EFM32GG11B520F2048IM64-B - 72MHz ARM Cortex-M4 MCU 2MB Flash
MPN: EFM32GG11B520F2048IM64-B ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.05 | $130.50 |
| 100 | $11.6 | $1,160.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.3 | $9,300.00 |
EFM32GG11B520F2048IM64-B Overview
An ARM Cortex-M4 microcontroller (MCU) is a 32-bit microcontroller unit based on the ARM Cortex-M4 processor core with DSP instructions and optional FPU, offering deterministic real-time performance at MHz clock speeds while consuming only tens of microamps per MHz in active mode. It fits within the hierarchy: Cortex-M4 MCU -> ARM-based microcontroller -> embedded microcontroller -> semiconductor. Battery voltage is critical for portable, energy-sensitive designs where sleep current dominates battery life.
Key features include 2 MB flash, 512 kB RAM, 53 GPIO, hardware AES/SHA crypto accelerator, segment LCD controller, USB, CAN, EBI and other peripherals, 39 C/W thermal resistance (typical QFN-64), -40C to +125C industrial temperature grade, and multiple low-energy modes down to sub-uA sleep currents. The B-grade part variant features extended industrial temperature range and is supplied on tape and reel.
The architecture combines ARM Cortex-M4 core with autonomous low-energy peripherals (LETIMER, RTCC, IADC, LESENSE) that operate without waking the CPU. The 2 MB flash supports over-the-air (OTA) firmware updates via dual-bank memory mapping, while the LCD controller enables direct drive of segmented displays without external driver ICs, reducing BOM cost and PCB area.
Typical applications include battery-powered IoT sensor nodes, smart energy metering with ESE AMR and LCD displays, industrial HMI panels with capacitive touch, connected lighting with wireless-segment control, and asset tracking with GPS/GNSS. The EFM32GG11B520F2048IM64-B is particularly well-suited to designs that require large memory for firmware/RF stacks while maintaining years of battery life.
When designing with this device, ensure adequate decoupling on VDD (1.8-3.8V) with 100 nF ceramic capacitors per supply pin and consider ground plane continuity under the QFN exposed pad for thermal dissipation. Order chips at tape and reel quantities via authorized distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EFM32GG11B520F2048IM64-B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EFM32GG11B520F2048IM64-B (same form factor and footprint) — differing in Mounting Type, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EFM32GG11B520F2048IM64
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG11B520F2048IM64-A
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG11B520F2048IM64-BR
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG11B420F2048IM64
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG11B520F2048GL120
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG12B810F1024IQ64
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32GG11B520F2048IM64-B Maximum Ratings & Electrical Characteristics
| Manufacturer | Silicon Labs |
| Series | EFM32 Giant Gecko Series 1 |
| Core | ARM Cortex-M4 |
| Core Size | 32-bit |
| Maximum Clock Frequency | 72 MHz |
| Program Memory Size (Flash) | 2 MB (2M x 8) |
| RAM Size | 512 kB |
| Supply Voltage (Vcc/Vdd) | 1.8 V to 3.8 V |
| Number of I/O | 53 |
| Timer/Counters | 7 x 16-bit |
| Package | 64-QFN (9x9) |
| Supplier Device Package | 64-QFN (9x9) |
| Operating Temperature | -40C to +125C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Grade | B (Extended Industrial) |
EFM32GG11B520F2048IM64-B Pin Configuration
| Pin 1 | PA0 — GPIO/Timer/Wake-up |
| Pin 2 | PA1 — GPIO/Timer/Wake-up |
| Pin 3 | PA2 — GPIO/USART0 |
| Pin 4 | PA3 — GPIO/USART0 |
| Pin 5 | PA4 — GPIO/I2C0 SDA |
| Pin 6 | PA5 — GPIO/I2C0 SCL |
| Pin 7 | PB0 — GPIO/ADC0 |
| Pin 8 | PB1 — GPIO/ADC0 |
