MC13770FCR2 - 2.1-2.4 GHz W-CDMA Front-End IC | NXP
MPN: MC13770FCR2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.55 | $2.55 |
| 10 | $2.3 | $23.00 |
| 100 | $1.97 | $197.00 |
| 500 | $1.65 | $825.00 |
| 1,000 | $1.4 | $1,400.00 |
MC13770FCR2 Overview
A Front-End IC (FEIC) is a multi-function radio block that consolidates the first stages of a receiver chain (typically LNA plus down-conversion mixer) into a single die. Within the broader system hierarchy, the MC13770 sits between the antenna switch / duplexer and the channel-filter / baseband section; it is a member of the RF transceiver IC family, which itself belongs to the wireless front-end module (FEM) and RF IC product categories. By replacing discrete LNA-plus-mixer designs, an FEIC reduces board area, BOM count, and inter-stage matching complexity while still delivering gain and noise figure suitable for 3GPP sensitivity targets.
Key features of the MC13770 include 15 dB RF gain across the 2.1-2.4 GHz band, an integrated single-band down-converter mixer, low-noise LNA front-end optimized for W-CDMA, 2.7 V to 3 V single-supply operation with approximately 8 mA quiescent current, ESD ratings of 100 V HBM and 30 V MM, and a compact 12-VFQFN exposed-pad package that improves thermal dissipation while providing a low-inductance ground reference. The exposed pad also serves as the primary RF ground, simplifying PCB layout.
Technically, the MC13770 uses a heterodyne-style receive chain with on-chip local-oscillator buffering. The 3 V supply rail is typical of battery-powered mobile terminals of its era, and the modest 8 mA supply current makes it usable in early smartphone and feature-phone platforms. The exposed-pad QFN-12 package provides short bond wires, which minimizes stray inductance at GHz frequencies - critical for noise figure and gain stability. Designers should treat the exposed pad as RF ground and place adequate copper for thermal relief.
Typical applications include W-CDMA / UMTS handset receivers, mobile phone front-end modules, wireless data-card receivers, and embedded cellular modules for industrial IoT gateways. The 2.1-2.4 GHz band also covers 2.4 GHz ISM-adjacent W-CDMA extensions and some WLAN coexistence scenarios.
When designing with the MC13770, route RF inputs and outputs as controlled-impedance 50 ohm lines, place decoupling capacitors as close to the supply pin as possible, and ensure the exposed pad is soldered to a continuous ground plane for both thermal and RF performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical RF design notes not found in the manufacturer datasheet.
Drop-in alternatives for MC13770FCR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC13770FCT
✅ Drop-In📋 Reference alternative (not in catalog)
MC13770FC
✅ Drop-In📋 Reference alternative (not in catalog)
MC13770FCR2 Maximum Ratings & Electrical Characteristics
| Function | Single-band LNA + mixer front-end IC (FEIC) |
| RF Type | W-CDMA |
| Frequency Range | 2.1 GHz to 2.4 GHz |
| Gain | 15 dB |
| Supply Voltage | 2.7 V to 3 V |
| Supply Current | 8 mA (typ) |
| Package / Case | 12-VFQFN Exposed Pad (QFN-12, 3x3 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| ESD Rating (HBM) | <= 100 V |
| ESD Rating (MM) | <= 30 V |
| Number of Pins | 12 |
MC13770FCR2 Pin Configuration
| Pin 1 | RF_IN — RF signal input from antenna switch or duplexer |
| Pin 2 | GND — Ground |
| Pin 3 | LNA_OUT — LNA output to mixer input |
| Pin 4 | GND — Ground |
| Pin 5 | MIX_IN — Mixer RF input (internally connected from LNA) |
| Pin 6 | LO_IN — Local oscillator input |
| Pin 7 | IF_OUT — Mixer IF output |
| Pin 8 | VCC — 2.7 V to 3 V supply |
| Pin 9 | GND — Ground |
| Pin 10 | BIAS — External bias reference |
| Pin 11 | EN — Enable / power-down control |
| Pin 12 | GND — Ground |
Typical Applications
MC13770FCR2 is suitable for 6 applications: W-CDMA Handset Receiver Front-End, Mobile Phone RF Front-End Module, Wireless Data Card Receiver, Embedded Cellular IoT Module, WLAN / W-CDMA Coexistence Receiver, Test and Measurement Reference Receiver.
W-CDMA Handset Receiver Front-End
The MC13770FCR2 is purpose-built for W-CDMA / UMTS handset receivers, where its integrated LNA plus down-conversion mixer in a 12-VFQFN package directly supports Band I (2.11-2.17 GHz) and adjacent downlink frequencies. Its 15 dB conversion gain establishes a low cascaded noise figure when paired with the antenna switch and duplexer, while the 8 mA typical supply current at 2.7-3 V keeps the receive path within the power budget of a single Li-ion cell. Place the IC immediately after the duplexer, with a 50 ohm controlled-impedance trace to the RF input and a matched LO feed from the transceiver synthesizer; this topology preserves the 3GPP sensitivity target and provides adequate gain headroom for AGC.
Recommended
Mobile Phone RF Front-End Module
The MC13770FCR2 is a strong fit inside a 2G/3G feature-phone or early smartphone front-end module, where it sits between the antenna switch and the baseband transceiver. Its 2.1-2.4 GHz band, single 3 V supply, and integrated LNA-plus-mixer function reduce external component count on already-crowded phone PCBs. The 12-VFQFN 3x3 mm exposed-pad package also helps RF grounding and thermal dissipation in a sealed handset enclosure. Pair it with a power amplifier, duplexer, and baseband transceiver; the 15 dB gain block ensures the receiver chain meets sensitivity targets with margin for production variation.
