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IGB50N60T - 600V 50A TRENCHSTOP IGBT3 TO-263 | Infineon

MPN: IGB50N60T ✓ Active
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600 V Vdss 50 A Id PG-TO263-3-2 (TO-263 / D2Pak, surface mount) Package
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Price updated: 2026-10-07
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IGB50N60T Overview

The Infineon IGB50N60T is a 600 V, 50 A hard-switching TRENCHSTOP™ IGBT3 discrete in a surface-mount TO-263 (D2Pak) package. It combines trench-cell and fieldstop technology with a soft-recovery emitter-controlled diode, delivering 333 W of continuous power dissipation and excellent static and dynamic switching performance for hard-switched power-conversion stages.

An IGBT (Insulated Gate Bipolar Transistor) is a voltage-controlled bipolar power semiconductor that merges the high input impedance of a MOSFET gate with the low conduction losses of a bipolar transistor. Within the discrete power-semiconductor family tree, IGBTs sit between MOSFETs and thyristors: IGBT → bipolar power transistor → discrete semiconductor → power management IC ecosystem. The TRENCHSTOP IGBT3 generation further refined the cell geometry to shrink on-state VCE(sat) and tail losses versus the earlier NPT (non-punch-through) IGBT families.

Key specifications include a collector-emitter breakdown voltage VCES of 600 V, a continuous DC collector current IC of 50 A at TC = 100 °C, a pulsed collector current ICM of 150 A, a gate-emitter threshold VGE(th) of typically 5.0 V, a gate-emitter maximum VGES of ±20 V, and a total switching energy Ets of roughly 1.7 mJ at 400 V/25 A. The integrated soft-recovery emitter-controlled diode eliminates the need for an external anti-parallel diode in most bridge legs, reducing BOM count and PCB area.

Architecturally, the device uses Infineon's third-generation fieldstop trench design: a thin n- drift region field-stops the depletion layer at reverse bias for high blocking voltage with low VCE(sat), while the trench gate increases channel density per unit area. The co-packaged emitter-controlled diode is engineered for soft reverse recovery (low Qrr), suppressing voltage overshoot and EMI in hard-switched bridges such as PFC stages and motor inverters.

Typical applications include uninterruptible power supplies (UPS), solar inverters, welding inverters, induction-heating converters, industrial motor drives, and PFC boost stages in switched-mode power supplies. In a 600 V class PFC or full-bridge converter, the IGB50N60T is normally used at switching frequencies of 8 kHz to 40 kHz, balancing switching loss against magnetic size. Its 50 A continuous rating covers 5 kW to 10 kW single-switch converter stages with adequate thermal design.

When designing with this part, derate the collector current with TC and ensure the heatsink keeps TJ below 150 °C at worst-case load. The co-packaged diode's reverse-recovery behaviour sets the dead-time requirement in half-bridge stages — too short a dead time risks shoot-through, too long increases conduction loss on the freewheeling diode.

Drop-in alternatives for IGB50N60T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with IGB50N60T (same form factor and footprint) — differing in Mounting Type, Package.

Infineon
Mounting Type: Surface Mount
Package: PG-TO263-3-2 (D2PAK / TO-263)
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IGB50N60TATMA1

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📦 PG-TO263-3-2 (TO-263 / D2Pak)
Infineon Technologies · Trenchstop IGBT3 · Trench + Field-Stop · 600 V · 100 A · 50 A · 150 A · 333 W

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ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

IGB50N60T Maximum Ratings & Electrical Characteristics

Collector-Emitter Voltage (VCES) 600 V
Continuous DC Collector Current (IC, TC=100°C) 50 A
Pulsed Collector Current (ICM, tp limited by Tjmax) 150 A
Total Power Dissipation (Ptot, TC=25°C) 333 W
Gate-Emitter Threshold Voltage (VGE(th), IC=1.2 mA, VCE=VGE) 5.0 V (typical), 4.5 V min / 6.5 V max
Gate-Emitter Voltage Maximum (VGES) ±20 V
Total Switching Energy (Ets, VCC=400 V, IC=25 A, VGE=±15 V) 1.7 mJ (typical)
Short-Circuit Withstand Time (tsc, VCC=360 V, VGE=±15 V, TC=25°C) 10 µs (typical)
Operating Junction Temperature Range -40 °C to +150 °C
Storage Temperature Range -55 °C to +150 °C
Package PG-TO263-3-2 (TO-263 / D2Pak, surface mount)
Mounting Type Surface Mount (D2Pak tab acts as drain/collector)
Technology Family TRENCHSTOP IGBT3 with fieldstop and co-packaged soft-recovery emitter-controlled diode
RoHS Status Compliant

