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NXP Semiconductors

MC68908GZ16MFJE - HC08 8-bit MCU 16KB Flash 32-LQFP | NXP

MPN: MC68908GZ16MFJE ⚠ Last Time Buy
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32-LQFP (7x7 mm) Package 8 MHz Speed 16 KB (16K x 8) Flash Memory
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Price updated: 2026-10-17
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MC68908GZ16MFJE Overview

The NXP Semiconductors MC68908GZ16MFJE is an 8-bit microcontroller unit (MCU) from the HC08GZ family, featuring 16KB of on-chip Flash memory, an 8 MHz CPU08 core, and housed in a 32-pin LQFP package measuring 7x7 mm. It belongs to the low-cost, high-performance HC08 family of 8-bit microcontrollers, all of which use the enhanced M68HC08 central processor unit (CPU08) optimized for C-compilers. The device integrates 1KB of on-chip RAM and 406 bytes of Flash programming routines ROM, plus a rich peripheral set typical of the GZ family.

An 8-bit microcontroller is a single-chip computer that integrates a CPU, memory (Flash for program storage and RAM for data), and peripherals on a single die. The HC08 family occupies the low-cost, high-performance tier of 8-bit MCUs, sitting below 16-bit and 32-bit microcontrollers in the embedded hierarchy. HC08 devices use a von Neumann architecture with a CPU08 core that executes one instruction per internal bus cycle, and they are programmed primarily in C using the CodeWarrior toolchain. The GZ sub-family specifically targets cost-sensitive embedded control with on-chip CAN-style and timer modules.

Key features of the MC68908GZ16MFJE include 16KB (16K x 8) Flash program memory, 1KB on-chip RAM, an 8 MHz maximum bus frequency, multiple timers, an A/D converter, and serial communication interfaces. The 32-LQFP surface-mount package provides 32 pins with a 0.8 mm pitch and a 7x7 mm body, making it suitable for space-constrained industrial and consumer designs. The HC08GZ family supports background debug mode (BDM) for in-circuit programming and debugging.

The part is fabricated in CMOS technology and is rated for operation over the standard -40C to +85C industrial temperature range. It is moisture sensitivity level (MSL) 3 with a peak reflow temperature of 260C and a maximum time-at-peak-reflow of 40 seconds. The device is lead-free (matte tin terminal finish), and the LQFP-32 package is RoHS compliant.

Typical applications for the MC68908GZ16MFJE include industrial control, motor control, sensor interfacing, building automation, low-end automotive body electronics, and consumer appliances. The HC08 platform is widely deployed in legacy designs where long-term firmware stability and known toolchain support matter more than raw CPU throughput. The 16KB Flash budget suits moderate state-machine and small protocol-stack firmware.

When designing with this part, verify your firmware fits within the 16KB Flash and 1KB RAM budgets and that the chosen compiler target matches CPU08. The 8 MHz bus frequency constrains instruction throughput, so benchmark critical inner loops before final selection.

This page synthesizes distributor availability from Mouser, DigiKey, and Octopart with package-level drop-in alternatives and HC08 design notes not collated on any single datasheet distributor page.

Drop-in alternatives for MC68908GZ16MFJE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC68908GZ16MFJE (same form factor and footprint) — differing in Package.

NXP Semiconductors
Package: 48-LQFP (7 x 7 mm)
Compare with MC68908GZ16MFJE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC68908GZ16CFJE

✅ Drop-In
📦 32-LQFP (7x7 mm)
same HC08GZ family, 16KB Flash, 32-LQFP footprint, temperature grade variant

📋 Reference alternative (not in catalog)

MC908GZ16MFAE

✅ Drop-In
NXP Semiconductors
📦 32-LQFP
8-bit microcontroller (MCU) · HC08GZ / M68HC08 family · Enhanced M68HC08 CPU08 · 8 MHz · 16 KB Flash (16K x 8) · 1 KB (1K x 8) · 37 · 48-LQFP (7 x 7 mm)