| Pin 9 | PB2 — GPIO/ADC0 |
| Pin 10 | PB3 — GPIO/ADC0 |
| Pin 11 | PB4 — GPIO/I2C1 SDA |
| Pin 12 | PB5 — GPIO/I2C1 SCL |
| Pin 13 | PB6 — GPIO/USART1 |
| Pin 14 | PB7 — GPIO/USART1 |
| Pin 15 | PC0 — GPIO/Timer |
| Pin 16 | PC1 — GPIO/Timer |
| Pin 17 | PC2 — GPIO/Timer |
| Pin 18 | PC3 — GPIO/Timer |
| Pin 19 | PC4 — GPIO/ADC0 |
| Pin 20 | PC5 — GPIO/ADC0 |
| Pin 21 | PC6 — GPIO/ADC0 |
| Pin 22 | PC7 — GPIO/ADC0 |
| Pin 23 | PD0 — GPIO/USART2 |
| Pin 24 | PD1 — GPIO/USART2 |
| Pin 25 | PD2 — GPIO/SPI0 |
| Pin 26 | PD3 — GPIO/SPI0 |
| Pin 27 | PD4 — GPIO/SPI0 |
| Pin 28 | PD5 — GPIO/SPI0 |
| Pin 29 | PD6 — GPIO/I2C |
| Pin 30 | PD7 — GPIO/I2C |
| Pin 31 | PE0 — GPIO/CAN0 |
| Pin 32 | PE1 — GPIO/CAN0 |
| Pin 33 | PE2 — GPIO/Timer |
| Pin 34 | PE3 — GPIO/Timer |
| Pin 35 | PF0 — GPIO/LCD segment |
| Pin 36 | PF1 — GPIO/LCD segment |
| Pin 37 | PF2 — GPIO/LCD segment |
| Pin 38 | PF3 — GPIO/LCD segment |
| Pin 39 | PF4 — GPIO/LCD segment |
| Pin 40 | PF5 — GPIO/LCD segment |
| Pin 41 | PF6 — GPIO/LCD segment |
| Pin 42 | PF7 — GPIO/LCD segment |
| Pin 43 | PG0 — GPIO/LCD segment |
| Pin 44 | PG1 — GPIO/LCD segment |
| Pin 45 | PG2 — GPIO/LCD segment |
| Pin 46 | PG3 — GPIO/LCD segment |
| Pin 47 | PG4 — GPIO/LCD segment |
| Pin 48 | PG5 — GPIO/LCD segment |
| Pin 49 | PG6 — GPIO/LCD segment |
| Pin 50 | PG7 — GPIO/LCD segment |
| Pin 51 | PH0 — GPIO/LCD segment |
| Pin 52 | PH1 — GPIO/LCD segment |
| Pin 53 | PH2 — GPIO/LCD segment |
| Pin 54 | VSS — Ground |
| Pin 55 | VDD — Supply voltage (1.8V-3.8V) |
| Pin 56 | VSS — Ground |
| Pin 57 | VDD — Supply voltage (1.8V-3.8V) |
| Pin 58 | RESETn — Reset input (active low) |
| Pin 59 | SWDIO — Serial Wire Debug I/O |
| Pin 60 | SWCLK — Serial Wire Debug Clock |
| Pin 61 | SWO — Serial Wire Trace Output |
| Pin 62 | VCOM — LCD charge pump output |
| Pin 63 | VBAT — Battery domain supply |
| Pin 64 | EP — Exposed thermal pad (connect to GND) |
Typical Applications
EFM32GG11B520F2048IM64-B is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Smart Energy Metering with LCD, Industrial HMI with Capacitive Touch, Connected Lighting Controllers, Asset Tracking with GPS/GNSS, Medical Wearable Monitors.
Battery-Powered IoT Sensor Nodes
The EFM32GG11B520F2048IM64-B fits battery-powered IoT sensor nodes because its 72 MHz Cortex-M4 plus 512 kB RAM and 2 MB flash support full BLE/Zigbee/Thread stacks on-chip. Its sub-uA sleep currents and 1.8-3.8V supply enable direct Li-ion/Li-Ion connection. Autonomous peripherals (LETIMER, IADC) measure sensors without waking the CPU, extending battery life to multi-year horizons in intermittent-duty wireless sensor deployments. The 53 GPIO also drive sensor arrays, switches, and LEDs directly.
Recommended
Smart Energy Metering with LCD
The integrated segment LCD controller (up to 8x32 segments) drives multi-meter digit readouts without an external driver, making the EFM32GG11B520F2048IM64-B ideal for smart meters. Its 2 MB flash supports complex metering algorithms, segmented display font tables, and HAN/WAN protocol stacks. Low-energy modes keep average current below 30 uA in metering idle states, while 53 GPIO interface to current transformers, tamper switches, and metrology ICs across the entire metrology-to-display signal chain.
Recommended
Industrial HMI with Capacitive Touch
The EFM32GG11B520F2048IM64-B suits industrial HMI panels where its 72 MHz core drives capacitive touch sensing via LESENSE and IADC peripherals without external touch controller. Industrial temperature grade (-40C to +125C) supports factory floor conditions. 53 GPIO handle RGB LED indicators, segment LCDs, rotary encoders, and buzzer drivers. The 2 MB flash stores multi-page UI assets and CANopen/Modbus firmware, while the 39 C/W thermal resistance QFN package enables fanless sealed enclosures.