Recommended
Wireless Data Card Receiver
PCMCIA / PC Card and USB wireless data cards for HSDPA / UMTS networks use the MC13770FCR2 as the first-stage receive path. Its 15 dB gain and 2.1-2.4 GHz band match the UMTS downlink, and the small 3x3 mm QFN-12 footprint suits the dense PCB of a removable wireless card. The 2.7-3 V supply aligns with the on-card LDO rails derived from the USB or PCMCIA bus power. Design the LO distribution from the companion transceiver with short matched traces, and ensure the exposed pad has a continuous ground pour under the IC for thermal relief.
Recommended
Embedded Cellular IoT Module
Industrial gateways and remote-asset trackers that need 3G/UMTS fallback connectivity can use the MC13770FCR2 as the W-CDMA receive front-end, particularly in designs targeting the 2.1 GHz UMTS band. Its integrated LNA and mixer simplify BOM and reduce calibration complexity for low-volume industrial designs. The 8 mA supply current is acceptable for always-on IoT modules with average power budgets in the hundreds of milliwatts. Place a SAW filter between the antenna and the MC13770 RF input to reject out-of-band blockers, and use a shielded enclosure around the front-end to control radiated emissions.
Recommended
WLAN / W-CDMA Coexistence Receiver
In dual-mode 2.4 GHz WLAN plus W-CDMA designs, the MC13770FCR2 can serve as the dedicated W-CDMA receive branch while a separate 2.4 GHz WLAN transceiver handles the Wi-Fi side. The 2.1-2.4 GHz overlap requires careful filtering to prevent WLAN transmitters from desensitizing the W-CDMA LNA; an external SAW or FBAR duplexer is mandatory. The MC13770's 15 dB gain and integrated mixer reduce the bill of materials for the coexistence design. Place the IC physically isolated from the WLAN power amplifier and use separate supply decoupling to minimize LO leakage and reciprocal mixing.
Recommended
Test and Measurement Reference Receiver
Test equipment manufacturers building W-CDMA reference receivers or production test fixtures for mobile devices can use the MC13770FCR2 as a known-good LNA-plus-mixer front-end in the 2.1-2.4 GHz band. Its datasheet-specified 15 dB gain and 8 mA supply current provide a predictable, repeatable reference block for calibrating other receivers. The 12-VFQFN package is straightforward to integrate on a test PCB with controlled-impedance RF traces and a calibrated LO source. This makes the IC well-suited to ATE reference designs and bench characterization setups that target UMTS Band I performance.
Recommended
Recommended Products Summary
Engineering reference data for MC13770FCR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC13770FCT | MC13770FC |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 12-VFQFN Exposed Pad (QFN-12, 3x3 mm) | 12-VFQFN Exposed Pad (QFN-12, 3x3 mm) - same | 12-VFQFN Exposed Pad (QFN-12, 3x3 mm) - same |
| Frequency Range | 2.1 GHz to 2.4 GHz | 2.1 GHz to 2.4 GHz | 2.1 GHz to 2.4 GHz |
| Gain | 15 dB | 15 dB | 15 dB |
| Supply Voltage | 2.7 V to 3 V | 2.7 V to 3 V | 2.7 V to 3 V |
| Supply Current | 8 mA (typ) | 8 mA (typ) | 8 mA (typ) |
| RF Type | W-CDMA | W-CDMA | W-CDMA |
| Packaging Media | Tape & Reel (13-inch reel) | Cut Tape | Bulk / uncommitted media |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Single-band integrated LNA plus mixer FEIC for W-CDMA (vs MC13770FCT)
- Original 3 V single-supply operation tuned for Li-ion batteries (vs MC13770FC)
- Compact 3x3 mm QFN-12 with 8 mA typical current (vs MC13770FC (bulk packaging))
Design Notes
Treat the exposed pad of the QFN-12 package as both primary RF ground and primary thermal path. Solder it to a continuous, unbroken ground plane on the top layer, with multiple ground vias stitching around the package periphery to the inner ground layers. Avoid routing any signal trace under the package, and keep the RF input, LO input, and IF output traces as short and straight as possible, each maintained at 50 ohm controlled impedance.
Place supply decoupling capacitors as close as physically possible to the VCC pin: a 100 nF ceramic in parallel with a 10 nF or 1 nF high-frequency bypass cap, plus a 4.7 uF or larger bulk cap on the same supply trace. This star-grounding and stacked-decoupling approach suppresses supply-induced LO pulling and prevents gain ripple in the 2.1-2.4 GHz band, which is critical because the LO frequency is close to the RF input frequency.
The MC13770's intended receive topology assumes an external SAW or FBAR band filter between the duplexer and the RF input. Without this filter, out-of-band blockers (including the W-CDMA uplink band and the 2.4 GHz ISM band) can desensitize the LNA and degrade cascaded noise figure. Add the SAW filter as the closest preceding component to the RF input pin, and route its output to the IC through a short, impedance-controlled microstrip or coplanar waveguide trace.
Avoid sharing the LO trace with any digital or switching signals: the LO feed is single-ended and prone to coupling. Route it on the opposite side of the ground plane from the IF output, use ground via stitching along both sides of the trace, and place a small series resistor (10-22 ohm) close to the LO input pin if the source synthesizer is known to deliver sharp edges. This minimizes reciprocal mixing and improves receiver EVM.
Compliance Information
Lifecycle status is obsolete as of 2026-10-16. Compliance fields (RoHS, REACH, lead-free, halogen-free) are not explicitly stated in the provided verified web data; set to unknown rather than assume.