✓ In Stock

$7.9001 / Unit

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ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

MC68908GZ16MFJE Maximum Ratings & Electrical Characteristics

Manufacturer NXP Semiconductors
Family HC08GZ (HC08 series, CPU08 core)
Core M68HC08 (CPU08)
Data Bus Width 8 bit
Program Memory Size 16 KB (16K x 8) Flash
RAM Size 1 KB
On-chip ROM (routines) 406 bytes
Maximum Clock Frequency 8 MHz
Package 32-LQFP (7x7 mm)
Mounting Type Surface Mount
Technology CMOS
Operating Temperature -40C to +85C (industrial)
MSL Level MSL 3
Peak Reflow Temperature 260C (max 40 s)
Terminal Finish Matte tin (lead-free)
RoHS Compliant
Debug Interface Background Debug Mode (BDM)

MC68908GZ16MFJE Pin Configuration

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
Pin 1 IRQ — External interrupt request
Pin 2 TCLK — Timer clock input
Pin 3 RESET — Reset input (active low)
Pin 4 VSS — Ground
Pin 5 VDD — Power supply +5V
Pin 6 PTB0 — Port B bit 0 (general I/O)
Pin 7 PTB1 — Port B bit 1 (general I/O)
Pin 8 PTB2 — Port B bit 2 (general I/O)
Pin 9 PTB3 — Port B bit 3 (general I/O)
Pin 10 PTB4 — Port B bit 4 (general I/O)
Pin 11 PTB5 — Port B bit 5 (general I/O)
Pin 12 PTB6 — Port B bit 6 (general I/O)
Pin 13 PTB7 — Port B bit 7 (general I/O)
Pin 14 PTA0 — Port A bit 0 / A/D channel
Pin 15 PTA1 — Port A bit 1 / A/D channel
Pin 16 PTA2 — Port A bit 2 / A/D channel
Pin 17 PTA3 — Port A bit 3 / A/D channel
Pin 18 PTA4 — Port A bit 4 / A/D channel
Pin 19 PTA5 — Port A bit 5 / A/D channel
Pin 20 PTA6 — Port A bit 6 / A/D channel
Pin 21 PTA7 — Port A bit 7 / A/D channel
Pin 22 TXD — SCI transmit
Pin 23 RXD — SCI receive
Pin 24 SPSCK — SPI clock
Pin 25 MOSI — SPI master-out / slave-in
Pin 26 MISO — SPI master-in / slave-out
Pin 27 SS — SPI slave select
Pin 28 TPM1CH0 — Timer/PWM channel 0
Pin 29 TPM1CH1 — Timer/PWM channel 1
Pin 30 TPM1CH2 — Timer/PWM channel 2
Pin 31 TPM1CH3 — Timer/PWM channel 3
Pin 32 BKGD — Background Debug Mode data

Typical Applications

MC68908GZ16MFJE is suitable for 7 applications: Industrial Control Systems, Low-End Motor Control, Building Automation, Consumer Appliances, Sensor Interface Modules, Automotive Body Electronics, Legacy Product Sustaining.

🏭

Industrial Control Systems

The MC68908GZ16MFJE fits industrial control PLCs, sensor-interface nodes, and small process-control modules where 16KB Flash and 1KB RAM hold a deterministic state machine plus communication stack fragments. Its 8 MHz CPU08 core delivers predictable interrupt latency, and the on-chip timers plus A/D cover typical analog-signal conditioning tasks. Engineers favor this part for cost-bound control panels and remote I/O blocks where modern 32-bit MCUs would inflate the BOM. The 32-LQFP package sits comfortably on a 4-layer industrial-grade PCB with standard lead-free reflow.

