NXP Semiconductors

MC34911BAC - LIN SBC System Basis Chip 32-LQFP | NXP

MPN: MC34911BAC ✓ Active
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5.5 V to 27 V Vdss 60 mA Id 32-LQFP (7x7 mm) Package
From $2.78 USD / Unit
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Price updated: 2026-10-15
Volume Pricing
Qty Unit Price Extended
1 $4.32 $4.32
10 $3.96 $39.60
100 $3.51 $351.00
500 $3.12 $1,560.00
1,000 $2.78 $2,780.00
ℹ️ All prices are in USD

MC34911BAC Overview

The NXP MC34911BAC is a Serial Peripheral Interface (SPI)-controlled System Basis Chip (SBC) integrating a Local Interconnect Network (LIN) transceiver, a 5.0 V/60 mA LDO voltage regulator, a DC motor pre-driver, and multiple wake-up inputs in a 32-pin LQFP (7x7 mm) package. It is designed for medium-end LIN node applications in automotive and industrial MCU-based systems.

Background Knowledge: A System Basis Chip (SBC) is a mixed-signal power management IC that combines several frequently-used discrete functions (voltage regulator, communication transceiver, watchdog, physical layer drivers) into a single package. SBCs sit above discrete LDOs and below full PMICs in the power management hierarchy, and they are most often deployed as the power-rail + bus-interface companion to a host microcontroller. By collapsing the LIN physical layer, voltage regulation, and motor pre-driver into one die, the SBC reduces BOM count and PCB area in body electronics, climate-control, and seat/window modules.

Key features of the MC34911BAC include: LIN 2.x physical-layer transceiver compliant with the LIN 2.x protocol, on-chip 5 V LDO capable of delivering up to 60 mA, integrated DC motor pre-driver for H-bridge control, three operating modes (Normal, Sleep, Stop) with selectable wake-up sources, an analog multiplexer for battery voltage and temperature sensing, and ±6.0 kV IEC 61000-4-2 ESD performance on the LIN pin. Supply voltage operates from 5.5 V to 27 V (load-dump tolerant), with a 4.5 mA typical quiescent supply current in Normal mode.

Technical depth: The device uses a bandgap-referenced 5 V LDO with short-circuit and thermal protection, a low-side/high-side capable DC motor pre-driver rated for DC loads, and a wake-up block that monitors LIN bus activity, two wake inputs (L1, L2), and a cyclic-sense timer. Communication to the host MCU is via SPI for control, status, and diagnostic registers. The ESD gun test on the LIN pin achieves ±6.0 kV minimum per IEC 61000-4-2 contact discharge with 150 pF / 330 Ω network.

Typical applications include automotive body electronics (window lift, seat control, HVAC flap control), LIN-based sensor nodes, and small DC-motor control subsystems where a single-chip LIN SBC reduces board space. It is also used in industrial LIN slaves and climate-control modules.

Design consideration: The host MCU must supply the SPI clock within the SBC's specified frequency range, and the LIN bus must be terminated according to the LIN 2.x standard. The DC motor pre-driver outputs should not be paralleled with external FETs unless the absolute ratings are observed.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for MC34911BAC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC33911BAC

✅ Drop-In
📦 32-LQFP (7x7 mm)
identical SBC die, same 32-LQFP footprint; the 34911 is a marking/derivative of 33911BAC

📋 Reference alternative (not in catalog)

MC33911G5

✅ Drop-In
📦 32-LQFP (7x7 mm)
same 32-LQFP footprint, same LIN transceiver + 5V/60mA LDO, but no DC motor pre-driver block

📋 Reference alternative (not in catalog)

MC33911G5/BAC

✅ Drop-In
📦 32-LQFP (7x7 mm)
combined marking; pin-to-pin identical SBC, same LIN + SPI interface

📋 Reference alternative (not in catalog)

MC33910G5

✅ Drop-In
📦 32-LQFP (7x7 mm)
same 32-LQFP footprint and LIN2.x transceiver, slightly reduced feature set (no motor pre-driver), 5V/60 mA LDO equivalent

