Analog Devices

MAX1167C/D+ - 16-Bit 200ksps SAR ADC Die | Maxim Integrated

MPN: MAX1167C/D+ ✓ Active
In Stock Ships in 1-3 business days
4.75 V to 5.25 V Vdss Die (unpackaged) Package
From $12.2 USD / Unit
MOQ: 1 |
Price updated: 2026-10-14
Volume Pricing
Qty Unit Price Extended
1 $21.5 $21.50
10 $19.35 $193.50
100 $16.8 $1,680.00
500 $14.5 $7,250.00
1,000 $12.2 $12,200.00
ℹ️ All prices are in USD

MAX1167C/D+ Overview

The Maxim Integrated MAX1167C/D+ (now part of Analog Devices) is a 16-bit, low-power, successive-approximation-register (SAR) analog-to-digital converter (ADC) supplied as an unpackaged die (D suffix). It integrates 4 analog input channels and a 1:1 sample-and-hold (S/H) to ADC architecture, enabling simultaneous-sampling-free, sequential-channel acquisition at up to 200 ksps aggregate throughput. The die-level form factor is intended for hybrid-module assemblies and chip-on-board (COB) designs where board area is at a premium and a conventional QSOP-16 package is not viable.

An SAR ADC (Successive Approximation Register Analog-to-Digital Converter) is a Nyquist-rate data converter that uses a binary-search algorithm against an internal precision DAC to digitize an analog input in N conversion cycles for N bits of resolution. Within the broader data-converter taxonomy, the SAR ADC sits between flash converters (faster, lower resolution) and sigma-delta converters (higher resolution, lower bandwidth). Compared to sigma-delta ADCs of similar resolution, SAR converters offer deterministic latency and zero-latency single-shot conversion, which is critical for multiplexed multi-channel systems and control loops. The MAX1167 therefore belongs to the precision data acquisition IC class within the signal-chain hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor.

Key specifications include 16-bit resolution with no missing codes, 200 ksps maximum sampling rate, 4 single-ended analog input channels, an analog supply range of 4.75 V to 5.25 V, and a digital supply range of 2.7 V to 5.25 V that simplifies interfacing to 3.3 V or 5 V microcontrollers without level shifters. The architecture provides true 16-bit performance with integrated track-and-hold, reducing external component count and settling-time concerns typical of discrete S/H designs. The die is rated for the industrial -40C to +85C operating range.

Typical uses include portable instrumentation, multi-channel data-acquisition front ends, process-control I/O modules, and medical patient-monitoring equipment where four single-ended sensor inputs must be digitized sequentially at high resolution. Designers also deploy this part in factory-automation analog input modules and panel-meter designs that benefit from a small die footprint and the low power dissipation characteristic of SAR converters.

When designing with the MAX1167C/D+, note that the die variant requires special handling for die attach and encapsulation, and that the QSOP-16 packaged counterpart MAX1167CEEE+ should be selected for conventional SMT board assembly. Reference voltages, decoupling capacitors, and ground plane recommendations in the manufacturer datasheet apply to both package options.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet alone.

Drop-in alternatives for MAX1167C/D+ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MAX1167C/D+ (same form factor and footprint) — differing in Analog Supply Voltage, Digital Supply Voltage, Operating Temperature, Sample Rate, Resolution.

Maxim Integrated
Analog Supply Voltage: +5 V
Digital Supply Voltage: +2.7 V to +5.25 V
Operating Temperature: 0°C to +70°C (commercial)
Analog Devices
Analog Supply Voltage: +4.75 V to +5.25 V
Digital Supply Voltage: +4.75 V to +5.25 V
Operating Temperature: 0 C to +70 C (commercial)
Analog Devices
Sample Rate: 58.6 ksps
Resolution: 14 bits

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MAX1167CEEE+

✅ Drop-In ⚠️ Specs Unverified
📦 QSOP-16
Same die as MAX1167C/D+ but QSOP-16 packaged - not a true drop-in for the unpackaged die form factor

📋 Reference alternative (not in catalog)

MAX1168CEUE+

✅ Drop-In ⚠️ Specs Unverified
📦 QSOP-16
Same 16-bit 200ksps SAR family, QSOP-16 package - not drop-in for die but pin-compatible with MAX1167CEEE+

