LBEE5HY1MW-230 - Wi-Fi 5 + BT 5.0 Module, Type 1MW | Murata
MPN: LBEE5HY1MW-230 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.56 | $18.56 |
| 10 | $17.4 | $174.00 |
| 100 | $15.5 | $1,550.00 |
| 500 | $13.85 | $6,925.00 |
| 1,000 | $12.3 | $12,300.00 |
LBEE5HY1MW-230 Overview
A Wi-Fi + Bluetooth combo module is a pre-certified subsystem that bundles the radio transceiver, baseband processor, antenna matching network, and regulatory shielding into a single reflow-solderable component. The module sits between the host application processor (which runs the network stack and BT profiles) and the wireless air interface, offloading RF complexity, FCC/ETSI/TELEC certification burden, and BOM risk. The Murata Type 1MW family specifically targets low-power IoT endpoints that need modern dual-band Wi-Fi and Bluetooth 5.0 coexistence without discrete RF design effort.
Key features of the LBEE5HY1MW-230 include dual-band 2.4 GHz and 5 GHz operation with 802.11ac wave-2 (433 Mbps), Bluetooth 5.0 with LE 2M PHY and LE Coded PHY support, integrated shield and reference clock, and an SDIO 3.0 + UART host interface. The SMD package is reflow-compatible at standard 260 °C peak profile, and antenna is not included (typical for modules with host-board antenna or external antenna pigtail). Operating temperature is rated for industrial -30 °C to +85 °C environments.
Architecturally, the module integrates the Infineon CYW43455 die, a 37.4 MHz reference crystal, RF matching network, transmit balun, low-noise PA chain, and DC-DC regulators on a multilayer ceramic substrate with metal shield. Wi-Fi and Bluetooth radios share an antenna diversity topology with internal coexistence arbitration, allowing simultaneous 2.4 GHz WLAN + BT operation with on-chip packet scheduling. The module presents a standard SDIO 3.0 interface to the host MCU/MPU for WLAN and a 4-wire UART (plus PCM for BT audio) for Bluetooth.
Typical applications include Wi-Fi 5 + BLE smart-home gateways, industrial IoT gateways, wireless POS terminals, audio streaming products (BT classic A2DP + Wi-Fi), medical telemetry devices, and consumer electronics that need modern dual-band connectivity without in-house RF expertise. The integrated shield dramatically simplifies EMC compliance at the end-product level.
When designing with the LBEE5HY1MW-230, allocate a keep-out zone under the antenna feed, provide a clean 3.3 V rail with adequate bulk decoupling, and follow Murata's reference layout for the host-board antenna or pigtail. Host-driver selection (Linux/Backport, Android HAL, or vendor-specific MCU port) is critical - confirm firmware compatibility before committing to the design.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for LBEE5HY1MW-230 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LBEE5HY1MW
✅ Drop-In📋 Reference alternative (not in catalog)
LBEE5HY1MW-195
✅ Drop-In📋 Reference alternative (not in catalog)
LBEE5HY1MW-230 Specifications (manufacturer-published)
| Module Family | Type 1MW |
| Chipset | Infineon CYW43455 |
| Wi-Fi Standard | 802.11a/b/g/n/ac (Wi-Fi 5) dual-band |
| Bluetooth Standard | Bluetooth 5.0 BR/EDR/LE |
| Wi-Fi PHY Data Rate | Up to 433 Mbps (802.11ac, 1x1) |
| Bluetooth PHY Data Rate | Up to 3 Mbps (EDR) |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Host Interface (Wi-Fi) | SDIO 3.0 |
| Host Interface (Bluetooth) | UART (4-wire), PCM for audio |
| Antenna | Not Included (external / host-board antenna required) |
| Module Type | Shielded, Surface Mount |
| Operating Temperature | -30 °C to +85 °C |
| Mounting Type | Surface Mount (SMD, reflow) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
LBEE5HY1MW-230 Interfaces & Connectors
LBEE5HY1MW-230 exposes the following interfaces and connectors as published by the manufacturer: Wireless, Bluetooth. Expansion header pinout, connector pin numbering, and electrical limits are defined in the manufacturer documentation.
| Wireless | 802.11a/b/g/n/ac (Wi-Fi 5) dual-band |
| Bluetooth | Bluetooth 5.0 BR/EDR/LE |
Refer to the manufacturer documentation for the full expansion header pinout and connector pin numbering.