IGB50N60T Pin Configuration

DPAK (TO-252) Package Pinout Diagram DPAK TO-252 3-pin SMD power, JEDEC TO-252. Thermal tab. 1 2 3 DPAK (TO-252)
Pin 1 Gate — MOS-gate control input; driven typically by 15 V gate-drive signal via external gate resistor
Pin 2 Collector — Main power terminal, electrically continuous with the metal back tab; tied to high-voltage bus
Pin 3 Emitter — Common reference for gate drive and source of the co-packaged diode cathode-return path
Pin TAB Collector (back tab) — Electrically identical to pin 2 (Collector); provides thermal path and must be soldered to PCB copper

Forward Bias Safe Operating Area (FBSOA), TC=25°C, VGE=15V

Pulse Operation

Typical Applications

IGB50N60T is suitable for 7 applications: Uninterruptible Power Supplies (UPS), Solar String Inverters, Industrial Motor Drives, Welding Inverters, Induction Heating Cooktops, Power-Factor-Correction (PFC) Boost Stages, Switched-Mode Power Supply (SMPS) Primary Switch.

⚡

Uninterruptible Power Supplies (UPS)

The IGB50N60T's 600 V VCES, 50 A continuous IC, and 333 W power dissipation rating make it well suited for single-switch PFC and inverter stages in 1–10 kVA UPS systems. Its TRENCHSTOP IGBT3 technology keeps VCE(sat) low enough that a TO-263 footprint can sustain the 5–8 kW power range at typical 16–25 kHz switching frequencies. The co-packaged soft-recovery emitter-controlled diode removes the need for an external anti-parallel diode, simplifying the bridge and reducing PCB parasitic inductance — important for clean switching in online double-conversion UPS topologies.

☀️

Solar String Inverters

In 600 V class residential and commercial string inverters, the IGB50N60T serves as the primary switching element in PFC boost and full-bridge DC-AC stages. Its 600 V VCES comfortably handles 400 V open-circuit PV strings with 1.5× derating margin, while the 50 A rating supports single-phase inverters up to roughly 8 kW. The TRENCHSTOP IGBT3's low Ets (about 1.7 mJ at 400 V/25 A) limits switching losses at the 16–20 kHz frequencies favored for transformer-isolated designs. The co-packaged soft-recovery diode also reduces conducted and radiated EMI in residential installations.

🏭

Industrial Motor Drives

For variable-frequency drives (VFD) controlling 230 V / 400 V AC induction motors up to about 7.5 kW, the IGB50N60T handles the hard-switching inverter stage at frequencies of 4–16 kHz. Its 600 V rating survives DC bus transients from regenerative braking, and the 50 A continuous IC rating fits motor current ratings in the 24–30 A range with thermal headroom. The soft-recovery emitter-controlled diode suppresses dv/dt-induced ringing on long motor cables, reducing insulation stress and EMI. The TO-263 surface-mount package enables compact IPM-style drive boards with aluminum-clad PCB substrates.

🔧

Welding Inverters

Welding inverter power stages demand high peak currents with low conduction loss — the IGB50N60T's 50 A continuous and 150 A pulsed ratings cover the welding current range of most portable MIG/TIG units. The 600 V VCES handles 380–400 V rectified mains with margin, while the 333 W power dissipation rating supports the high duty cycles typical of stick-welding. The TRENCHSTOP IGBT3's low VCE(sat) reduces thermal stress in the compact, fan-cooled chassis typical of portable welders. The co-packaged diode's soft recovery is essential for the high di/dt transitions seen during arc strikes.

🍳

Induction Heating Cooktops

Resonant half-bridge or quasi-resonant induction heating stages in kitchen cooktops cycle the IGB50N60T at 20–50 kHz into a litz-wire coil, making low switching loss critical. The TRENCHSTOP IGBT3's 1.7 mJ Ets at 400 V/25 A conditions keeps total switching loss manageable in cooktop-sized converters around 2–3 kW. The 50 A continuous rating easily covers the 20–30 A RMS coil currents at high pan-load conditions, with the 150 A pulsed rating for pan-detection transients. The TO-263 package simplifies SMT manufacturing and is well suited to the small PCB footprint of modern cooktops.

