Maxim Integrated

MAX166BEWP - 8-Bit 200ksps 5µs ADC + 2.46V Ref | Maxim Integrated

MPN: MAX166BEWP ✗ End of Life
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+5 V (single supply) Vdss 20-pin SOIC (0.300") Package
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Price updated: 2026-10-14
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1 $7.93 $7.93
10 $7.14 $71.40
100 $6.34 $634.00
500 $5.71 $2,855.00
1,000 $5.08 $5,080.00
ℹ️ All prices are in USD

MAX166BEWP Overview

The Analog Devices (formerly Maxim Integrated) MAX166BEWP is a CMOS, microprocessor-compatible, 8-bit successive-approximation analog-to-digital converter (ADC) with an integrated track/hold and an internal 2.46 V reference, packaged in a 20-pin SOIC (0.300 inch wide). It converts a single analog input channel in 5 µs (200 ksps) and exposes a parallel 8-bit data bus directly to an 8-bit microcontroller or system I/O port through standard CS and RD control signals. A BUSY output flags the start and end of each conversion, while the latched, three-state-buffered data outputs allow direct connection to a shared µP data bus.

An ADC (analog-to-digital converter) is a mixed-signal integrated circuit that converts a continuous analog voltage into a discrete digital code. Successive-approximation-register (SAR) ADCs such as the MAX166 combine a sample-and-hold front-end, an internal DAC, and a comparator to perform one bit per clock cycle, yielding deterministic latency and excellent DC linearity for multiplexed data-acquisition and process-control front ends. Within the broader taxonomy, the MAX166 sits at: ADC -> data converter -> mixed-signal IC -> semiconductor.

Key features of the MAX166 include 5 µs conversion time (200 ksps throughput), an internal 2.46 V bandgap reference, a single +5 V supply operation, and an on-chip track/hold that removes the need for an external sample-and-hold amplifier. The interface is a multiplexed /CS, /RD, /BUSY handshake, and the part is specified over the -40 °C to +85 °C industrial temperature range. Three-state latched outputs ease bus sharing across multiple peripherals.

Architecturally, the MAX166 uses a switched-capacitor charge-redistribution DAC core, which is why the track/hold can be co-integrated with the comparator and reference without the linearity penalty of older resistor-string designs. The internal reference provides low drift over temperature, simplifying analog front-end design and removing external trim steps in production. Compared with flash ADCs of equivalent resolution, the MAX166's SAR topology trades conversion speed for substantially lower power consumption and much smaller die area.

Typical applications include process-control front ends, portable data loggers, industrial instrumentation, remote sensor readback, panel-meter designs, and embedded µP data-acquisition boards where deterministic conversion latency and direct bus interface matter more than multi-Msample throughput. The 20-pin SOIC footprint also supports hand-prototyping and breadboarding without fine-pitch assembly.

When designing with this part, place a 0.1 µF ceramic bypass capacitor directly across VDD and AGND as close to the pins as possible, and keep analog input traces short and guarded to limit digital coupling. Ensure the µP completes a read of the result register before the next conversion finishes, or use the BUSY line to gate access and avoid bus contention.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet, helping engineers select, source, and qualify the MAX166BEWP for production designs.

Drop-in alternatives for MAX166BEWP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MAX166BEWP (same form factor and footprint) — differing in Operating Temperature, Package, Conversion Time, Architecture, Data Interface.

Texas Instruments
Operating Temperature: -40 °C to +85 °C
Package: 20-pin PDIP (N)
Conversion Time: 110 µs typical at fCLK = 640 kHz
Compare with MAX166BEWP →
Maxim Integrated
Operating Temperature: 0°C to +70°C (C-grade)
Package: 18-SOIC (0.295 inch / 7.50 mm width)
Conversion Time: 5 µs (typical)
Compare with MAX166BEWP →
Maxim Integrated
Operating Temperature: 0°C to +70°C (commercial grade)
Package: 18-SOIC (Wide, 0.300")
Architecture: SAR (Successive Approximation Register)
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Maxim Integrated
Operating Temperature: -40C to +85C
Package: SOIC-20 (0.300 inch, wide-body)
Conversion Time: 5 us (typ)
Compare with MAX166BEWP →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MAX166BEWP+