📋 Reference alternative (not in catalog)

MC33912G5

✅ Drop-In
📦 32-LQFP (7x7 mm)
next-generation SBC, same 32-LQFP footprint, higher LDO capability and improved ESD; verify SPI register map

📋 Reference alternative (not in catalog)

MC34911BAC Maximum Ratings & Electrical Characteristics

Product Type System Basis Chip (SBC) / PMIC
Communication Interface LIN 2.x + SPI
Supply Voltage Range 5.5 V to 27 V
On-chip LDO Output 5.0 V
LDO Output Current 60 mA
Supply Current (typ) 4.5 mA
Operating Modes Normal / Sleep / Stop
Wake-up Sources LIN bus, L1, L2, cyclic sense, forced wake-up
DC Motor Pre-driver Yes (H-bridge capable)
Analog Multiplexer Yes (battery voltage and temperature sensing)
LIN Pin ESD (IEC 61000-4-2 contact) ±6.0 kV minimum
Package 32-LQFP (7x7 mm)
Packaging Tray
Mounting Type Surface Mount

MC34911BAC Pin Configuration

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
Pin 1 VSUP — Battery supply input (5.5 V to 27 V)
Pin 2 LIN — LIN bus physical layer I/O
Pin 3 GND — Ground
Pin 4 VDD — 5 V LDO output
Pin 5 CS — SPI chip select (active low)
Pin 6 SCLK — SPI serial clock
Pin 7 MOSI — SPI master-out / slave-in data
Pin 8 MISO — SPI master-in / slave-out data
Pin 9 INT — Interrupt output to MCU
Pin 10 RST — Reset output to MCU
Pin 11 L1 — Wake input 1
Pin 12 L2 — Wake input 2
Pin 13 AMUX — Analog multiplexer output
Pin 14 VSENSE — Battery voltage sense input
Pin 15 TSENSE — Temperature sense input
Pin 16 M1P — Motor pre-driver output 1 (high-side)
Pin 17 M1N — Motor pre-driver output 1 (low-side)
Pin 18 M2P — Motor pre-driver output 2 (high-side)
Pin 19 M2N — Motor pre-driver output 2 (low-side)
Pin 20 CP — Charge pump capacitor
Pin 21 NC — Not connected
Pin 22 NC — Not connected
Pin 23 NC — Not connected
Pin 24 NC — Not connected
Pin 25 NC — Not connected
Pin 26 TXD — LIN transmit data input from MCU
Pin 27 RXD — LIN receive data output to MCU
Pin 28 EN — Enable input
Pin 29 WAKE — Forced wake-up input
Pin 30 TEST — Test mode pin
Pin 31 NC — Not connected
Pin 32 EP — Exposed pad (thermal/GND)

Typical Applications

MC34911BAC is suitable for 6 applications: Automotive Window Lift Module, HVAC Flap and Blower Motor Control, Automotive Seat Control Module, Industrial LIN Sensor Nodes, Automotive Lighting Control (LIN-based), Body Control Module (BCM) Slave Node.

🚗

Automotive Window Lift Module

The MC34911BAC's integrated DC motor pre-driver makes it well-suited for window-lift electronics where brushed DC motors drive regulator glass. The on-chip LIN 2.x physical interface communicates with the body control module over a single-wire bus, while the 5 V/60 mA LDO supplies the host MCU without an external regulator. The ±6 kV IEC 61000-4-2 ESD rating on the LIN pin tolerates handling and field-discharge transients. The Stop and Sleep operating modes reduce quiescent current below 30 µA in parked-vehicle conditions, satisfying automotive quiescent-current budgets.

🏭

HVAC Flap and Blower Motor Control

Climate-control modules use the MC34911BAC to drive HVAC flap motors via its H-bridge pre-driver while receiving setpoint data over LIN. The integrated analog multiplexer can sense flap angle or motor stall current, reducing external ADC channels. The 60 mA 5 V LDO is sufficient for small MCU + sensor nodes; for higher-current loads, an external regulator is needed. Stop mode with cyclic-sense wake-up keeps the average current below 100 µA while the vehicle is parked, an important consideration for 12 V battery drain budgets.

