EPM7256BFC256-10 - MAX 7000B CPLD 256MC 10ns FBGA-256 | Intel
N.º da peça: EPM7256BFC256-10 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.1 | $421,00 |
| 100 | $36.75 | $3.675,00 |
| 500 | $32.4 | $16.200,00 |
| 1.000 | $28.9 | $28.900,00 |
EPM7256BFC256-10 Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocells with a programmable interconnect fabric on a single chip. Architecturally, CPLDs sit between small FPGAs and discrete glue-logic ICs: like FPGAs they implement arbitrary combinatorial and sequential logic, but like discrete logic they provide deterministic, zero-latency propagation through an EEPROM- or flash-based configuration cell. The MAX 7000B family targets glue-logic replacement, bus-interface bridging, and power-up control in industrial, telecom, and embedded systems.
Key features of the EPM7256BFC256-10 include 256 macrocells, 16 logic array blocks, 164 user I/Os, in-system programmability via IEEE 1149.1 JTAG, and 5V-tolerant I/O. The 10 ns tPD enables 100 MHz+ state-machine decoding and address-decoding pipelines. The 2.5V core with 5V-tolerant I/Os simplifies interfacing to legacy 3.3V/5V buses without external level shifters. The -10 speed grade is the mid-tier offering between -7 (faster) and -15 (slower) in the same family.
The device uses a non-volatile EEPROM configuration cell with 100 program/erase cycles minimum, providing instant-on operation at power-up with no external boot PROM. The interconnect is a continuous, fast-path Classic architecture that delivers predictable timing without the place-and-route variability typical of SRAM-based FPGAs - a key advantage for control-plane applications where deterministic latency matters more than raw logic density.
Typical applications include bus-interface bridging (e.g., PCI-to-ISA, 8-bit to 16-bit multiplexing), glue-logic consolidation in embedded CPU boards, industrial control system I/O expansion, and legacy peripheral replacement in telecom backplanes. The wide I/O count (164) and 5V tolerance suit industrial 5V-bus designs. The JTAG in-system programmability simplifies firmware updates on assembled boards.
When designing with this part, allocate the BGA-256 footprint with proper microvia stack-up and 1.27 mm pitch escape routing. The 2.5V core requires an external LDO or switching regulator from the 3.3V rail. For new designs, consider MAX II or MAX V CPLDs for lower cost and lower power unless you specifically need the 5V-tolerant I/O of the MAX 7000B family.
This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, package-compatible drop-in alternatives, and practical design notes that are not found in the bare manufacturer datasheet.
Alternativas drop-in para EPM7256BFC256-10 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM7256BFC256-10 (mesmo formato e footprint) — diferindo em Configuration Memory, I/O Voltage Tolerance, Lead-Free, Programming Interface, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM7256BFC256-10N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256BFC256-7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256BFC256-7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256BFC256-5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256AEFC256-7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPM7256AEFC256-5N
✅ Drop-In✓ Em estoque
$23.1 / unidade
Ver ficha técnica →EPM7256BFC256-10 Classificações máximas e características elétricas
| Series | MAX 7000B |
| Programmable Type | In System Programmable |
| Number of Macrocells | 256 |
| Number of Logic Elements / Blocks | 16 Logic Array Blocks |
| Gate Count | 5000 |
| Number of I/O | 164 |
| Propagation Delay (tPD) | 10 ns |
| Maximum Operating Frequency | 94.3 MHz |
| Supply Voltage - Internal | 2.375 V to 2.625 V (core 2.5 V) |
| I/O Voltage Tolerance | 5 V tolerant |
| Encapsulamento / Caixa | 256-FBGA (17 x 17 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +90C (commercial) |
| Configuration Memory | EEPROM (non-volatile, 100 cycles min) |
| Programming Interface | IEEE 1149.1 JTAG, in-system |
| Status RoHS | unknown |
| Lead-Free | unknown |
Guia de Configuração de Pinos do EPM7256BFC256-10 256-fbga (17 x 17 mm)
Configuração de pinos para EPM7256BFC256-10 (pacote 256-fbga (17 x 17 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPM7256BFC256-10.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPM7256BFC256-10 é adequado para 6 aplicaçãos: Bus Interface Bridging, Glue-Logic Consolidation, Industrial Control I/O Expansion, Telecom Backplane Control, Legacy Peripheral Replacement, Embedded CPU Board Hub Logic.
Bus Interface Bridging
The EPM7256BFC256-10's 164 user I/Os, 5V-tolerant I/O cells, and 10 ns tPD make it well suited for bridging legacy 5V peripheral buses to 3.3V CPU buses in industrial embedded systems. Its 256 macrocells can absorb wide multiplexers, address decoders, and wait-state generators that previously required multiple 74-series TTL parts. The 5V tolerance eliminates external level-shifters when interfacing to ISA, PC/104, or 5V PCI bus segments, while the JTAG in-system programming simplifies field firmware updates on assembled backplanes.
Recomendado
Glue-Logic Consolidation
The EPM7256BFC256-10 collapses dozens of discrete 74HC/74FTTL gates, muxes, and latches onto a single 256-FBGA device, reducing board area and improving reliability in industrial controller designs. With 256 macrocells and 16 logic array blocks, the device absorbs complex address decoding, chip-select generation, and interrupt-priority encoding that previously populated several square inches of board. The EEPROM-based configuration provides instant-on deterministic timing critical for control-plane logic.