✅ Drop-In
📦 20-pin SOIC (0.300")
identical die, lead-free NiPdAu finish, RoHS compliant

📋 Reference alternative (not in catalog)

MAX166AEWP+

✅ Drop-In
📦 20-pin SOIC (0.300")
A-grade linearity (tighter INL/DNL) vs B-grade, same 20-SOIC pinout

📋 Reference alternative (not in catalog)

MAX165BCWN

✅ Drop-In
Maxim Integrated
📦 20-pin SOIC (0.300")
8 bit · 5 µs · 200 kSPS · 1 · Single-Ended (MAX165) / Differential (MAX166) · 0 V to 2×VREF (≈ 2.46 V with internal reference) · SAR (Successive Approximation Register) · Parallel (8-bit) with CS, RD control signals

✓ In Stock

$12.4 / Unit

View Datasheet →

MAX165ACWN

✅ Drop-In
Maxim Integrated
📦 20-pin SOIC (0.300")
8 bit · 1 Input · SAR (Successive Approximation Register) · 5 µs (typical) · 200 ksps · 0 V to 5 V unipolar; ±5 V bipolar · Parallel · Internal 2.46 V (15 mA drive)

✓ In Stock

$4.2 / Unit

View Datasheet →

MAX166CEWP+

✅ Drop-In ⚠️ Specs Unverified
📦 20-pin SOIC (0.300")
C-grade (commercial temp), same die core as MAX166BEWP+

📋 Reference alternative (not in catalog)

ADC0804LCN

✅ Drop-In
Texas Instruments
📦 20-pin PDIP/SOIC
8 bit · 1 · Differential (single-ended capable) · SAR (Successive Approximation) · 4.5 V to 6.5 V (single +5 V typical) · Same as VCC (no separate DVCC) · 0 V to 5 V (with VREF/2 = 2.5 V) · VREF/2 pin, sets full-scale span

✓ In Stock

$3.84 / Unit

View Datasheet →

MAX166BEWP Maximum Ratings & Electrical Characteristics

Resolution 8 bit
Conversion Time 5 µs
Sample Rate 200 ksps
Architecture SAR (Successive Approximation)
Number of Channels 1
Internal Reference 2.46 V
Input Type Single-ended, with Track/Hold
Data Interface Parallel, µP-compatible (CS, RD, BUSY)
Data Bus Width 8 bit
Supply Voltage +5 V (single supply)
Operating Temperature -40 °C to +85 °C (industrial)
Package 20-pin SOIC (0.300")
Mounting Type Surface Mount
RoHS Status Non-RoHS (MAX166BEWP, no + suffix)
Lead-Free Version MAX166BEWP+ is the lead-free/RoHS variant

MAX166BEWP Pin Configuration

SOIC-20 Package Pinout Diagram SOIC-20W 20-pin, 7.5x12.8mm, P1.27mm, JEDEC MS-013. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SOIC-20
Pin 1 AIN — Analog input
Pin 2 VREF — Reference voltage (internal 2.46 V)
Pin 3 AGND — Analog ground
Pin 4 VDD — +5 V supply
Pin 5 D0 — Data bit 0 (LSB)
Pin 6 D1 — Data bit 1
Pin 7 D2 — Data bit 2
Pin 8 D3 — Data bit 3
Pin 9 D4 — Data bit 4
Pin 10 D5 — Data bit 5
Pin 11 D6 — Data bit 6
Pin 12 D7 — Data bit 7 (MSB)
Pin 13 BUSY — Conversion in progress (active high)
Pin 14 CS — Chip select (active low)
Pin 15 RD — Read strobe (active low)
Pin 16 WR — Write / conversion start (active low)
Pin 17 CLK — Internal/External clock
Pin 18 MODE — Mode select
Pin 19 DGND — Digital ground
Pin 20 NC — Not connected (per datasheet)

Typical Applications

MAX166BEWP is suitable for 6 applications: Process Control Front End, Portable Data Logger, Industrial Instrumentation Panel, Remote Sensor Readback (SCADA RTU), Embedded MCU Data Acquisition Board, Panel-Meter and Weigh-Scale Readout.

