EPM7256BFC256-10 - MAX 7000B CPLD 256MC 10ns FBGA-256 | Intel
부품 번호: EPM7256BFC256-10 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.1 | $421.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $28.9 | $28,900.00 |
EPM7256BFC256-10 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocells with a programmable interconnect fabric on a single chip. Architecturally, CPLDs sit between small FPGAs and discrete glue-logic ICs: like FPGAs they implement arbitrary combinatorial and sequential logic, but like discrete logic they provide deterministic, zero-latency propagation through an EEPROM- or flash-based configuration cell. The MAX 7000B family targets glue-logic replacement, bus-interface bridging, and power-up control in industrial, telecom, and embedded systems.
Key features of the EPM7256BFC256-10 include 256 macrocells, 16 logic array blocks, 164 user I/Os, in-system programmability via IEEE 1149.1 JTAG, and 5V-tolerant I/O. The 10 ns tPD enables 100 MHz+ state-machine decoding and address-decoding pipelines. The 2.5V core with 5V-tolerant I/Os simplifies interfacing to legacy 3.3V/5V buses without external level shifters. The -10 speed grade is the mid-tier offering between -7 (faster) and -15 (slower) in the same family.
The device uses a non-volatile EEPROM configuration cell with 100 program/erase cycles minimum, providing instant-on operation at power-up with no external boot PROM. The interconnect is a continuous, fast-path Classic architecture that delivers predictable timing without the place-and-route variability typical of SRAM-based FPGAs - a key advantage for control-plane applications where deterministic latency matters more than raw logic density.
Typical applications include bus-interface bridging (e.g., PCI-to-ISA, 8-bit to 16-bit multiplexing), glue-logic consolidation in embedded CPU boards, industrial control system I/O expansion, and legacy peripheral replacement in telecom backplanes. The wide I/O count (164) and 5V tolerance suit industrial 5V-bus designs. The JTAG in-system programmability simplifies firmware updates on assembled boards.
When designing with this part, allocate the BGA-256 footprint with proper microvia stack-up and 1.27 mm pitch escape routing. The 2.5V core requires an external LDO or switching regulator from the 3.3V rail. For new designs, consider MAX II or MAX V CPLDs for lower cost and lower power unless you specifically need the 5V-tolerant I/O of the MAX 7000B family.
This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, package-compatible drop-in alternatives, and practical design notes that are not found in the bare manufacturer datasheet.
드롭인 대체품: EPM7256BFC256-10 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM7256BFC256-10 (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Memory, I/O Voltage Tolerance, Lead-Free, Programming Interface, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM7256BFC256-10N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM7256BFC256-7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM7256BFC256-7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM7256BFC256-5N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM7256AEFC256-7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPM7256AEFC256-5N
✅ 드롭인✓ 재고 있음
$23.1 / 개
데이터시트 보기 →EPM7256BFC256-10 최대 정격 & 전기적 특성
| Series | MAX 7000B |
| Programmable Type | In System Programmable |
| Number of Macrocells | 256 |
| Number of Logic Elements / Blocks | 16 Logic Array Blocks |
| Gate Count | 5000 |
| Number of I/O | 164 |
| Propagation Delay (tPD) | 10 ns |
| Maximum Operating Frequency | 94.3 MHz |
| Supply Voltage - Internal | 2.375 V to 2.625 V (core 2.5 V) |
| I/O Voltage Tolerance | 5 V tolerant |
| 패키지 / 케이스 | 256-FBGA (17 x 17 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +90C (commercial) |
| Configuration Memory | EEPROM (non-volatile, 100 cycles min) |
| Programming Interface | IEEE 1149.1 JTAG, in-system |
| RoHS 상태 | unknown |
| Lead-Free | unknown |
EPM7256BFC256-10 256-fbga (17 x 17 mm) 핀 구성 가이드
EPM7256BFC256-10(256-fbga (17 x 17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM7256BFC256-10.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM7256BFC256-10 적합 용도: 6 애플리케이션s: Bus Interface Bridging, Glue-Logic Consolidation, Industrial Control I/O Expansion, Telecom Backplane Control, Legacy Peripheral Replacement, Embedded CPU Board Hub Logic.
Bus Interface Bridging
The EPM7256BFC256-10's 164 user I/Os, 5V-tolerant I/O cells, and 10 ns tPD make it well suited for bridging legacy 5V peripheral buses to 3.3V CPU buses in industrial embedded systems. Its 256 macrocells can absorb wide multiplexers, address decoders, and wait-state generators that previously required multiple 74-series TTL parts. The 5V tolerance eliminates external level-shifters when interfacing to ISA, PC/104, or 5V PCI bus segments, while the JTAG in-system programming simplifies field firmware updates on assembled backplanes.
추천
Glue-Logic Consolidation
The EPM7256BFC256-10 collapses dozens of discrete 74HC/74FTTL gates, muxes, and latches onto a single 256-FBGA device, reducing board area and improving reliability in industrial controller designs. With 256 macrocells and 16 logic array blocks, the device absorbs complex address decoding, chip-select generation, and interrupt-priority encoding that previously populated several square inches of board. The EEPROM-based configuration provides instant-on deterministic timing critical for control-plane logic.