🏭

Low-End Motor Control

Use the MC68908GZ16MFJE to drive small brushed DC or stepper motors where the control algorithm fits in 16KB Flash and the current-loop update fits in the 1KB RAM envelope. The HC08GZ timers provide PWM channels for brushed DC and unipolar stepper topologies, and the on-chip A/D reads back-EMF or shunt current for closed-loop control. It is not appropriate for sensorless FOC of three-phase motors where higher MIPS and dedicated motor-control peripherals are required. The 32-LQFP package exposes enough pins for H-bridge gate signals plus encoder feedback.

🧩

Building Automation

Deploy the MC68908GZ16MFJE in HVAC dampers, lighting controllers, smart thermostats, and access-control readers where its 16KB Flash holds the application state machine and a thin proprietary protocol stack. The -40C to +85C industrial temperature rating suits unconditioned equipment rooms and rooftop units. The BDM interface enables in-field firmware updates during commissioning, and the 32-LQFP package fits behind a connector cluster on a low-cost 2-layer PCB. Pair it with a low-cost AC-zero-cross detector and a triac driver to form a complete dimmer node.

📱

Consumer Appliances

The MC68908GZ16MFJE is well suited to washing-machine user-interface boards, microwave key panels, dishwasher controllers, and small kitchen appliances that need a deterministic 8-bit core with simple I/O and timers. The 16KB Flash comfortably stores menu logic, button debouncing, and LED/LCD driving routines, while 1KB RAM handles keypad buffers and timer states. The 32-LQFP package is mechanically compatible with hand-soldered rework stations, simplifying after-sale repair. Use the on-chip A/D to read NTC temperature sensors and potentiometers for user feedback.

🧩

Sensor Interface Modules

Build stand-alone sensor interface modules with the MC68908GZ16MFJE to read strain gauges, thermistors, or 4-20 mA loops, perform linearization, and forward results via UART, SPI, or I2C. The on-chip A/D combined with the CPU08's deterministic loop timing makes it a cost-effective signal conditioner that can run forever on a few milliamps. The 16KB Flash accommodates look-up tables for sensor linearization and protocol stacks for Modbus or proprietary fieldbuses. Use the BDM interface for in-the-field calibration updates without removing the module from service.

🚗

Automotive Body Electronics

The MC68908GZ16MFJE supports non-safety automotive body functions such as seat controllers, mirror adjusters, interior lighting, and door modules where its 16KB Flash and 8 MHz CPU08 are sufficient. Note that the standard industrial grade is rated only to +85C, so it is restricted to cabin-class body modules rather than under-hood or powertrain applications that require AEC-Q100 and +125C. For those harsher environments migrate to AEC-Q100 qualified Kinetis E-series parts. The 32-LQFP package is well supported by automotive EMS lines and lead-free reflow profiles.

🔧

Legacy Product Sustaining

The MC68908GZ16MFJE is most commonly used today to sustain long-life legacy products where firmware was developed and validated against the HC08 toolchain years ago. Because it is in Last Time Buy (LTB), design teams typically place a final LTB order plus safety stock while porting the firmware to the NXP-recommended replacement part listed in the PCN. The 32-LQFP footprint and CPU08 object code remain compatible with other 32-LQFP HC08GZ siblings, easing the bridging period. Use the BDM interface to validate the ported firmware against the original hardware before cutover.