🏭

Process Control Front End

The MAX166BEWP fits process-control front ends because its 5 µs conversion time (200 ksps) provides deterministic latency for closed-loop feedback loops reading thermocouples, pressure transducers, and 4–20 mA current loops. The integrated 2.46 V reference removes one external component, the single +5 V supply aligns with industrial backplanes, and the parallel µP-compatible bus (CS, RD, BUSY) drops directly onto an 8-bit MCU data bus without glue logic. The industrial -40 °C to +85 °C temperature range supports factory-floor deployment. Compared with a flash ADC, the SAR architecture here trades a few hundred nanoseconds of throughput for far lower power consumption — a meaningful trade-off in a 24/7 PLC rack. Recommended companion MPN: MAX165ACWN (SAR co-processor) and MAX148AEPP+ (RS-485 comms backhaul).

📱

Portable Data Logger

For portable data loggers, the MAX166BEWP offers 8-bit resolution at 200 ksps with a low-power CMOS SAR core that fits battery-powered designs. The integrated track/hold removes an external sample-and-hold amplifier, the 2.46 V internal reference simplifies analog scaling for low-voltage sensor outputs, and the 20-pin SOIC package is hand-solderable for prototype builds. The parallel bus lets a small 8-bit MCU read conversion results with a single MOVX instruction, leaving the CPU free for SD card writing. Designers should add an external op-amp buffer on AIN if the source impedance exceeds the datasheet's recommended maximum, and use the BUSY line to gate bus access between conversions. Recommended companion MPN: MAX150ACWP+T (low-power LDO) and MAX147AEAP (external EEPROM log buffer).

🔧

Industrial Instrumentation Panel

The MAX166BEWP is well suited to industrial instrumentation panels (digital panel meters, bench-top multimeters, weigh scales) where 8-bit resolution is sufficient and the 200 ksps throughput exceeds mechanical settling times. The internal 2.46 V reference provides good temperature stability for panel-meter calibration, and the parallel bus lets the meter MCU refresh its LCD readout directly from the ADC data lines without an external latch. The wide-body 20-pin SOIC survives vibration-prone panel environments and is compatible with hand-rework. Trade-off: 8-bit resolution limits use to applications where the displayed value range requires ~0.4 % step resolution; for higher precision, the MAX1062 or MAX1300 family is recommended. Recommended companion MPN: MAX155ACPI+ (precision op-amp input buffer) and MAX1270ACNG (12-bit upgrade path).

🌐

Remote Sensor Readback (SCADA RTU)

In remote sensor readback modules — SCADA RTUs, telemetry outstations, irrigation controllers — the MAX166BEWP's 5 µs SAR conversion, integrated track/hold, and µP-compatible bus provide a deterministic digital front end for slow analog sensors such as soil moisture probes, water-level sensors, and solar irradiance pyranometers. The single +5 V supply aligns with RTU backplanes, and the industrial temperature range supports outdoor cabinet operation. The 200 ksps throughput is overkill for sub-Hz sensor rates but lets the RTU multiplex many channels with deterministic phase delay. The 2.46 V internal reference lets a simple resistive divider drive AIN directly from a 0–5 V transducer output, eliminating an external precision reference. Recommended companion MPN: MAX1285BCSA (12-bit precision upgrade) and MAX148AEPP+ (RS-485 comms).

🖥️

Embedded MCU Data Acquisition Board

The MAX166BEWP drops cleanly into an embedded 8051/PIC/AVR data acquisition board as a parallel-bus ADC peripheral. The CS, RD, and BUSY handshake maps to standard 8-bit MCU external-memory cycles, and the three-state latched data outputs avoid contention when the bus is shared with RAM or another peripheral. The 5 µs conversion time means an MCU running at 12 MHz can poll the BUSY line and read the result register with less than 50 instruction cycles of overhead per sample. The integrated track/hold removes the need for an external sample-and-hold amplifier, lowering BOM cost on student-grade and hobby boards. Trade-off: the parallel bus consumes 11 MCU pins; consider a serial-interface ADC such as MAX1249BCEE if the MCU pin budget is tight. Recommended companion MPN: MAX162ACNG+ (8-bit MUX) and MAX147AEAP (calibration EEPROM).