Power & Thermal Characteristics
| Operating Temperature | -30 °C to +85 °C |
Power input and thermal parameters for LBEE5HY1MW-230 as published by the manufacturer.
Typical Applications
LBEE5HY1MW-230 is suitable for 6 applications: Smart Home IoT Gateway, Industrial IoT Gateway, Wireless POS Terminal, Audio Streaming Product (Wi-Fi + BT A2DP), Medical Telemetry Device, Consumer Smart Display / Voice Assistant.
Smart Home IoT Gateway
The LBEE5HY1MW-230 brings dual-band Wi-Fi 5 and Bluetooth 5.0 to a smart-home hub that bridges Zigbee/BLE sensors to the home WLAN. Its 433 Mbps PHY lets the gateway aggregate 1080p camera streams while BT 5.0 LE handles low-power mesh sensors with up to 4x range via LE Coded PHY. The module sits on the hub motherboard with an SDIO link to the host SoC and a UART link to a BT audio path; the integrated metal shield and Murata pre-certification remove the largest EMC risk in a plastic-wall-mounted enclosure.
Recommended
Industrial IoT Gateway
In factory-floor gateways, the LBEE5HY1MW-230 provides Wi-Fi 5 backhaul to a cloud SCADA system while Bluetooth 5.0 connects to local HMI panels and wireless sensors. The -30 °C to +85 °C industrial temperature range covers typical cabinet environments without derating. With 802.11ac 1x1 MIMO at 433 Mbps, the gateway can carry aggregated Modbus-TCP, OPC-UA, and video telemetry streams concurrently; coexistent BT classic supports legacy wireless barcode scanners via the same module.
Recommended
Wireless POS Terminal
The LBEE5HY1MW-230 is well suited to mobile point-of-sale terminals that need both Wi-Fi for store-network checkout and Bluetooth for chip-card readers, NFC payment sleeves, and receipt printers. The compact shielded SMD footprint fits handheld form factors, and the 5 GHz band provides cleaner spectrum in dense retail environments. BLE 2M PHY speeds up the BT-paired printer transactions, while Wi-Fi 5 802.11ac carries the EMV authorization handshake to the payment processor.
Recommended
Audio Streaming Product (Wi-Fi + BT A2DP)
Wi-Fi/BT combo speakers and soundbars benefit from the LBEE5HY1MW-230's simultaneous dual-radio operation: Wi-Fi streams lossless audio from a phone or NAS via AirPlay/Chromecast while BT classic A2DP handles legacy phones. The CYW43455 silicon includes an internal coexistence arbiter that prevents Wi-Fi/BT packet collisions, eliminating the audible dropouts common in 2.4 GHz-only designs. The PCM interface feeds an external DAC/amplifier chain directly.
Recommended
Medical Telemetry Device
Patient-worn telemetry patches and bedside monitors use the LBEE5HY1MW-230 to transmit vitals over Wi-Fi to a hospital dashboard while using BLE for local clinician tablet pairing. Wi-Fi 5 dual-band ensures reliable connectivity even in congested 2.4 GHz hospital spectrum, and the industrial -30 to +85 °C rating supports sterilized-wipe cleaning cycles. The integrated shield simplifies IEC 60601-1 EMC compliance at the end-product level.
Recommended
Consumer Smart Display / Voice Assistant
Voice-assistant smart displays use the LBEE5HY1MW-230 to provide Wi-Fi connectivity for cloud speech recognition while BT classic supports out-of-band device pairing and BLE GATT services for mesh setup. The 433 Mbps PHY comfortably streams 720p video response to the display panel. Designers place the module on a dedicated RF island with antenna keep-out around the LCD backlight driver to preserve certification margins.