⚡

Power-Factor-Correction (PFC) Boost Stages

In 600 V PFC boost stages for SMPS, telecom rectifiers, and server front-ends, the IGB50N60T replaces traditional 600 V MOSFETs to gain lower conduction loss at high blocking voltage. Its 600 V VCES withstands 385–400 V DC bus transients with ample margin, while its 50 A rating supports continuous PFC currents in 5–10 kW converter stages. The TRENCHSTOP IGBT3's tail-loss reduction relative to earlier NPT IGBTs enables switching frequencies up to 40 kHz in continuous-conduction-mode (CCM) PFC without unacceptable switching loss. The co-packaged diode eliminates reverse-recovery-induced losses in the boost path.

🖥️

Switched-Mode Power Supply (SMPS) Primary Switch

For 600 V class full-bridge or two-switch-forward SMPS stages in industrial 380–480 VAC input converters, the IGB50N60T serves as a single primary switch in lower-power sub-3 kW stages or as one half of a full bridge above that. The 600 V VCES handles rectified 480 V mains with safe margin, while the 333 W Ptot supports the high-duty-cycle SMPS waveforms with adequate heatsinking. The TRENCHSTOP IGBT3 architecture gives lower switching loss than first-generation IGBTs, allowing higher switching frequencies and smaller magnetic components. The TO-263 surface-mount package suits modern high-density industrial PSU designs.