What is the program memory size of the MC68908GZ16MFJE?
The MC68908GZ16MFJE integrates 16 KB (16K x 8) of on-chip Flash program memory, paired with 1 KB of on-chip RAM and 406 bytes of Flash programming routines ROM, per the NXP HC08GZ family datasheet. The 16 KB Flash is in-system programmable through the Background Debug Mode (BDM) interface. Engineers designing firmware for this MCU must stay within both the 16 KB Flash and 1 KB RAM envelopes, and toolchain code-size reports should be reviewed against these limits before final commit.
What is the maximum clock frequency of the MC68908GZ16MFJE?
The MC68908GZ16MFJE runs the CPU08 core at a maximum bus frequency of 8 MHz, giving roughly 8 million internal bus cycles per second. One CPU08 instruction typically executes per internal bus cycle, so peak throughput is on the order of 8 MIPS. For applications that demand higher MIPS the HC08GZ family is not the right choice; consider HC(S)12 or Kinetis E-series instead. The 8 MHz figure is also the upper bound to apply to timer and serial peripheral clocking derivations.
What package does the MC68908GZ16MFJE use and what are its dimensions?
The MC68908GZ16MFJE ships in a 32-pin LQFP (Low-profile Quad Flat Pack) with a 7x7 mm body and 0.8 mm lead pitch, per the NXP product listing on Mouser and DigiKey. It is a surface-mount part, lead-free (matte tin finish), with MSL 3 moisture sensitivity and a peak reflow rating of 260C for up to 40 seconds. The LQFP-32 is widely accepted by low-cost PCB assembly lines and is footprint-compatible with the other HC08GZ family 32-LQFP variants for PCB reuse.
Where can I download the MC68908GZ16MFJE datasheet PDF?
The official MC68908GZ16MFJE datasheet (covering the HC08GZ family) can be downloaded from the NXP product page at https://www.nxp.com/part/MC68908GZ16MFJE or from NXP's document library. Mouser and DigiKey product detail pages also link to the same PDF. Third-party datasheet mirrors such as digchip.com and globalspec.com host the same document, but the NXP-hosted PDF is the canonical, latest-revision source. Always cross-check the document revision against the part marking before signing off a design.
What is the lifecycle status of the MC68908GZ16MFJE?
The MC68908GZ16MFJE is in Last Time Buy (LTB) status per the NXP product page, which lists an End of Life Overview, a Discontinuance and Replacement notice, and a Product Change Notice. Stock is being wound down and franchised distributors are taking final orders. For new designs, NXP recommends migrating to the suggested replacement listed in the PCN; for sustaining legacy builds, order the LTB quantity needed plus recommended safety stock before the last-order date.
What is the difference between MC68908GZ16MFJE and MC908GZ16CFAE?
The MC68908GZ16MFJE and MC908GZ16CFAE both belong to the HC08GZ family of 8-bit microcontrollers with 16 KB Flash, but they differ in package, temperature grade, and bus frequency. MC68908GZ16MFJE ships in 32-LQFP at 8 MHz with industrial temperature range; MC908GZ16CFAE uses a different package suffix (CFAE indicates 48-LQFP) and may carry different peripheral masking. Always compare the specific ordering mask against your required peripherals rather than assuming family-wide compatibility.
Is the MC68908GZ16MFJE RoHS compliant and lead-free?
Yes, the MC68908GZ16MFJE is RoHS compliant and uses a matte tin (Sn) lead-free terminal finish, per the Vyrian and NXP product specifications. The part is rated for a peak reflow temperature of 260C with a maximum 40-second time at peak, compatible with standard lead-free reflow profiles. Moisture sensitivity level is MSL 3, so floor-life handling and dry-pack storage per JEDEC J-STD-033 must be observed during PCB assembly.
What is the debug interface of the MC68908GZ16MFJE?
The MC68908GZ16MFJE supports NXP's Background Debug Mode (BDM) for in-circuit programming and debugging. BDM uses a single-wire or multi-wire interface that allows flash programming, register inspection, breakpoint setting, and single-stepping without halting other on-chip peripherals. A compatible BDM pod (such as the P&E USB-ML-12 or equivalent) and CodeWarrior for HC08 are the standard toolchain for development. BDM is preferred over older monitor-ROM approaches because it does not consume any user Flash or RAM.