추천
Industrial Control I/O Expansion
In PLC and process-control backplanes, the EPM7256BFC256-10's 164 I/Os drive opto-isolated 24V industrial I/O modules while its 5V tolerance interfaces directly to legacy 5V sensor buses. The 0C to +90C commercial operating range covers most factory-floor enclosure environments. The MAX 7000B architecture's deterministic timing ensures control-loop signals propagate without place-and-route jitter, critical for hard-real-time industrial Ethernet and Profibus implementations.
추천
Telecom Backplane Control
The EPM7256BFC256-10 handles backplane control-plane functions in legacy telecom equipment, including clock distribution steering, hot-swap control logic, and alarm-status aggregation. The 10 ns propagation delay supports 100 MHz H.110 bus implementations common in CompactPCI and AdvancedTCA designs. The non-volatile EEPROM configuration provides instant operation at power-up with no external boot PROM, simplifying board design and reducing bill-of-materials cost.
추천
Legacy Peripheral Replacement
For board-repair and end-of-life system support, the EPM7256BFC256-10 directly replaces multiple obsolete 74-series TTL/MSI logic parts in legacy industrial PC, point-of-sale, and test equipment designs. The 256-FBGA footprint matches original board pads, and the 10 ns tPD preserves timing margins in replacement scenarios. This application is particularly valuable for long-lifecycle industrial, medical, and aerospace systems where original PCB layouts must be preserved.
추천
Embedded CPU Board Hub Logic
In PowerPC, ARM, and x86 embedded CPU boards, the EPM7256BFC256-10 implements chip-select decoders, DMA arbitration, and boot-ROM steering logic. The 256 macrocells accommodate complex state machines for PCI arbitration and SDRAM controller glue logic. The 2.5V core voltage with 5V-tolerant I/O bridges between 2.5V ASIC/FPGA cores and 3.3V/5V peripheral buses without external level-translation, simplifying PCB stack-up.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM7256BFC256-10 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM7256BFC256-10N | EPM7256BFC256-7 | EPM7256BFC256-7N | EPM7256BFC256-5N | EPM7256AEFC256-7 | EPM7256AEFC256-5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same |
| Propagation Delay (tPD) | 10 ns | 10 ns | 7 ns (-30%) | 7 ns (-30%) | 5 ns (-50%) | 7 ns (-30%) | 5 ns (-50%) |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/O | 164 | 164 | 164 | 164 | 164 | 164 | 164 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage Tolerance | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant |
| Lead-Free (RoHS) | No (standard) | Yes (Pb-free) | No (standard) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Family | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000AE | MAX 7000AE |
주요 차별점
- Identical electrical spec with lead-free reflow profile (vs EPM7256BFC256-10N)
- 30% faster propagation delay in same package (vs EPM7256BFC256-7)
- Combined speed and RoHS advantages (vs EPM7256BFC256-7N)
- MAX 7000AE family variant (vs EPM7256AEFC256-7)
설계 노트
The 256-FBGA package at 1.0 mm ball pitch requires a 4-layer or 6-layer PCB with microvia (laser-drilled or 0.1 mm mechanical) escape routing from inner ball rows. Use a 0.4 mm pad-to-pad routing grid with 0.15 mm trace width between BGA escape vias and the inner row balls. Plan for via-in-pad or microvia-under-pad if the design uses inner balls for high-speed signals. Estimated minimum trace clearance per 1.0 mm BGA: 0.2 mm trace, 0.2 mm space. Avoid dog-bone fanout on inner rows - use buried vias or via-in-pad instead.
The EPM7256BFC256-10 requires a clean 2.5V core supply with tolerance of 2.375V-2.625V per verified distributor specifications. Use an LDO (e.g., LT1763-2.5 or TPS7A4525) or a dedicated switching regulator with output ripple under 50 mVpk-pk. The 5V-tolerant I/O cells draw their VCCIO from the 5V or 3.3V rail - never connect VCCIO to the 2.5V core rail. Place 10uF tantalum and 0.1uF ceramic decoupling on each VCC pin within 5 mm of the ball.
Do not confuse the EPM7256BFC256-10 with the EPM7256AETI100-6: the latter uses a 100-pin TQFP package with far fewer I/Os (~76 vs 164) and is NOT pin-compatible. When sourcing replacements, verify the FC256 suffix indicates the 256-FBGA package. Also, the 'N' suffix (e.g., EPM7256BFC256-10N) denotes the lead-free RoHS version - confirm reflow profile compatibility (peak 260C for Pb-free vs 235C for SnPb) before substituting.
Assign JTAG pins (TDI, TDO, TMS, TCK) to a dedicated header or test point cluster for in-system programming access. The MAX 7000B JTAG interface operates at 2.5V logic - if your programming tool outputs 3.3V JTAG, insert a level translator or use a modern USB-Blaster-compatible programmer with 2.5V support. Add a 4.7 kohm pull-up on TCK and TMS for clean boundary-scan operation.
규정 준수 정보
Standard EPM7256BFC256-10 (no 'N' suffix) is the SnPb (leaded) version. The EPM7256BFC256-10N variant is RoHS-compliant (lead-free). RoHS/REACH compliance status for the original part was not explicitly stated in verified data. AEC-Q100 not applicable - this is a commercial-grade logic device.
