedded CPU Board Hub Logic
In PowerPC, ARM, and x86 embedded CPU boards, the EPM7256BFC256-10 implements chip-select decoders, DMA arbitration, and boot-ROM steering logic. The 256 macrocells accommodate complex state machines for PCI arbitration and SDRAM controller glue logic. The 2.5V core voltage with 5V-tolerant I/O bridges between 2.5V ASIC/FPGA cores and 3.3V/5V peripheral buses without external level-translation, simplifying PCB stack-up.
Recommended
Recommended Products Summary
Engineering reference data for EPM7256BFC256-10 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7256BFC256-10N | EPM7256BFC256-7 | EPM7256BFC256-7N | EPM7256BFC256-5N | EPM7256AEFC256-7 | EPM7256AEFC256-5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same |
| Propagation Delay (tPD) | 10 ns | 10 ns | 7 ns (-30%) | 7 ns (-30%) | 5 ns (-50%) | 7 ns (-30%) | 5 ns (-50%) |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/O | 164 | 164 | 164 | 164 | 164 | 164 | 164 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage Tolerance | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant |
| Lead-Free (RoHS) | No (standard) | Yes (Pb-free) | No (standard) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Family | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000AE | MAX 7000AE |
Key Differentiators
- Identical electrical spec with lead-free reflow profile (vs EPM7256BFC256-10N)
- 30% faster propagation delay in same package (vs EPM7256BFC256-7)
- Combined speed and RoHS advantages (vs EPM7256BFC256-7N)
- MAX 7000AE family variant (vs EPM7256AEFC256-7)
Design Notes
The 256-FBGA package at 1.0 mm ball pitch requires a 4-layer or 6-layer PCB with microvia (laser-drilled or 0.1 mm mechanical) escape routing from inner ball rows. Use a 0.4 mm pad-to-pad routing grid with 0.15 mm trace width between BGA escape vias and the inner row balls. Plan for via-in-pad or microvia-under-pad if the design uses inner balls for high-speed signals. Estimated minimum trace clearance per 1.0 mm BGA: 0.2 mm trace, 0.2 mm space. Avoid dog-bone fanout on inner rows - use buried vias or via-in-pad instead.
The EPM7256BFC256-10 requires a clean 2.5V core supply with tolerance of 2.375V-2.625V per verified distributor specifications. Use an LDO (e.g., LT1763-2.5 or TPS7A4525) or a dedicated switching regulator with output ripple under 50 mVpk-pk. The 5V-tolerant I/O cells draw their VCCIO from the 5V or 3.3V rail - never connect VCCIO to the 2.5V core rail. Place 10uF tantalum and 0.1uF ceramic decoupling on each VCC pin within 5 mm of the ball.
Do not confuse the EPM7256BFC256-10 with the EPM7256AETI100-6: the latter uses a 100-pin TQFP package with far fewer I/Os (~76 vs 164) and is NOT pin-compatible. When sourcing replacements, verify the FC256 suffix indicates the 256-FBGA package. Also, the 'N' suffix (e.g., EPM7256BFC256-10N) denotes the lead-free RoHS version - confirm reflow profile compatibility (peak 260C for Pb-free vs 235C for SnPb) before substituting.
Assign JTAG pins (TDI, TDO, TMS, TCK) to a dedicated header or test point cluster for in-system programming access. The MAX 7000B JTAG interface operates at 2.5V logic - if your programming tool outputs 3.3V JTAG, insert a level translator or use a modern USB-Blaster-compatible programmer with 2.5V support. Add a 4.7 kohm pull-up on TCK and TMS for clean boundary-scan operation.
Compliance Information
Standard EPM7256BFC256-10 (no 'N' suffix) is the SnPb (leaded) version. The EPM7256BFC256-10N variant is RoHS-compliant (lead-free). RoHS/REACH compliance status for the original part was not explicitly stated in verified data. AEC-Q100 not applicable - this is a commercial-grade logic device.