📋 Reference alternative (not in catalog)

MAX1067BCEE

✅ Drop-In ⚠️ Specs Unverified
Maxim Integrated
📦 QSOP-16
14 bits · 200 kSamples/sec · 4 single-ended · SAR (Successive Approximation) · Single-Ended · SPI / QSPI / MICROWIRE-compatible serial · +5 V · +2.7 V to +5.25 V

✓ In Stock

$9.4 / Unit

View Datasheet →

MAX1068AEEG+

✅ Drop-In ⚠️ Specs Unverified
Analog Devices
📦 QSOP-16
14 bits · 200 ksps · SAR (Successive Approximation) · 8 single-ended / 4 pseudo-differential · Single-ended / pseudo-differential · +4.75 V to +5.25 V · +4.75 V to +5.25 V · +4.096 V

✓ In Stock

$7.48 / Unit

View Datasheet →

MAX1069AEUD+

✅ Drop-In ⚠️ Specs Unverified
Analog Devices
📦 TSSOP-14
Analog Devices / Maxim Integrated · MAX1069AEUD+ · 14 bits · 1 · 58.6 ksps · SAR (Successive Approximation Register) · 2-Wire Serial, I2C-compatible · 4.75 V to 5.25 V

✓ In Stock

$4.2 / Unit

View Datasheet →

MAX1167C/D+ Maximum Ratings & Electrical Characteristics

Resolution 16 bit
Architecture SAR (Successive Approximation Register)
Sample Rate (max) 200 ksps
Analog Inputs 4 single-ended
Input Type Single-Ended
S/H to ADC Ratio 1:1
Analog Supply Voltage 4.75 V to 5.25 V
Digital Supply Voltage 2.7 V to 5.25 V
Package / Case Die (unpackaged)
Operating Temperature -40 C to +85 C
Number of Channels 4
Mounting Type Surface Mount / Die Attach
RoHS Status Compliant
Lead Free Status Lead Free

MAX1167C/D+ die (unpackaged) Pin Configuration Guide

Pin configuration for MAX1167C/D+ (die (unpackaged) package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.

die (unpackaged) package pinout diagram for MAX1167C/D+

No detailed pinout data available for MAX1167C/D+.

Refer to the datasheet for full pin configuration.

Typical Applications

MAX1167C/D+ is suitable for 6 applications: Portable Data Acquisition Systems, Process Control and Industrial I/O Modules, Medical Patient Monitoring Equipment, Panel Meters and Digital Instrumentation, Factory Automation Analog Input Modules, Data Logger and Sensor Readout Boards.

📱

Portable Data Acquisition Systems

The MAX1167C/D+ is well suited to portable battery-powered data-acquisition front ends because its 16-bit resolution, 200 ksps sample rate, and low SAR-architecture quiescent power draw enable multi-channel sensor digitization without draining the battery. With 4 single-ended inputs, the die can directly accept signals from thermocouples, strain gauges, and 4-20 mA loop sensors through external signal scaling. The 2.7 V-5.25 V digital supply range allows direct interface to 3.3 V microcontrollers without level shifters, reducing BOM cost and PCB area. Unlike sigma-delta converters of similar resolution, the SAR architecture provides deterministic single-conversion latency, which simplifies the host firmware timing model in data loggers and handheld test instruments.

🏭

Process Control and Industrial I/O Modules

In process-control and industrial-automation I/O modules, the MAX1167C/D+ provides the 16-bit resolution needed for accurate measurement of pressure, flow, and temperature transducers while the 200 ksps throughput supports multiplexed multi-loop scanning at rates well above typical PLC update intervals. The 4 single-ended analog inputs allow direct connection to four field sensors per ADC, reducing the per-channel cost. The -40 C to +85 C industrial operating temperature range is suitable for cabinet-mounted control panels. Designers benefit from the integrated track-and-hold which removes external S/H amplifier cost and reduces PCB footprint - critical for compact DIN-rail I/O modules where board area is constrained.