Recommended
Recommended Products Summary
Engineering reference data for LBEE5HY1MW-230 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LBEE5HY1MW | LBEE5HY1MW-195 |
|---|---|---|---|
| Package | Type 1MW SMD (shielded) | Type 1MW SMD (shielded) - same | Type 1MW SMD (shielded) - same |
| Brand | Murata Manufacturing | Murata Manufacturing | Murata Manufacturing |
| Chipset | Infineon CYW43455 | Infineon CYW43455 | Infineon CYW43455 |
| Wi-Fi Standard | 802.11a/b/g/n/ac dual-band | 802.11a/b/g/n/ac dual-band | 802.11a/b/g/n/ac dual-band |
| Bluetooth Version | 5.0 BR/EDR/LE | 5.0 BR/EDR/LE | 5.0 BR/EDR/LE |
| Wi-Fi PHY Rate | Up to 433 Mbps | Up to 433 Mbps | Up to 433 Mbps |
| Bluetooth PHY Rate | Up to 3 Mbps | Up to 3 Mbps | Up to 3 Mbps |
| Regional Certification | Region-coded (-230) | Engineering sample (no region certification) | Region-coded (-195) |
| Operating Temperature | -30 °C to +85 °C | -30 °C to +85 °C | -30 °C to +85 °C |
Key Differentiators
- Pre-certified dual-band Wi-Fi 5 + BT 5.0 module with integrated metal shield (vs LBEE5HY1MW (engineering sample))
- Different regional certification bundle with identical silicon (vs LBEE5HY1MW-195)
- On-chip Wi-Fi/Bluetooth coexistence arbiter prevents 2.4 GHz packet collisions (vs Discrete CYW43455 design)
Design Notes
Follow Murata's Type 1MW reference layout exactly to preserve the bundled RF certification: allocate a copper keep-out zone under the antenna feed area (no ground plane, no traces, no components), keep the SDIO/UART traces length-matched within ±50 mil to suppress reflections, and place the module on the board edge or top corner with the antenna facing outward. Any deviation may void the modular certification and force full EMC re-testing at the end product.
Power the LBEE5HY1MW-230 from a regulated 3.3 V rail with a 10 µF bulk + 0.1 µF + 1 nF decoupling network placed within 5 mm of the module's VBAT pins. Estimated: at peak 802.11ac 5 GHz TX the module can pull 400-600 mA in short bursts; the host 3.3 V LDO or DC-DC must have ≤30 mV p-p ripple to avoid desense on the 5 GHz chain. Use a ferrite bead if sharing the rail with a noisy SoC core.
Do not substitute the -230 suffix with the base LBEE5HY1MW (engineering sample) in production - the base part has no regional certification and will fail FCC/ETSI pre-scan. Also, do not hot-plug the SDIO bus; the CYW43455 firmware expects a clean power-on reset sequence, so tie the host's RESET_OUT to a GPIO and follow the Murata power-up timing diagram exactly. Finally, confirm firmware/driver compatibility (Linux Backport, Android HAL, or MCU port) before PCB commitment - driver mismatches are the #1 cause of late-stage module swaps.
Although the LBEE5HY1MW-230 is rated -30 °C to +85 °C operating, sustained 5 GHz 802.11ac TX at 433 Mbps can raise the module case temperature by 15-20 °C above ambient. Estimated: in a sealed enclosure with no airflow, derate TX duty cycle to 60% or add a small thermal via array under the shield to keep the CYW43455 junction below 105 °C. Monitor the host SoC's thermal sensor near the module for ambient drift during product validation.
Compliance Information
RoHS compliant per distributor listings. Not AEC-Q100 qualified - this is a consumer/industrial module, not an automotive-grade part. Modular RF certification (FCC/ETSI/TELEC) is bundled with the -230 suffix; Murata publishes the certification IDs in the Type 1MW datasheet. REACH compliance per Murata PIM product page.