Recomendado
Industrial Control I/O Expansion
In PLC and process-control backplanes, the EPM7256BFC256-10's 164 I/Os drive opto-isolated 24V industrial I/O modules while its 5V tolerance interfaces directly to legacy 5V sensor buses. The 0C to +90C commercial operating range covers most factory-floor enclosure environments. The MAX 7000B architecture's deterministic timing ensures control-loop signals propagate without place-and-route jitter, critical for hard-real-time industrial Ethernet and Profibus implementations.
Recomendado
Telecom Backplane Control
The EPM7256BFC256-10 handles backplane control-plane functions in legacy telecom equipment, including clock distribution steering, hot-swap control logic, and alarm-status aggregation. The 10 ns propagation delay supports 100 MHz H.110 bus implementations common in CompactPCI and AdvancedTCA designs. The non-volatile EEPROM configuration provides instant operation at power-up with no external boot PROM, simplifying board design and reducing bill-of-materials cost.
Recomendado
Legacy Peripheral Replacement
For board-repair and end-of-life system support, the EPM7256BFC256-10 directly replaces multiple obsolete 74-series TTL/MSI logic parts in legacy industrial PC, point-of-sale, and test equipment designs. The 256-FBGA footprint matches original board pads, and the 10 ns tPD preserves timing margins in replacement scenarios. This application is particularly valuable for long-lifecycle industrial, medical, and aerospace systems where original PCB layouts must be preserved.
Recomendado
Embedded CPU Board Hub Logic
In PowerPC, ARM, and x86 embedded CPU boards, the EPM7256BFC256-10 implements chip-select decoders, DMA arbitration, and boot-ROM steering logic. The 256 macrocells accommodate complex state machines for PCI arbitration and SDRAM controller glue logic. The 2.5V core voltage with 5V-tolerant I/O bridges between 2.5V ASIC/FPGA cores and 3.3V/5V peripheral buses without external level-translation, simplifying PCB stack-up.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM7256BFC256-10 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM7256BFC256-10N | EPM7256BFC256-7 | EPM7256BFC256-7N | EPM7256BFC256-5N | EPM7256AEFC256-7 | EPM7256AEFC256-5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same | 256-FBGA (17x17) - same |
| Propagation Delay (tPD) | 10 ns | 10 ns | 7 ns (-30%) | 7 ns (-30%) | 5 ns (-50%) | 7 ns (-30%) | 5 ns (-50%) |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/O | 164 | 164 | 164 | 164 | 164 | 164 | 164 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage Tolerance | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant | 5 V tolerant |
| Lead-Free (RoHS) | No (standard) | Yes (Pb-free) | No (standard) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Family | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000B | MAX 7000AE | MAX 7000AE |
Principais diferenciais
- Identical electrical spec with lead-free reflow profile (vs EPM7256BFC256-10N)
- 30% faster propagation delay in same package (vs EPM7256BFC256-7)
- Combined speed and RoHS advantages (vs EPM7256BFC256-7N)
- MAX 7000AE family variant (vs EPM7256AEFC256-7)
Notas de projeto
The 256-FBGA package at 1.0 mm ball pitch requires a 4-layer or 6-layer PCB with microvia (laser-drilled or 0.1 mm mechanical) escape routing from inner ball rows. Use a 0.4 mm pad-to-pad routing grid with 0.15 mm trace width between BGA escape vias and the inner row balls. Plan for via-in-pad or microvia-under-pad if the design uses inner balls for high-speed signals. Estimated minimum trace clearance per 1.0 mm BGA: 0.2 mm trace, 0.2 mm space. Avoid dog-bone fanout on inner rows - use buried vias or via-in-pad instead.
The EPM7256BFC256-10 requires a clean 2.5V core supply with tolerance of 2.375V-2.625V per verified distributor specifications. Use an LDO (e.g., LT1763-2.5 or TPS7A4525) or a dedicated switching regulator with output ripple under 50 mVpk-pk. The 5V-tolerant I/O cells draw their VCCIO from the 5V or 3.3V rail - never connect VCCIO to the 2.5V core rail. Place 10uF tantalum and 0.1uF ceramic decoupling on each VCC pin within 5 mm of the ball.
Do not confuse the EPM7256BFC256-10 with the EPM7256AETI100-6: the latter uses a 100-pin TQFP package with far fewer I/Os (~76 vs 164) and is NOT pin-compatible. When sourcing replacements, verify the FC256 suffix indicates the 256-FBGA package. Also, the 'N' suffix (e.g., EPM7256BFC256-10N) denotes the lead-free RoHS version - confirm reflow profile compatibility (peak 260C for Pb-free vs 235C for SnPb) before substituting.
Assign JTAG pins (TDI, TDO, TMS, TCK) to a dedicated header or test point cluster for in-system programming access. The MAX 7000B JTAG interface operates at 2.5V logic - if your programming tool outputs 3.3V JTAG, insert a level translator or use a modern USB-Blaster-compatible programmer with 2.5V support. Add a 4.7 kohm pull-up on TCK and TMS for clean boundary-scan operation.
Informações de conformidade
Standard EPM7256BFC256-10 (no 'N' suffix) is the SnPb (leaded) version. The EPM7256BFC256-10N variant is RoHS-compliant (lead-free). RoHS/REACH compliance status for the original part was not explicitly stated in verified data. AEC-Q100 not applicable - this is a commercial-grade logic device.
