MAX1167C/D+ - 16-Bit 200ksps SAR ADC Die | Maxim Integrated
MPN： MAX1167C/D+ ✓ 啟用中MAX1167C/D+ 概覽
An SAR ADC (Successive Approximation Register Analog-to-Digital Converter) is a Nyquist-rate data converter that uses a binary-search algorithm against an internal precision DAC to digitize an analog input in N conversion cycles for N bits of resolution. Within the broader data-converter taxonomy, the SAR ADC sits between flash converters (faster, lower resolution) and sigma-delta converters (higher resolution, lower bandwidth). Compared to sigma-delta ADCs of similar resolution, SAR converters offer deterministic latency and zero-latency single-shot conversion, which is critical for multiplexed multi-channel systems and control loops. The MAX1167 therefore belongs to the precision data acquisition IC class within the signal-chain hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor.
Key specifications include 16-bit resolution with no missing codes, 200 ksps maximum sampling rate, 4 single-ended analog input channels, an analog supply range of 4.75 V to 5.25 V, and a digital supply range of 2.7 V to 5.25 V that simplifies interfacing to 3.3 V or 5 V microcontrollers without level shifters. The architecture provides true 16-bit performance with integrated track-and-hold, reducing external component count and settling-time concerns typical of discrete S/H designs. The die is rated for the industrial -40C to +85C operating range.
Typical uses include portable instrumentation, multi-channel data-acquisition front ends, process-control I/O modules, and medical patient-monitoring equipment where four single-ended sensor inputs must be digitized sequentially at high resolution. Designers also deploy this part in factory-automation analog input modules and panel-meter designs that benefit from a small die footprint and the low power dissipation characteristic of SAR converters.
When designing with the MAX1167C/D+, note that the die variant requires special handling for die attach and encapsulation, and that the QSOP-16 packaged counterpart MAX1167CEEE+ should be selected for conventional SMT board assembly. Reference voltages, decoupling capacitors, and ground plane recommendations in the manufacturer datasheet apply to both package options.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet alone.
直接替換替代品，適用於 MAX1167C/D+ — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MAX1167C/D+ （相同外形與佔位） — 差異在於 Analog Supply Voltage, Digital Supply Voltage, Operating Temperature, Sample Rate, Resolution.
MAX1167CEEE+
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MAX1168CEUE+
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MAX1067BCEE
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MAX1068AEEG+
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MAX1069AEUD+
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MAX1167C/D+ 最大額定值與電氣特性
| 解析度 | 16 bit |
| Architecture | SAR (Successive Approximation Register) |
| Sample Rate (max) | 200 ksps |
| Analog Inputs | 4 single-ended |
| Input Type | Single-Ended |
| S/H to ADC Ratio | 1:1 |
| Analog Supply Voltage | 4.75 V to 5.25 V |
| Digital Supply Voltage | 2.7 V to 5.25 V |
| 封裝 / 外殼 | Die (unpackaged) |
| 工作溫度 | -40 C to +85 C |
| Number of Channels | 4 |
| 安裝類型 | Surface Mount / Die Attach |
| RoHS 狀態 | Compliant |
| Lead Free Status | Lead Free |
MAX1167C/D+ die (unpackaged) 腳位配置指南
MAX1167C/D+（die (unpackaged) 封裝）的腳位配置。 此類比元件具有輸入、輸出與電源腳位。偏移歸零、補償與致能腳位配置請參閱製造商資料表。適用於訊號調理與放大器電路。
無詳細腳位定義資料： MAX1167C/D+.
請參閱 資料表 以查看完整腳位配置。
典型應用
MAX1167C/D+ 適用於 6 應用s: Portable Data Acquisition Systems, Process Control and Industrial I/O Modules, Medical Patient Monitoring Equipment, Panel Meters and Digital Instrumentation, Factory Automation Analog Input Modules, Data Logger and Sensor Readout Boards.
Portable Data Acquisition Systems
The MAX1167C/D+ is well suited to portable battery-powered data-acquisition front ends because its 16-bit resolution, 200 ksps sample rate, and low SAR-architecture quiescent power draw enable multi-channel sensor digitization without draining the battery. With 4 single-ended inputs, the die can directly accept signals from thermocouples, strain gauges, and 4-20 mA loop sensors through external signal scaling. The 2.7 V-5.25 V digital supply range allows direct interface to 3.3 V microcontrollers without level shifters, reducing BOM cost and PCB area. Unlike sigma-delta converters of similar resolution, the SAR architecture provides deterministic single-conversion latency, which simplifies the host firmware timing model in data loggers and handheld test instruments.
推薦
Process Control and Industrial I/O Modules
In process-control and industrial-automation I/O modules, the MAX1167C/D+ provides the 16-bit resolution needed for accurate measurement of pressure, flow, and temperature transducers while the 200 ksps throughput supports multiplexed multi-loop scanning at rates well above typical PLC update intervals. The 4 single-ended analog inputs allow direct connection to four field sensors per ADC, reducing the per-channel cost. The -40 C to +85 C industrial operating temperature range is suitable for cabinet-mounted control panels. Designers benefit from the integrated track-and-hold which removes external S/H amplifier cost and reduces PCB footprint - critical for compact DIN-rail I/O modules where board area is constrained.