💊

Medical Patient Monitoring Equipment

The MAX1167C/D+ suits multi-parameter patient monitoring equipment such as bedside monitors and ambulatory recorders that need 16-bit resolution for ECG, SpO2, temperature, and respiration channels. Its SAR architecture delivers deterministic single-shot conversion latency, which is important for triggered-event captures such as arrhythmia detection. The wide 2.7 V-5.25 V digital supply range simplifies connection to 3.3 V microcontrollers commonly used in medical MCUs. The 4 single-ended channels allow direct digitization of up to four physiological signals without an external multiplexer, reducing patient-leakage paths in isolated designs. Verify IEC 60601-1 compliance and patient-isolation requirements are met by the surrounding system design.

🔧

Panel Meters and Digital Instrumentation

Digital panel meters, bench-top multimeters, and laboratory instrumentation benefit from the MAX1167C/D+ combination of 16-bit no-missing-codes resolution and 200 ksps sample rate. The 4-channel input allows simultaneous readout of voltage, current, and temperature in a single ADC, reducing BOM and simplifying calibration. The SAR architecture provides a single deterministic conversion result per trigger, which simplifies display update logic. The wide digital supply range supports both 3.3 V and 5 V display-driver MCUs. Designers should note the die variant is preferred only when board area is at an extreme premium; otherwise the QSOP-16 MAX1167CEEE+ is more cost-effective for standard panel-meter PCBs.

🏭

Factory Automation Analog Input Modules

Factory automation analog input modules - particularly those that aggregate 4-20 mA or 0-10 V field signals into a PLC backplane - benefit from the MAX1167C/D+ 16-bit resolution and 200 ksps throughput. The 4 single-ended inputs allow one ADC to handle four field channels, reducing cost per channel. The industrial -40 C to +85 C operating range and SAR deterministic conversion timing suit industrial control loops where deterministic latency matters. The 4.75 V-5.25 V analog supply. The unpackaged die form factor suits integration into custom ASIC modules where a packaged ADC would not fit the form factor.

🖥️

Data Logger and Sensor Readout Boards

Multi-channel data loggers and sensor readout boards for environmental, structural-health, and scientific-instrument applications use the MAX1167C/D+ to digitize multiple sensor channels at 16-bit resolution and 200 ksps aggregate. The 4 single-ended inputs allow direct connection to bridge outputs, RTDs, or thermistor networks with appropriate signal conditioning. The SAR architecture provides consistent single-conversion timing for triggered captures, and the 2.7 V-5.25 V digital supply range simplifies interfacing to low-power MCUs in battery-deployed data loggers. The die form factor is preferred where the data-logger module must fit inside a sealed sensor housing with strict form-factor constraints.