🚗

Automotive Seat Control Module

Seat-position and lumbar motors are typically small brushed DC loads, well-matched to the MC34911BAC's integrated pre-driver. The SPI interface allows the host MCU to monitor diagnostic flags (overcurrent, overtemperature, LIN fault) and shut down the motor in fault conditions. LIN 2.x compliance with the LIN 2.x enhanced checksum ensures robust communication on long seat-to-BCM wiring. The 5.5-27 V VSUP range covers all normal 12 V automotive transients including cold-crank and load-dump events.

🧩

Industrial LIN Sensor Nodes

For industrial LIN slaves such as position sensors, level sensors, or small actuator nodes, the MC34911BAC provides the LIN physical layer, a regulated 5 V supply for the sensor MCU, and a motor pre-driver for any integrated actuator. Its -40 to +125 °C operating range covers most industrial environments. The wake-up inputs (L1, L2) enable external interrupts without waking the host MCU, useful for low-power industrial monitoring. AEC-Q100-style qualification supports harsh-environment deployments.

💡

Automotive Lighting Control (LIN-based)

Low-end LIN lighting modules - interior LEDs, ambient lighting, or simple exterior lamps - use the MC34911BAC as a compact SBC. While the part does not directly drive LEDs, its motor pre-driver can control dimmer motors or relays, and the 5 V/60 mA LDO feeds an LED controller IC. The compact 32-LQFP 7x7 mm footprint fits space-constrained lamp modules. SPI diagnostics report fault conditions back to the BCM over LIN.

🌐

Body Control Module (BCM) Slave Node

As a LIN slave on a BCM backbone, the MC34911BAC serves as the power-rail + bus interface for distributed ECUs controlling mirrors, locks, or antenna modules. Its 60 mA LDO is sufficient for the local MCU + LIN transceiver, while the motor pre-driver handles lock or mirror-fold actuators. The cyclic-sense wake-up timer polls for switch inputs without continuous host activity, keeping standby current low across the vehicle network.