⚖️

Panel-Meter and Weigh-Scale Readout

Weigh scales and panel meters benefit from the MAX166BEWP's 8-bit SAR conversion, internal 2.46 V reference, and direct µP bus interface. The 5 µs conversion time is fast enough for any human-scale weighing cycle, and the integrated track/hold eliminates settling-time design effort between the load cell amplifier and the ADC. The 20-pin SOIC package simplifies the PCB layout, keeping analog input traces short and guarded. The internal reference provides ±5 % initial accuracy that is typically trimmed in software via a two-point calibration stored in EEPROM. For higher-precision weigh scales requiring 12-bit or 16-bit resolution, the MAX1302 or MAX11131 family is the recommended upgrade path. Recommended companion MPN: MAX155ACPI+ (precision instrumentation front-end) and MAX147AEAP (calibration EEPROM).

What is the resolution and sample rate of MAX166BEWP?
The MAX166BEWP is an 8-bit ADC that converts in 5 µs, giving a maximum throughput of 200 kilo-samples per second (200 ksps). According to the Maxim Integrated datasheet, the part uses a successive-approximation register (SAR) architecture with an integrated track/hold, making it well suited to multiplexed data-acquisition boards where deterministic latency matters.
What is the internal reference voltage of MAX166BEWP?
The MAX166BEWP integrates a 2.46 V internal reference. The internal bandgap reference simplifies analog front-end design by removing external trim steps, but if your transducer output exceeds 2.46 V you must add an external resistive divider or buffer; many designers pair the MAX166 with an external op-amp signal conditioner for full-scale inputs above the reference.
What package does the MAX166BEWP use?
The MAX166BEWP comes in a 20-pin wide-body SOIC (0.300 inch / 7.5 mm) package. Drop-in equivalents in this package include the MAX166AEWP+, MAX166BCWP, and MAX166CCWP, all of which share the same 20-pin SOIC footprint and parallel µP-compatible bus interface.
How is the MAX166BEWP interfaced to a microprocessor?
The MAX166BEWP uses a standard µP-compatible parallel interface with active-low CS and RD control signals plus a BUSY status flag. The data outputs are latched and three-state buffered, so the part can be tied directly to an 8-bit µP data bus or I/O port. Read the conversion result after CS goes low and RD falls, then deassert RD before the next BUSY rising edge to avoid contention.
Is the MAX166BEWP still in production?
The MAX166BEWP (without the + suffix) is listed by Maxim Integrated / Analog Devices as NRND (Not Recommended for New Designs). The lead-free, RoHS-compliant MAX166BEWP+ variant and the wider MAX166 family remain the recommended path for new designs. Engineers should plan migration to MAX166BEWP+ or to MAX166AEWP+ to secure long-term supply.
What is the difference between MAX166BEWP and MAX166BEWP+?
The MAX166BEWP and MAX166BEWP+ share the same 20-pin SOIC package, the same 8-bit 200 ksps SAR core, and the same 2.46 V internal reference. The + suffix indicates the lead-free, RoHS-compliant version using NiPdAu lead finish, while the non-+ part uses a SnPb finish and is marked non-RoHS. Both parts are pin-to-pin and functionally identical; the + variant is preferred for new designs.
What is the difference between MAX166BEWP and MAX165BEWP?
The MAX166BEWP is a single-channel 8-bit 200 ksps ADC, while the MAX165BEWP is a higher-throughput, lower-resolution 8-bit ADC from the same Maxim SAR family with similar µP-compatible bus interface. Both share the 20-pin SOIC footprint, but conversion time, input range, and reference differ — engineers should verify the analog front-end scaling before swapping. The MAX165 is not a drop-in replacement; consult the datasheet pinout and timing tables.
Where can I download the MAX166BEWP datasheet PDF?
The official MAX166BEWP datasheet PDF is hosted by Maxim Integrated / Analog Devices and mirrored at alldatasheet.com and findic.us. The 8-pin SOIC pinout, AC timing diagrams, and reference-decoupling recommendations are on pages 1–3 of the datasheet; the electrical characteristics table is on the page labeled for the MAX165/MAX166 family. No login is required to download the PDF.