What is the resolution and sample rate of MAX1167C/D+?
The MAX1167C/D+ is a 16-bit SAR ADC with a maximum sampling rate of 200 ksps. According to the Maxim Integrated datasheet, it integrates 4 single-ended analog input channels and a 1:1 sample-and-hold to converter ratio, providing no-missing-codes 16-bit performance for multi-channel data acquisition systems.
Where to buy MAX1167C/D+ online and what is the lead time?
The MAX1167C/D+ is currently stocked at distributors such as Components-House (4343 pieces in stock as of 2026-10-14), with DigiKey and Octopart also listing the part. The die variant typically carries longer lead time than the QSOP-16 packaged MAX1167CEEE+ because unpackaged die is a specialty inventory item. Contact the distributor directly for current qty-1 unit price.
What is the price of MAX1167C/D+ in 100-piece quantity?
The 100-piece price for MAX1167C/D+ is approximately $16.80 as of 2026-10-14, based on aggregated distributor data. Pricing for unpackaged die parts varies with wafer availability and bonding-service options; for the QSOP-16 MAX1167CEEE+ counterpart the curve is markedly cheaper due to higher production volume.
MAX1167C/D+ vs MAX1167CEEE+ - which one should I choose?
The MAX1167C/D+ is the die (unpackaged wafer) form factor designed for hybrid-module and chip-on-board assemblies, while the MAX1167CEEE+ is the QSOP-16 packaged version intended for standard SMT PCB assembly. Choose the /D+ variant only if your manufacturing process supports die attach and wire bonding; otherwise choose the QSOP-16 MAX1167CEEE+ for reflow-compatible assembly.
What is the best drop-in replacement for MAX1167C/D+?
There is no true pin-compatible drop-in replacement for the unpackaged MAX1167C/D+ because it is a bare die - any alternative must be specified at the bond-pad level. The closest functional equivalents are the QSOP-16 MAX1167CEEE+ (same die, different package - not drop-in) and other Maxim/ADI SAR ADCs with 200 ksps / 16-bit performance such as the MAX1168CEUE+. All require package-level qualification, not bond-pad-level drop-in.
Where to download MAX1167C/D+ datasheet PDF?
The MAX1167C/D+ datasheet PDF is hosted at datasheets.maximintegrated.com (now mirrored on analog.com). Mouser and DigiKey product pages for the QSOP-16 variant MAX1167CEEE+ link directly to the same datasheet, which covers both the QSOP and the die variants. Search the part number on the manufacturer website or via Octopart to retrieve the latest revision.
Where to find the pinout for MAX1167C/D+?
The MAX1167C/D+ pinout is defined as bond-pad coordinates on the die rather than package pins. The bond-pad map, ESD protection layout, and recommended die-attach pad pattern are documented in the manufacturer datasheet Mechanical Information section. For a packaged equivalent with conventional SMT pins, refer to the QSOP-16 MAX1167CEEE+ datasheet, which uses the same die.
Is MAX1167C/D+ suitable for portable battery-powered applications?
The MAX1167C/D+ is a low-power 16-bit SAR ADC operating from a 4.75 V to 5.25 V analog supply and 2.7 V to 5.25 V digital supply, which makes it compatible with 5 V regulated rails and 3.3 V microcontroller I/O. SAR converters inherently offer zero-latency single conversion and consume power proportional to sample rate - making the MAX1167 a strong fit for portable instrumentation and battery-powered multi-channel data loggers.
What are the supply voltages for MAX1167C/D+?
The MAX1167C/D+ operates from an analog supply of 4.75 V to 5.25 V and a digital supply of 2.7 V to 5.25 V, allowing direct interface to 3.3 V or 5 V microcontrollers without level shifters. According to the Maxim datasheet, the wide digital-supply range simplifies mixed-voltage system designs where the analog front-end runs at 5 V while the host MCU runs at 3.3 V.
MAX1167C/D+ vs MAX1168CEUE+ - which has more channels?
Both the MAX1167 and the MAX1168 are 16-bit 200 ksps SAR ADCs, but the MAX1167 has 8 single-ended inputs and the MAX1168 has 8 single-ended inputs as well - both share a similar 4-/8-channel architecture. Pin references in the datasheet confirm the channel-count difference; consult the Maxim/ADI part selector for the exact channel count needed for your multiplexed application.
When should I choose MAX1167C/D+ over the QSOP-16 MAX1167CEEE+?
Choose the MAX1167C/D+ die variant only if you have a hybrid-module or chip-on-board manufacturing process that supports die attach, wire bonding, and encapsulation. For standard SMT PCB assembly using reflow soldering and pick-and-place, choose the QSOP-16 MAX1167CEEE+ - it uses the same die but eliminates the cost and complexity of die-level assembly.
Is MAX1167C/D+ RoHS compliant?
The MAX1167C/D+ is RoHS compliant per the Maxim Integrated product page and lead-free per the manufacturer datasheet marking convention. Compliance extends to the QSOP-16 packaged variant MAX1167CEEE+ as well, since both share the same lead-free die. Always confirm REACH and conflict-minerals compliance documentation with the manufacturer for EU shipments.
Can MAX1167CEEE+ replace MAX1167C/D+ in my design?
No, the MAX1167CEEE+ is not a drop-in replacement for the MAX1167C/D+. The /D+ variant is an unpackaged die, while the /CEEE+ is a QSOP-16 packaged part on a conventional SMT footprint. They use the same silicon die, but the package transition requires a redesigned PCB land pattern and assembly process - it is a package-level change, not a drop-in swap.
What are the key specifications of MAX1167C/D+ that engineers should know?
The MAX1167C/D+ is a 16-bit, 200 ksps, 4-channel single-ended SAR ADC supplied as an unpackaged die with a 4.75 V-5.25 V analog supply, 2.7 V-5.25 V digital supply, and -40 C to +85 C industrial operating range. It uses a 1:1 sample-and-hold to ADC ratio and offers no-missing-codes 16-bit performance for portable instrumentation, process-control I/O modules, and panel-meter designs.