推薦
Medical Patient Monitoring Equipment
The MAX1167C/D+ suits multi-parameter patient monitoring equipment such as bedside monitors and ambulatory recorders that need 16-bit resolution for ECG, SpO2, temperature, and respiration channels. Its SAR architecture delivers deterministic single-shot conversion latency, which is important for triggered-event captures such as arrhythmia detection. The wide 2.7 V-5.25 V digital supply range simplifies connection to 3.3 V microcontrollers commonly used in medical MCUs. The 4 single-ended channels allow direct digitization of up to four physiological signals without an external multiplexer, reducing patient-leakage paths in isolated designs. Verify IEC 60601-1 compliance and patient-isolation requirements are met by the surrounding system design.
推薦
Panel Meters and Digital Instrumentation
Digital panel meters, bench-top multimeters, and laboratory instrumentation benefit from the MAX1167C/D+ combination of 16-bit no-missing-codes resolution and 200 ksps sample rate. The 4-channel input allows simultaneous readout of voltage, current, and temperature in a single ADC, reducing BOM and simplifying calibration. The SAR architecture provides a single deterministic conversion result per trigger, which simplifies display update logic. The wide digital supply range supports both 3.3 V and 5 V display-driver MCUs. Designers should note the die variant is preferred only when board area is at an extreme premium; otherwise the QSOP-16 MAX1167CEEE+ is more cost-effective for standard panel-meter PCBs.
推薦
Factory Automation Analog Input Modules
Factory automation analog input modules - particularly those that aggregate 4-20 mA or 0-10 V field signals into a PLC backplane - benefit from the MAX1167C/D+ 16-bit resolution and 200 ksps throughput. The 4 single-ended inputs allow one ADC to handle four field channels, reducing cost per channel. The industrial -40 C to +85 C operating range and SAR deterministic conversion timing suit industrial control loops where deterministic latency matters. The 4.75 V-5.25 V analog supply. The unpackaged die form factor suits integration into custom ASIC modules where a packaged ADC would not fit the form factor.
推薦
Data Logger and Sensor Readout Boards
Multi-channel data loggers and sensor readout boards for environmental, structural-health, and scientific-instrument applications use the MAX1167C/D+ to digitize multiple sensor channels at 16-bit resolution and 200 ksps aggregate. The 4 single-ended inputs allow direct connection to bridge outputs, RTDs, or thermistor networks with appropriate signal conditioning. The SAR architecture provides consistent single-conversion timing for triggered captures, and the 2.7 V-5.25 V digital supply range simplifies interfacing to low-power MCUs in battery-deployed data loggers. The die form factor is preferred where the data-logger module must fit inside a sealed sensor housing with strict form-factor constraints.
推薦
推薦產品摘要
工程參考資料，適用於 MAX1167C/D+ — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MAX1167CEEE+ | MAX1168CEUE+ | MAX1067BCEE |
|---|---|---|---|---|
| Package | Die (unpackaged) | QSOP-16 - packaged | QSOP-16 - packaged | QSOP-16 - packaged |
| Brand | Analog Devices (Maxim Integrated) | Analog Devices | Analog Devices | Analog Devices |
| Resolution | 16 bit | 16 bit | 16 bit | 16 bit |
| Architecture | SAR | SAR | SAR | SAR |
主要差異化特點
- Unpackaged die form factor for hybrid-module integration (對比MAX1167CEEE+ (QSOP-16))
- 200 ksps throughput with 16-bit no-missing-codes performance (對比MAX1067BCEE)
- Wide 2.7 V-5.25 V digital supply range (對比MAX1168CEUE+)
設計說明
The MAX1167C/D+ is supplied as an unpackaged die, so the PCB substrate must accommodate die attach, wire bonding, and encapsulation. Provide a clean, low-impedance ground return directly under the die attach pad to minimize digital switching noise coupling into the analog inputs. Decouple both AVDD and DVDD with 0.1 uF ceramic capacitors placed as close as physically possible to the bond-wire pads, in parallel with a 10 uF tantalum or ceramic bulk capacitor. Route digital interface lines (SPI clock, chip select, data) away from analog input bond pads to minimize digital-to-analog crosstalk.
Power the analog and digital sections from separate, well-regulated supplies. AVDD should be derived from a low-noise LDO such as the ADP151 or similar to achieve the 16-bit no-missing-codes performance promised in the datasheet. The 4.75 V-5.25 V analog supply must remain within regulation during conversion - estimate: a 100 mV supply ripple on AVDD can degrade SNR by approximately 6 dB in 16-bit systems. Add bulk capacitance at the die-level supply bond pads and use a star-ground topology to isolate noisy digital return paths from the analog ground bond-pad.
Common pitfalls with the MAX1167C/D+ die variant include: (1) confusing the die variant with the QSOP-16 MAX1167CEEE+ - they are not drop-in replacements because the die has bond pads rather than package pins; (2) omitting the reference voltage capacitor - the MAX1167 typically needs a 10 uF reference bypass; (3) sampling-rate overclocking beyond 200 ksps which causes linearity errors. For QSOP-16 SMT assembly, choose the MAX1167CEEE+ instead to avoid die-attach complexity.
For multi-channel designs using all 4 analog inputs, ensure that input traces are matched in length and shielded from each other to prevent channel-to-channel crosstalk. Place the four input capacitors at the bond-wire pads rather than at the connector end of the trace to maximize filter effectiveness. Use a guard trace tied to analog ground between adjacent analog input bond pads if channel-to-channel isolation exceeds 80 dB is required. Verify mechanical drawings in the datasheet for the exact bond-pad coordinates before laying out the substrate.
合規資訊
RoHS compliant per Maxim Integrated product documentation. Not AEC-Q applicable (general-purpose ADC, not automotive-grade). Halogen-free status not confirmed in verified data.