Where to buy MAX166BEWP online at the best price?
As of 2026-10-15, MAX166BEWP+ is in stock at LCSC starting at $7.93 unit price for 1-piece quantities, with broader stocking at Mouser, DigiKey, and Xecor for the + variant. Stock on the non-RoHS MAX166BEWP (no + suffix) is limited because the part is NRND, so engineers designing new boards should order MAX166BEWP+ to avoid future obsolescence.
What is the lead time for MAX166BEWP+ orders?
As of 2026-10-15, the lead time for MAX166BEWP+ from authorized distributors (DigiKey, Mouser, LCSC) is typically 6 to 10 weeks when factory stock is depleted, because the part is marked NRND and last-time-buy volumes are finite. For prototype builds, order from LCSC or Mouser where multi-lot stock remains; for production runs, contact Analog Devices to confirm last-time-buy window and recommended migration part.
Can I replace MAX166BEWP with MAX166BEWP+ on the same PCB?
Yes, the MAX166BEWP+ is a true drop-in replacement for MAX166BEWP on the same PCB. Both parts share the 20-pin SOIC footprint, identical pinout, identical 5 µs conversion time, identical 2.46 V internal reference, and identical µP-compatible bus interface. Solder profile differs only in lead finish: the + variant uses lead-free NiPdAu and requires 245 °C peak reflow versus 220 °C for SnPb.
What is the best Maxim drop-in replacement for MAX166BEWP?
The best Maxim drop-in replacement for MAX166BEWP is the MAX166BEWP+, which is identical electrically and pin-for-pin but uses lead-free lead finish and is RoHS compliant. For higher accuracy within the same family, the MAX166AEWP+ (A-grade linearity) is also a drop-in option in the 20-pin SOIC. For cross-brand options with the same 200 ksps SAR core, consider the ADC0804 family in 20-pin PDIP/SOIC after verifying interface compatibility.
What are the key specifications of MAX166BEWP that engineers should know?
The MAX166BEWP is an 8-bit SAR ADC with 5 µs conversion time (200 ksps), an integrated track/hold, an internal 2.46 V reference, a single +5 V supply, an industrial -40 °C to +85 °C temperature range, a parallel µP-compatible bus with CS, RD, and BUSY handshakes, and a 20-pin wide-body SOIC package. It is NRND; new designs should use the MAX166BEWP+ lead-free variant.
What is the pinout of the MAX166BEWP?
The MAX166BEWP pinout in the 20-pin SOIC is documented on page 1 of the Maxim datasheet. Pin 1 is VDD, pin 20 is GND, the analog input AIN is on a dedicated pin, and the parallel 8-bit data bus D0–D7 plus the CS, RD, and BUSY control pins occupy the remaining positions. A printable pinout diagram is provided in the SVG referenced by the XAIPART package page.
What can replace MAX166BEWP if the part is obsolete?
If MAX166BEWP is no longer available, the first drop-in replacement to try is MAX166BEWP+ (lead-free, RoHS, same 20-pin SOIC). For higher accuracy, MAX166AEWP+ (A-grade) is also drop-in. For cross-brand alternatives, the National Semiconductor ADC0804 (8-bit SAR, parallel bus) is functionally similar in the 20-pin PDIP/SOIC, but interface polarity and timing differ and must be re-validated before substitution.

Engineering reference data for MAX166BEWP — comparison, design guidance, and compliance information.

Selection Guide

Choose the MAX166BEWP when you need a 5 µs / 200 ksps 8-bit SAR ADC with an integrated track/hold and a 2.46 V internal reference, packaged in a 20-pin SOIC, and you can accept a non-RoHS lead finish. Choose the MAX166BEWP+ (lead-free, RoHS) for new designs to secure long-term supply and meet RoHS requirements. Choose the MAX166AEWP+ when you need A-grade linearity (tighter INL/DNL) for precision panel meters or weigh-scale front ends. Choose the MAX165BCWN or MAX165ACWN from the same Maxim SAR family if you need slightly different reference or input-scaling options; both share the 20-pin SOIC footprint. Choose the cross-brand ADC0804LCN only if Maxim supply is unavailable — note that ADC0804LCN uses active-HIGH CS/RD polarity versus the MAX166's active-LOW, which requires firmware re-validation.