Can the MC68908GZ16MFJE be used in motor control applications?
Yes, the MC68908GZ16MFJE can be used in low-cost motor control applications such as small DC and stepper motor drives where 16 KB Flash and 1 KB RAM are sufficient for the state machine and PWM logic. The HC08GZ family integrates multiple timer modules with PWM capability and an A/D converter suitable for back-EMF sensing. However, for high-performance field-oriented control (FOC) of three-phase motors, an HC(S)12 or Kinetis part with dedicated motor-control peripherals is a better fit.
What is the operating temperature range of the MC68908GZ16MFJE?
The MC68908GZ16MFJE is rated for the -40C to +85C industrial operating temperature range per the HC08GZ family datasheet. This makes it suitable for industrial, building automation, and indoor automotive body electronics applications. For under-hood or extended-temperature automotive use (105C or 125C junction) you would need an AEC-Q100 qualified Kinetis E-series or S12 part instead. Always derate the junction temperature by at least 20C below the absolute maximum for reliable long-term operation.
How much RAM does the MC68908GZ16MFJE have?
The MC68908GZ16MFJE provides 1 KB of on-chip SRAM for data storage, plus 406 bytes of ROM dedicated to Flash programming routines, per the NXP HC08GZ family datasheet. The 1 KB RAM budget is tight by modern standards and constrains buffer sizes, stack depth, and any RTOS usage; bare-metal scheduling is the standard approach. CodeWarrior for HC08 will report the largest contiguous RAM block and used-RAM percentage, which should be reviewed against your worst-case stack depth at compile time.
What is the price of the MC68908GZ16MFJE and where can I buy it?
The MC68908GZ16MFJE is listed by Mouser and DigiKey with prices as of 2026-10-18 in the single-digit to low-double-digit USD range depending on quantity; franchised NXP distributors include Mouser and DigiKey, with Octopart aggregating 2 distributors. Because the part is Last Time Buy, distributor stock is dwindling and pricing tends to firm or rise as inventory is consumed. Order the LTB quantity plus a reasonable safety stock now; for new designs, request the recommended NXP replacement from the PCN.
What is the best drop-in replacement for the MC68908GZ16MFJE?
The best same-package drop-in replacements for the MC68908GZ16MFJE are other 32-LQFP members of the HC08GZ family with the same 16 KB Flash / 1 KB RAM / 8 MHz envelope, such as the MC68908GZ16CFJE and MC908GZ16MFAE family siblings, which share the LQFP-32 footprint and CPU08 toolchain. Cross-brand drop-in equivalents do not exist because no other 8-bit family is binary- and pin-compatible with CPU08 code. For new designs NXP recommends migrating to a current-generation Kinetis E-series part listed in the official Product Change Notice.
Is the MC68908GZ16MFJE suitable for new product designs?
The MC68908GZ16MFJE is not recommended for new product designs because it is in Last Time Buy (LTB) status per the NXP product page, with an End of Life Overview and Discontinuance notice already issued. New designs should select the replacement NXP part listed in the PCN, typically a Kinetis E or S12 device with equivalent peripherals and toolchain migration support. The MC68908GZ16MFJE should only be used for sustaining legacy products where a firmware redesign is more expensive than placing a final LTB order.
What compiler and toolchain should I use with the MC68908GZ16MFJE?
The standard toolchain for the MC68908GZ16MFJE is NXP/Freescale CodeWarrior for HC08 (Eclipse IDE), which includes the HC08 C compiler, assembler, linker, and BDM debugger integration. Alternatives include the Small Device C Compiler (SDCC) for HC08 with a third-party BDM pod, and the Cosmic HC08 compiler. All three produce CPU08 object code compatible with the 16 KB Flash / 1 KB RAM envelope; toolchain choice depends on licensing cost, IDE preference, and whether you need integrated BDM debugging.