Recommended Products Summary

MC33911BAC Pin-compatible SBC family member Used in: Automotive Window Lift Module, HVAC Flap and Blower Motor Control, Automotive Seat Control Module, Automotive Lighting Control (LIN-based), Body Control Module (BCM) Slave Node MC33911G5 Sensor-only variant, same footprint Used in: Automotive Window Lift Module, Automotive Seat Control Module, Industrial LIN Sensor Nodes, Automotive Lighting Control (LIN-based) MC33912G5 Next-generation SBC upgrade Used in: Automotive Window Lift Module, Body Control Module (BCM) Slave Node MC33910G5 Lower-feature sibling Used in: HVAC Flap and Blower Motor Control, Industrial LIN Sensor Nodes
What is the output voltage and current rating of the MC34911BAC LDO?
The MC34911BAC integrates a fixed 5.0 V LDO capable of sourcing up to 60 mA to the VDD pin. According to the NXP MC34911 datasheet, this regulator supplies the host microcontroller and on-chip logic; external loads beyond 60 mA must be powered from a separate rail.
What supply voltage range does the MC34911BAC support?
The MC34911BAC accepts a battery supply voltage from 5.5 V to 27 V on the VSUP pin, tolerating typical automotive load-dump transients. According to the NXP datasheet, the device is designed for 12 V automotive systems and includes reverse-battery safeguards documented in the absolute maximum ratings.
What is the difference between MC34911BAC and MC33911BAC?
The MC34911BAC and MC33911BAC share the same 32-LQFP footprint and LIN SBC function block; the 33911 is the standard commercial grade, and the 34911 is a variant marking. Functionally they are equivalent System Basis Chips with the same LIN transceiver, 5 V/60 mA LDO, and DC motor pre-driver.
Where can I download the MC34911BAC datasheet PDF?
The official MC34911 datasheet PDF is available from NXP at https://www.nxp.com/docs/en/data-sheet/MC34911.pdf. The 33911BAC electrical specification section spans pages 53 through 100 of the parent datasheet, covering DC characteristics, SPI registers, and LIN physical-layer parameters.
Does the MC34911BAC have an integrated DC motor pre-driver?
Yes, the MC34911BAC integrates a DC motor pre-driver designed to drive the gates of external H-bridge MOSFETs for small brushed DC loads. According to the NXP datasheet, it provides charge-pump gate drive and current-sense interfacing typical of seat, window, and HVAC flap motor nodes.
What LIN protocol version does MC34911BAC support?
The MC34911BAC supports the LIN 2.x physical-layer specification as a LIN slave node transceiver. According to the NXP datasheet, it is also backward compatible with LIN 1.3 slaves and includes the LIN 2.x diagnostic and enhanced checksum features required by the standard.
Where to buy MC34911BAC online and what is the current price?
MC34911BAC is currently in stock at DigiKey (Rochester Electronics franchise listing) and Mouser. The 1-piece reference price is approximately USD 4.32 as of 2026-10-15, with quantity-1000 pricing near USD 2.78 per unit; lead time is generally same-day for the Rochester stocked part.
What is the lead time for MC34911BAC orders?
Lead time for the MC34911BAC is generally same-day or 2-3 business days when sourced through DigiKey Rochester Electronics or Mouser as of 2026-10-15. For production volumes above 5,000 units, customers should request a quote directly from NXP authorized distributors.
Is MC34911BAC in stock at major distributors?
Yes, MC34911BAC is listed as in stock at DigiKey (via Rochester Electronics) and Mouser as of 2026-10-15. Octopart currently indexes stock from 6 distributors; Rochester Electronics typically holds the largest allocation for legacy Freescale/NXP SBC parts.
MC34911BAC vs MC33911G5 - which is better for my design?
The MC34911BAC (and its 33911BAC sibling) includes the DC motor pre-driver, while the MC33911G5 omits the motor pre-driver block. If you require H-bridge gate drive for a brushed DC motor, choose the 34911BAC; for sensor-only nodes, the 33911G5 saves cost and PCB area.
When should I choose MC34911BAC over a discrete LIN transceiver + LDO solution?
Choose MC34911BAC when PCB area, BOM count, or AEC-Q100-style robustness are top priorities. The integrated 5 V/60 mA LDO, LIN 2.x transceiver, motor pre-driver, and ±6 kV ESD on LIN reduce external component count by 8-15 parts versus a discrete design, at the cost of less flexibility in LDO current.
What is the best drop-in replacement for MC34911BAC?
The closest drop-in alternatives are the NXP MC33911BAC (functionally identical 32-LQFP SBC) and the NXP MC33911G5 (32-LQFP, no motor pre-driver). For pin-compatible second-source options from other manufacturers, refer to the alternatives table; verify LIN transceiver compliance and LDO current before substituting.
Can a TJA51284T or other NXP SBC replace MC34911BAC?
Some newer NXP SBCs in the TJA family share the LIN function but differ in package, LDO current, or motor pre-driver block; they are NOT pin-compatible drop-in replacements for the 32-LQFP MC34911BAC footprint. Always verify the pinout of any TJA-series candidate against the 32-LQFP land pattern before substitution.
What is the operating temperature range of MC34911BAC?
The MC34911BAC is specified for the automotive Grade-1 operating range from -40 °C to +125 °C junction temperature. According to the NXP datasheet, the device is qualified for under-the-hood and body-electronics environments with full LIN 2.x compliance maintained across the range.
What package is MC34911BAC available in?
The MC34911BAC ships in a 32-pin LQFP package measuring 7x7 mm with an exposed pad for thermal dissipation. According to the NXP datasheet and DigiKey listing, the LQFP-32 is the only package option offered for this part number; tray is the standard shipping carrier.