Recommended
Connected Lighting Controllers
Connected lighting controllers benefit from the EFM32GG11B520F2048IM64-B's 2 MB flash (large enough for Zigbee 3.0 + mesh networking firmware), 53 GPIO for multi-channel LED PWM driving, and sub-uA sleep that minimizes standby power below 30 uA per fixture. The integrated segment LCD drives simple status displays. The 1.8-3.8V supply directly accepts rectified 24V LED-driver rails after buck conversion, eliminating extra LDO stages and reducing BOM cost.
Recommended
Asset Tracking with GPS/GNSS
Asset trackers use the EFM32GG11B520F2048IM64-B to log position data from external GPS/GNSS modules over UART, storing hours of trajectory in 2 MB flash or external SPI flash. The 72 MHz core parses NMEA sentences and applies dead-reckoning algorithms, while sleep modes keep average current below 25 uA between fixes. 53 GPIO wakes on motion (PIR/IMU interrupts) and drives BLE beacons for last-seen reporting.
Recommended
Medical Wearable Monitors
The EFM32GS124F2048IM64-B fits medical wearables (pulse oximeters, continuous glucose monitor CGMs, portable ECGs) where low power, small footprint, and medical-grade firmware matter. The 72 MHz Cortex-M4 with FPU runs DSP algorithms (FFT, heart-rate variability) at sub-mW active power. 2 MB flash supports BLE Medical Devices Profile firmware plus on-device ML inference. The 53 GPIO connects to SpO2 sensors, PPG photodiodes, and BLE radio modules.
Recommended
Recommended Products Summary
Engineering reference data for EFM32GG11B520F2048IM64-B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EFM32GG11B520F2048IM64 | EFM32GG11B520F2048IM64-A | EFM32GG11B520F2048IM64-BR | EFM32GG11B420F2048IM64 | EFM32GG12B810F1024IQ64 |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
| Max Clock Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 40 MHz | 72 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| RAM | 512 kB | 512 kB | 512 kB | 512 kB | 512 kB | 256 kB |
| Supply Voltage | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V |
| Temperature Grade | B-grade (Industrial -40C to +125C) | Standard grade | A-grade | B-grade (T&R) | B-grade | I-grade (Industrial) |
| GPIO Count | 53 | 53 | 53 | 53 | 53 | 53 |
Key Differentiators
- B-grade extended industrial temperature range (vs EFM32GG11B520F2048IM64-A)
- Same 64-QFN (9x9) package as GG11 family siblings (vs EFM32GG11B520F2048GQ64-B (64-TQFP 10x10))
- Sub-uA low-energy modes (vs EFM32GG11B420F2048IM64 (40 MHz variant))
Design Notes
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pin. For the 64-QFN (9x9) package, route VDD and VSS on adjacent layers with low-impedance stitching vias around the exposed pad (pin 64). The 1.8V-3.8V supply allows direct Li-ion/Li-Ion battery connection, but for noise-sensitive analog peripherals (ADC, IADC), add a ferrite bead + 10 uF bulk capacitor pair on the supply rail. Estimated: at 72 MHz active, core current is approximately 25 mA/MHz, so peak VDD current near 1.8A requires 4-layer PCB with 2 oz copper on inner layers for adequate thermal spreading.
The 64-QFN (9x9) package exposed pad (pin 64) must be soldered to a continuous ground plane with thermal vias (0.3 mm pitch, 9+ vias recommended) to achieve the datasheet's 39 C/W theta_JA. Estimated: at 1.8A peak VDD current, worst-case junction-to-ambient rise is approximately 70C above ambient - well within the -40C to +125C industrial range if the PCB provides at least 1 square inch of 1 oz copper pour.
Route SWDIO/SWCLK/SWO (pins 59-61) as a 50 ohm-controlled impedance group with continuous ground reference, length-matched within 5 mm, and kept away from high-current switching nodes (DC-DC, RF). Place the 32.768 kHz crystal within 5 mm of the HFXTAL pins with symmetric trace lengths and guard ground to minimize load capacitor mismatch. Use 4-layer PCB stack-up with dedicated ground and power planes for EMI suppression.
Do not exceed 3.8V on VDD - the EFM32GG11B520F2048IM64-B has no internal overvoltage protection. Always assert RESETn (pin 18) low for at least 1 us after VDD reaches 1.8V to ensure clean startup. For firmware updates via dual-bank memory mapping, ensure BOOTMODE strap pin is properly configured during reset to avoid bricking the device. Verify the segment LCD bias voltage (VCOM, pin 62) is within the datasheet's specified range for the chosen LCD glass.
Compliance Information
RoHS compliant per Silicon Labs product page. Not AEC-Q100 qualified for automotive; choose automotive-grade variant for AEC-Q100 applications.