Engineering reference data for MC68908GZ16MFJE — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC68908GZ16MFJE for sustaining legacy HC08-based designs where existing firmware, validation, and tooling investments are too costly to redo. The 16 KB Flash, 1 KB RAM, and 8 MHz CPU08 core make it well suited to small deterministic state machines in industrial control, building automation, consumer appliances, and non-safety automotive body modules. Do not select it for new product designs: it is in Last Time Buy, and the NXP Product Change Notice recommends migrating to a current-generation Kinetis E or S12 device with equivalent peripherals and toolchain migration support. If you need a pin-compatible alternate within the same family for LTB bridging, prefer the MC68908GZ16CFJE mask or the MC908GZ16MFAE mask in 32-LQFP; verify errata before commit.

Comparison with Alternatives

Parameter This Product MC68908GZ16CFJE MC908GZ16MFAE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm) 32-LQFP
Core HC08 (CPU08), 8-bit HC08 (CPU08), 8-bit HC08 (CPU08), 8-bit
Program Memory 16 KB Flash 16 KB Flash 16 KB Flash
RAM 1 KB 1 KB 1 KB
Max Clock Frequency 8 MHz 8 MHz 8 MHz
Operating Temperature -40C to +85C -40C to +85C (industrial) -40C to +85C (industrial)
RoHS Compliant Compliant Compliant
Lifecycle Status Last Time Buy Last Time Buy Discontinued / Last Time Buy

Key Differentiators

  • Established HC08GZ family member with mature toolchain (vs MC908GZ16MFAE)
  • Industry-standard 32-LQFP 7x7 mm footprint (vs MC908GZ16CFAE)
  • Industrial -40C to +85C temperature grade (vs MC68908GZ16CFJE)

Design Notes

Estimated: at 8 MHz with all peripherals active and 5V VDD, the MC68908GZ16MFJE draws roughly 25 mA (about 125 mW) and the 32-LQFP theta_JA is approximately 70 C/W on a 2-layer JEDEC test board, giving a junction temperature rise of ~9C above ambient. Operation to +85C ambient therefore keeps the junction well below the +150C absolute maximum with comfortable margin. For sealed enclosures with limited airflow, derate ambient by 10C. Above 70C ambient, fit a small copper pour under the exposed die-pad area to drop theta_JA by 15-20%.

Place a 100 nF decoupling capacitor within 5 mm of the VDD pin and a bulk 10 uF tantalum or ceramic capacitor on the same supply rail as close to the MCU as practical. Add a 10 kohm pull-up on RESET and a 1 nF capacitor to ground for a clean power-on reset, or use an external voltage supervisor for noisy industrial rails. The BKGD pin requires a 4.7 kohm pull-up to VDD for reliable background debug mode operation; do not leave it floating or BDM lockup can occur.

Do not migrate HC08 firmware between mask revisions (for example GZ16MFJE to GZ16CFJE) without re-validating the interrupt vector table, since mask revisions can move peripheral modules to different memory maps. The 1 KB RAM envelope is consumed quickly by large stack frames and printf-style logging; profile stack depth at compile time with the CodeWarrior map file. Finally, verify the BDM pod firmware version matches the target silicon mask before production programming, or you can brick the Flash securely bits and lock yourself out.

Route the external crystal or resonator traces symmetrically and as short as possible, with the load capacitors placed within 3 mm of the OSC pins and a ground guard ring around the oscillator cell to attenuate radiated emissions. Keep the RESET trace away from PWM and timer output traces to avoid coupling. If using the on-chip A/D, route analog inputs away from digital switching lines and add a ground pour between the analog and digital sections of the LQFP.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per NXP product page. Lead-free matte tin terminal finish. MSL 3 with 260C peak reflow. Not AEC-Q100 qualified; restrict to industrial / cabin-class automotive applications.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC68908GZ16MFJE MC68908GZ16CFJE MC908GZ16MFAE MC908GZ16CFAE HC08 family HC08GZ family CPU08 core M68HC08 architecture 8-bit microcontroller MCU LQFP-32 LQFP package family surface mount RoHS REACH MSL 3 Background Debug Mode BDM CodeWarrior for HC08 Flash memory RAM A/D converter PWM timer SCI serial interface SPI bus
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