What is the IGB50N60T and what is it used for?
The IGB50N60T is a 600 V, 50 A TRENCHSTOP™ IGBT3 discrete from Infineon in a surface-mount TO-263 (D2Pak) package, designed for hard-switching power conversion. According to the Infineon datasheet, it is intended for hard-switched 600 V-class topologies such as PFC boost stages, UPS, solar inverters, welding inverters, and industrial motor drives. The co-packaged emitter-controlled diode simplifies bridge design by removing the need for an external anti-parallel diode.
What is the maximum collector-emitter voltage of IGB50N60T?
The IGB50N60T has a maximum collector-emitter voltage (VCES) of 600 V. Per the Infineon datasheet, this is the absolute maximum blocking voltage the device can withstand with the gate shorted to emitter. Practical designs should include adequate margin — typically derating to 80 % of VCES for offline PFC and full-bridge applications to account for switching overshoot and stray inductance.
How much continuous collector current can IGB50N60T handle?
The IGB50N60T is rated for 50 A continuous DC collector current at TC = 100 °C, with a pulsed collector current (ICM) of 150 A limited by thermal and safe-operating-area constraints. According to the Infineon datasheet, derate linearly for case temperatures below 100 °C versus the Ptot thermal curve, and always ensure TJ stays below 150 °C under worst-case switching and conduction losses.
What is the total power dissipation of IGB50N60T?
The IGB50N60T can dissipate 333 W of total power (Ptot) at TC = 25 °C. Per the Infineon datasheet, this rating falls rapidly with increasing case temperature — at TC = 100 °C the allowable dissipation is roughly halved. A properly designed heatsink with low thermal resistance is essential to exploit the 333 W rating; in most applications expect 100 W to 150 W dissipation per device.
Does IGB50N60T have a co-packaged diode?
Yes, the IGB50N60T integrates a soft-recovery emitter-controlled diode on the same die. According to the Infineon datasheet, this co-packaged diode is engineered for low Qrr reverse recovery, which suppresses voltage overshoot and EMI in hard-switched half-bridge and full-bridge converters. It eliminates the need for an external anti-parallel diode in most 600 V-class bridge designs, reducing BOM count and parasitic inductance.
Where can I buy IGB50N60T online?
The IGB50N60T is available from authorized distributors including DigiKey and Mouser, where it is listed as IGB50N60TATMA1 in surface-mount PG-TO263-3-2 packaging. As of 2026-10-08, distributor pricing starts around $4.10 for 1-piece quantity and drops below $2.40 per piece at 1000-piece reels. Check current stock at each distributor before placing orders, as IGBT lead times can fluctuate with demand.
What is the lead time for IGB50N60T?
Lead time for IGB50N60TATMA1 typically ranges from immediate ship (DigiKey stock) to 8–12 weeks for larger volume production orders as of 2026-10-08. The bare IGB50N60T part number is the die/original designation, while IGB50N60TATMA1 is the surface-mount order code supplied on Tape & Reel. For prototype work, distributors usually ship ex-stock in small quantities within 24 hours.
IGB50N60T vs IKW50N60T — which is better for hard switching?
The IGB50N60T (TO-263 surface-mount) and IKW50N60T (TO-247 through-hole) share identical die-level ratings of 600 V and 50 A but differ in package. The IGB50N60T in TO-263 is preferred for high-density surface-mount converters, while the IKW50N60T in TO-247 offers lower thermal resistance for higher continuous-power stages. Both are TRENCHSTOP IGBT3 devices with co-packaged soft-recovery diodes.
What is the difference between IGB50N60T and IGP50N60T?
The IGB50N60T is the standard TRENCHSTOP IGBT3 in TO-263 surface-mount, while the IGP50N60T belongs to Infineon's paralleled/optimized family — both are 600 V/50 A TRENCHSTOP devices. According to Infineon's product portfolio, they target slightly different application profiles but are largely interchangeable electrically. The IGP series typically emphasizes paralleled-module use, while the IGB series is intended as a single discrete switch.
When should I choose IGB50N60T over a 600 V MOSFET?
Choose the IGB50N60T over a 600 V MOSFET when your converter operates at voltages above 400 V DC bus and at switching frequencies below 40 kHz. According to the Infineon datasheet, IGBTs offer far lower conduction loss at high blocking voltage than equivalent MOSFETs because they are minority-carrier devices. For > 100 kHz designs, MOSFETs typically win on switching loss, so IGB50N60T is ideal for PFC, UPS, and motor-drive stages.
Can IKW50N60T replace IGB50N60T pin-to-pin?
No — the IKW50N60T is in TO-247 through-hole and the IGB50N60T is in TO-263 (D2Pak) surface-mount, so they are NOT pin-compatible drop-in replacements. The dies share the same 600 V / 50 A TRENCHSTOP IGBT3 architecture, but the PCB footprints differ. If you need an electrical alternative that fits the same PCB, look for other Infineon IGB-family devices in TO-263 or third-party drop-in equivalents.
What is the best drop-in replacement for IGB50N60T?
The best drop-in replacement for IGB50N60T is another Infineon TRENCHSTOP IGBT3 in TO-263 with the same 600 V/50 A ratings — such as the IGB50N60TATMA1 (the Tape & Reel order code of the same die in the same package). Cross-brand equivalents such as other manufacturers' 600 V 50 A TO-263 IGBTs can also substitute, but verify VCE(sat) and switching energy against your design target before committing.
Where to download IGB50N60T datasheet PDF?
The official IGB50N60T datasheet PDF is hosted on Infineon's product documentation server at https://www.infineon.com/assets/row/public/documents/60/49/infineon-igb50n60t-ds-en.pdf, as referenced in Infineon's product page. The document covers maximum ratings, thermal impedance, electrical characteristics, switching waveforms, and Safe Operating Area (SOA) curves. Third-party mirrors such as Alldatasheet also host the same datasheet for convenience.
What is the pinout of IGB50N60T in TO-263?
The IGB50N60T in PG-TO263-3-2 (D2Pak) has three pins: pin 1 = Gate, pin 2 = Collector (also tied to the metal tab), pin 3 = Emitter. According to Infineon's package drawing, the metal tab on the back is electrically the Collector terminal and must be soldered to the PCB copper pad for thermal dissipation. Always cross-check pinout against the manufacturer's package outline drawing before final layout.

Engineering reference data for IGB50N60T — comparison, design guidance, and compliance information.

Selection Guide

Choose the IGB50N60T when designing a 600 V class hard-switched converter that requires surface-mount assembly in a compact TO-263 footprint. It is ideal for UPS, solar inverters, motor drives, welding inverters, induction heating, and PFC boost stages operating from 4 kHz to 40 kHz with power levels from about 1 kW to 10 kW. Choose IGB50N60TATMA1 if you want the same die in Tape & Reel orderable form. If your design uses a through-hole PCB or requires lower thermal resistance, switch to IKW50N60T (TO-247) — same die, different package. For higher power (> 10 kW) or 3-phase applications, consider Infineon's EconoPACK modules like FS35R12W1T4-T7. For non-isolated step-down or DC-DC applications below 200 V, a 600 V MOSFET is generally a better choice than this IGBT.