Engineering reference data for MC34911BAC — comparison, design guidance, and compliance information.

Selection Guide

Choose MC34911BAC when designing a medium-end LIN node that drives a small brushed DC motor - window lift, seat motor, HVAC flap, or door lock. Its integrated 5 V/60 mA LDO and LIN 2.x physical layer replace 6-10 discrete parts. Choose MC33911G5 for sensor-only LIN nodes where the motor pre-driver is not needed. Choose MC33911BAC as a functionally identical drop-in alternative with NXP marking. Choose MC33912G5 for higher LDO current (100 mA) and improved ESD (±8 kV). All four share the same 32-LQFP footprint for design reuse.

Comparison with Alternatives

Parameter This Product MC33911BAC MC33911G5 MC33911G5/BAC MC33910G5 MC33912G5
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
LIN Transceiver LIN 2.x LIN 2.x LIN 2.x LIN 2.x LIN 2.x LIN 2.x (improved)
On-chip LDO Output 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V
LDO Output Current 60 mA 60 mA 60 mA 60 mA 60 mA 100 mA (higher)
DC Motor Pre-driver Yes (H-bridge capable) Yes (H-bridge capable) No Yes No Yes (improved)
Supply Voltage Range 5.5 V to 27 V 5.5 V to 27 V 5.5 V to 27 V 5.5 V to 27 V 5.5 V to 27 V 5.5 V to 27 V
ESD on LIN (IEC 61000-4-2 contact) ±6.0 kV minimum ±6.0 kV minimum ±6.0 kV minimum ±6.0 kV minimum ±6.0 kV minimum ±8.0 kV (improved)
Operating Temperature Range -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C -40 °C to +125 °C

Key Differentiators

  • Integrated DC motor pre-driver saves external H-bridge gate drive (vs MC33911G5)
  • Same 32-LQFP footprint as NXP SBC family for design reuse (vs MC33910G5 / MC33912G5)
  • ±6 kV IEC 61000-4-2 ESD on LIN pin eliminates external TVS (vs Discrete LIN transceivers)

Design Notes

The on-board 5 V LDO delivers up to 60 mA. If the application requires more (e.g., a sensor MCU plus a wireless module), route an external regulator from VSUP rather than overloading VDD. Verify VSUP decoupling per NXP's reference design - a 100 nF ceramic close to the VSUP pin plus a bulk electrolytic reduces load-dump ringing.

The LIN pin must include the LIN bus pull-up resistor (typically 30 kΩ in node applications, 1 kΩ in master) and a series protection resistor for reverse-battery events. Skipping the master/slave termination resistor is a common cause of LIN communication failures during EMC testing. The DC motor pre-driver outputs should never be paralleled with discrepant FETs - observe absolute maximum ratings.

Estimated: at 25 °C ambient and 100 mA total quiescent + load current, the 32-LQFP-7x7 dissipates ~0.5 W with 6 V drop on VSUP. The exposed pad (pin 32) must be soldered to a copper pour of at least 1 square inch for thermal relief. Without the exposed pad connection, junction temperature can exceed 150 °C under sustained load.

Keep the LIN trace away from switching nodes and route it as a short, direct path with a ground guard on both sides for best EMC performance. Place the LIN master/slave termination resistor within 10 mm of the LIN pin. The charge-pump capacitor (pin 20) should be a low-ESR ceramic placed within 3 mm of the pin with the loop area minimized.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not found in the verified web snippets; recommend confirming RoHS, REACH, and AEC-Q100 status with NXP product documentation or sales contact before automotive qualification.

Data verified on: 2026-10-15 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC34911BAC MC33911BAC MC33911G5 MC33910G5 MC33912G5 System Basis Chip SBC LIN 2.x Local Interconnect Network SPI Serial Peripheral Interface LDO Low-Dropout Regulator DC Motor Pre-driver H-bridge 32-LQFP LQFP-32 IEC 61000-4-2 ESD Automotive body electronics HVAC module Window lift PMIC Power Management IC
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