Engineering reference data for MAX1167C/D+ — comparison, design guidance, and compliance information.

Selection Guide

Choose the MAX1167C/D+ (unpackaged die) only when your product assembly process supports die attach and wire bonding, and when a conventional QSOP-16 footprint would not fit the form factor - typical applications include sealed sensor modules, medical implants, and hybrid ASIC assemblies. For standard SMT PCB assembly using reflow soldering, choose the MAX1167CEEE+ (QSOP-16) which uses the same silicon die and offers identical 16-bit 200 ksps specifications. Choose the MAX1168CEUE+ when more than 4 single-ended channels are required (8 channels). Choose lower-cost MAX1067BCEE for cost-sensitive applications where sample rate can be traded for lower unit cost. Verify the digital interface protocol (not available in verified snippets) against your MCU selection before finalizing the design.

Comparison with Alternatives

Parameter This Product MAX1167CEEE+ MAX1168CEUE+ MAX1067BCEE
Package Die (unpackaged) QSOP-16 - packaged QSOP-16 - packaged QSOP-16 - packaged
Brand Analog Devices (Maxim Integrated) Analog Devices Analog Devices Analog Devices
Resolution 16 bit 16 bit 16 bit 16 bit
Architecture SAR SAR SAR SAR

Key Differentiators

  • Unpackaged die form factor for hybrid-module integration (vs MAX1167CEEE+ (QSOP-16))
  • 200 ksps throughput with 16-bit no-missing-codes performance (vs MAX1067BCEE)
  • Wide 2.7 V-5.25 V digital supply range (vs MAX1168CEUE+)

Design Notes

The MAX1167C/D+ is supplied as an unpackaged die, so the PCB substrate must accommodate die attach, wire bonding, and encapsulation. Provide a clean, low-impedance ground return directly under the die attach pad to minimize digital switching noise coupling into the analog inputs. Decouple both AVDD and DVDD with 0.1 uF ceramic capacitors placed as close as physically possible to the bond-wire pads, in parallel with a 10 uF tantalum or ceramic bulk capacitor. Route digital interface lines (SPI clock, chip select, data) away from analog input bond pads to minimize digital-to-analog crosstalk.

Power the analog and digital sections from separate, well-regulated supplies. AVDD should be derived from a low-noise LDO such as the ADP151 or similar to achieve the 16-bit no-missing-codes performance promised in the datasheet. The 4.75 V-5.25 V analog supply must remain within regulation during conversion - estimate: a 100 mV supply ripple on AVDD can degrade SNR by approximately 6 dB in 16-bit systems. Add bulk capacitance at the die-level supply bond pads and use a star-ground topology to isolate noisy digital return paths from the analog ground bond-pad.

Common pitfalls with the MAX1167C/D+ die variant include: (1) confusing the die variant with the QSOP-16 MAX1167CEEE+ - they are not drop-in replacements because the die has bond pads rather than package pins; (2) omitting the reference voltage capacitor - the MAX1167 typically needs a 10 uF reference bypass; (3) sampling-rate overclocking beyond 200 ksps which causes linearity errors. For QSOP-16 SMT assembly, choose the MAX1167CEEE+ instead to avoid die-attach complexity.

For multi-channel designs using all 4 analog inputs, ensure that input traces are matched in length and shielded from each other to prevent channel-to-channel crosstalk. Place the four input capacitors at the bond-wire pads rather than at the connector end of the trace to maximize filter effectiveness. Use a guard trace tied to analog ground between adjacent analog input bond pads if channel-to-channel isolation exceeds 80 dB is required. Verify mechanical drawings in the datasheet for the exact bond-pad coordinates before laying out the substrate.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Maxim Integrated product documentation. Not AEC-Q applicable (general-purpose ADC, not automotive-grade). Halogen-free status not confirmed in verified data.

Data verified on: 2026-10-14 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Analog Devices Maxim Integrated MAX1167C/D+ MAX1167CEEE+ MAX1168CEUE+ MAX1067BCEE MAX1068AEEG+ MAX1069AEUD+ SAR ADC successive approximation register analog-to-digital converter ADC data converter mixed-signal IC semiconductor QSOP-16 Die RoHS AEC-Q100 single-ended input sample-and-hold 4-20 mA data acquisition process control panel meter patient monitoring
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