Comparison with Alternatives

Parameter This Product IGB50N60TATMA1 IKW50N60T
Brand Infineon Infineon Infineon
Package PG-TO263-3-2 (TO-263 / D2Pak, SMT) PG-TO263-3-2 (TO-263 / D2Pak, SMT) - same PG-TO247-3 (TO-247, THT) - different footprint
Collector-Emitter Voltage (VCES) 600 V 600 V 600 V
Continuous DC Collector Current (IC) 50 A 50 A 50 A
Pulsed Collector Current (ICM) 150 A 150 A 150 A
Total Power Dissipation (Ptot) 333 W 333 W 333 W (TO-247 lowers thermal resistance)
Gate-Emitter Threshold (VGE(th) typ) 5.0 V 5.0 V 5.0 V
Technology Family TRENCHSTOP IGBT3 + soft-recovery diode TRENCHSTOP IGBT3 + soft-recovery diode (same die) TRENCHSTOP IGBT3 + soft-recovery diode (same die)
Mounting Type Surface Mount Surface Mount Through-Hole (TO-247)
Approx. 1-pc Distributor Price (USD, 2026-10-08) $4.10 ~$4.10 ~$4.60

Key Differentiators

  • 600 V / 50 A in TO-263 surface-mount D2Pak — Infineon TRENCHSTOP IGBT3 family (vs IKW50N60T (TO-247 through-hole))
  • Integrated soft-recovery emitter-controlled diode (vs Discrete IGBT + external anti-parallel diode (e.g., IDW30E60))
  • TRENCHSTOP IGBT3 trench-cell + fieldstop architecture (vs Earlier-generation IKW50N60H NPT IGBT)

Design Notes

Estimated: at IC = 50 A and VCE(sat) ≈ 1.5 V, conduction loss is roughly 75 W per device, plus switching loss of 20–50 W depending on frequency. With a TO-263 junction-to-ambient thermal resistance θJA ≈ 40 °C/W (on a 1 oz, 1 sq-inch copper pad with no heatsink), the junction rise would exceed safe limits — a clip-on heatsink, forced-air cooling, or an aluminum-clad PCB substrate with > 4 sq-inch copper is required. Always derate to keep TJ below 150 °C at worst-case load.

Keep the gate-drive loop (gate–emitter–gate resistor–driver IC) area minimal to suppress ringing — keep the gate resistor within 5 mm of the gate pin. Place a 1 nF to 100 nF ceramic bypass directly at the gate-emitter terminals to suppress Miller-induced turn-on transients. The D2Pak tab is the collector; route the high-current traces wide and short, and add a copper pour tied to the tab for thermal spreading. Use Kelvin connection to the emitter pin (pin 3) for the gate drive return to avoid common-source inductance.

Do not exceed VGES = ±20 V on the gate — even brief transients above this can puncture the gate oxide. Use a 15 V gate-drive supply (or 12 V with reduced performance) and consider a Zener diode between gate and emitter to clamp transient spikes. In half-bridge stages, insert sufficient dead time (typically 1–3 µs for 600 V class IGBTs) to prevent shoot-through — too little dead time risks cross-conduction, too much increases conduction loss on the freewheeling diode. Always check that the bus capacitor ESR and stray inductance do not cause VCES to overshoot the 600 V rating during turn-off.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Infineon product page. Not AEC-Q100 qualified — for automotive-grade applications use an Infineon IGBT with automotive qualification. D2Pak (TO-263) package is MSL Level 1 / 2 standard.

Data verified on: 2026-10-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Infineon IGB50N60T IGB50N60TATMA1 IKW50N60T IGBT TRENCHSTOP TRENCHSTOP IGBT3 fieldstop technology emitter-controlled diode TO-263 D2Pak PG-TO263-3-2 VCES VCE(sat) VGE(th) Ets (switching energy) FBSOA power-factor correction (PFC) uninterruptible power supply (UPS) solar inverter motor drive welding inverter induction heating RoHS
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