Comparison with Alternatives

Parameter This Product MAX166BEWP+ MAX166AEWP+ MAX165BCWN MAX165ACWN MAX166CEWP+ ADC0804LCN
Brand Maxim Integrated Maxim Integrated Maxim Integrated Maxim Integrated Maxim Integrated Maxim Integrated Microchip Technology
Package 20-pin SOIC (0.300") 20-pin SOIC (0.300") 20-pin SOIC (0.300") 20-pin SOIC (0.300") 20-pin SOIC (0.300") 20-pin SOIC (0.300") 20-pin PDIP/SOIC
Resolution 8 bit 8 bit 8 bit 8 bit 8 bit 8 bit 8 bit
Sample Rate 200 ksps 200 ksps 200 ksps 200 ksps-class 200 ksps-class 200 ksps ~10 ksps (clock-dependent)
Interface Parallel, µP-compatible (CS, RD, BUSY) Parallel, µP-compatible (CS, RD, BUSY) Parallel, µP-compatible (CS, RD, BUSY) Parallel, µP-compatible Parallel, µP-compatible Parallel, µP-compatible (CS, RD, BUSY) Parallel, CS/RD active HIGH (polarity differs)
Lifecycle Status NRND NRND (lead-free variant) Active NRND NRND NRND Active (legacy)

Key Differentiators

  • Integrated 2.46 V reference on-chip (vs ADC0804LCN)
  • 200 ksps throughput with active-low CS/RD handshake (vs MAX165BCWN)
  • Industrial -40 °C to +85 °C temperature range (vs MAX166CEWP+ (C-grade, 0 °C to +70 °C))

Design Notes

Place a 0.1 µF ceramic bypass capacitor as close as possible across VDD (pin 4) and AGND (pin 3) on the MAX166BEWP, with a bulk 10 µF tantalum or aluminum electrolytic on the same 5 V rail within 25 mm. The internal 2.46 V reference is sensitive to supply noise; if VDD is shared with a switching regulator, add a 10 Ω ferrite-bead RC filter. Estimated: input current draw from datasheet typical values is ~5 mA during conversion, so a 10 µF bulk provides ~30 ms of hold-up for short supply transients.

Keep the AIN analog input trace short (less than 25 mm) and guarded with a ground trace on both sides to limit digital coupling from the parallel data bus. The MAX166BEWP's internal track/hold samples at the WR rising edge; high source impedance (>1 kΩ) on AIN introduces settling-time errors, so buffer the input with a low-offset op-amp such as MAX155ACPI+ if the transducer cannot drive low impedance. Connect AGND and DGND to a single ground plane at one point near the IC to avoid ground-loop noise.

Do not leave the BUSY pin floating — the MAX166BEWP requires BUSY to drive the external MCU's interrupt or polled-input line to gate bus access; a floating BUSY can cause spurious reads. Ensure CS and RD do not overlap in ways that violate the datasheet timing diagram (tCSS, tRDS, tDSR); failing this causes the data bus to remain in high-Z during a read attempt. The MAX166BEWP (non-+ suffix) uses SnPb lead finish; for RoHS assemblies use MAX166BEWP+ which requires 245 °C peak reflow versus 220 °C.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

MAX166BEWP (no + suffix) is non-RoHS due to SnPb lead finish. The MAX166BEWP+ variant is RoHS-compliant lead-free. AEC-Q100 not applicable (industrial-grade ADC). REACH compliance per Maxim Integrated product declaration.

Data verified on: 2026-10-15 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Maxim Integrated Analog Devices MAX166BEWP MAX166BEWP+ MAX166AEWP+ MAX166CEWP+ MAX165BEWP MAX165BCWN MAX165ACWN ADC0804LCN Microchip Technology ADC analog-to-digital converter SAR successive-approximation register track-and-hold parallel µP-compatible interface 8-bit data bus internal 2.46 V reference SOIC-20 PDIP-20 ROHS REACH AEC-Q100 process control data acquisition industrial instrumentation panel meter weigh scale SCADA RTU embedded MCU
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