MC9S08DZ60CLC - 8-bit HCS08 MCU 60KB Flash 32-LQFP | NXP
MPN: MC9S08DZ60CLC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.65 | $66.50 |
| 100 | $5.5 | $550.00 |
| 500 | $4.95 | $2,475.00 |
| 1,000 | $4.4 | $4,400.00 |
MC9S08DZ60CLC Overview
An 8-bit microcontroller (MCU) is a small computer-on-a-chip that integrates a CPU, memory (Flash/RAM), peripherals (ADC, timers, communication modules), and I/O pins on a single die. MCUs sit within the broader hierarchy of microcontrollers -> embedded processors -> semiconductors, and the HCS08 line is a low-power, HC08-compatible family well suited to motor control, body electronics, and CAN-node applications.
Key features include 60KB on-chip Flash (60K x 8), 4KB RAM (4K x 8), 25 I/O pins, and an external oscillator interface for system clock flexibility. The part supports up to 32 interrupt/reset sources, integrates a 24-channel 12-bit ADC with 2.5 us conversion time, and includes CAN, SCI, and SPI/I2C peripherals typical of the S08DZ family.
The 40-MHz HCS08 core executes the HC08 instruction set with the added BGND instruction, providing backward compatibility with legacy Freescale code while improving code density and execution efficiency. The 20-MHz internal bus and integrated peripherals reduce system BOM cost for CAN and LIN slave node designs.
Typical applications include industrial control nodes, automotive body electronics, CAN-based sensor interfaces, HVAC controllers, and small appliances. Designers select this MCU when deterministic 8-bit performance, CAN connectivity, and ample Flash headroom are required in a compact LQFP footprint.
When designing with this device, ensure proper decoupling by placing a 0.1 uF ceramic bypass capacitor near each VDD pin and a bulk 10 uF tantalum capacitor across the rails, as recommended in the manufacturer datasheet, to suppress high-frequency switching noise.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MC9S08DZ60CLC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08DZ60CLC (same form factor and footprint) — differing in Instruction Set, RAM Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08DZ60ACLC
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08DZ60F2MLC
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08DZ60CLC Maximum Ratings & Electrical Characteristics
| Series | MC9S08DZ60 |
| Core | HCS08 (40-MHz CPU, 20-MHz bus) |
| Core Size | 8-bit |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Maximum Clock Frequency | 40 MHz |
| Number of I/O | 25 |
| Package / Case | 32-LQFP (7x7 mm) |
| Oscillator Type | External |
| ADC | 24-channel, 12-bit, 2.5 us conversion |
| Interrupt / Reset Sources | Up to 32 |
| Instruction Set | HC08 with added BGND instruction |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Communication Peripherals | CAN, SCI, SPI, I2C (S08DZ family) |
MC9S08DZ60CLC Pin Configuration
| Pin 1 | PTE4/TxD1 — Port E bit 4 / SCI1 transmit |
| Pin 2 | PTE5/RxD1 — Port E bit 5 / SCI1 receive |
| Pin 3 | PTE6 — Port E bit 6 |
| Pin 4 | PTE7 — Port E bit 7 |
| Pin 5 | VDD — Digital supply voltage |
| Pin 6 | VSS — Digital ground |
| Pin 7 | PTG0/KBI1P0 — Port G bit 0 / keyboard interrupt |
| Pin 8 | PTG1/KBI1P1 — Port G bit 1 / keyboard interrupt |
| Pin 9 | PTG2/KBI1P2 — Port G bit 2 / keyboard interrupt |
| Pin 10 | PTG3/KBI1P3 — Port G bit 3 / keyboard interrupt |
| Pin 11 | PTH0/MISO1 — Port H bit 0 / SPI1 MISO |
| Pin 12 | PTH1/MOSI1 — Port H bit 1 / SPI1 MOSI |
| Pin 13 | PTH2/SPSCK1 — Port H bit 2 / SPI1 clock |
| Pin 14 | PTH3/SS1 — Port H bit 3 / SPI1 slave select |
| Pin 15 | PTH4/MISO2 — Port H bit 4 / SPI2 MISO |
| Pin 16 | PTH5/MOSI2 — Port H bit 5 / SPI2 MOSI |
| Pin 17 | PTH6/SPSCK2 — Port H bit 6 / SPI2 clock |
| Pin 18 | PTH7/SS2 — Port H bit 7 / SPI2 slave select |
| Pin 19 | PTF0 — Port F bit 0 |
| Pin 20 | PTF1 — Port F bit 1 |
| Pin 21 | PTF2 — Port F bit 2 |
| Pin 22 | PTF3 — Port F bit 3 |
| Pin 23 | PTF4 — Port F bit 4 |
| Pin 24 | PTF5 — Port F bit 5 |
| Pin 25 | PTF6 — Port F bit 6 |
| Pin 26 | PTF7 — Port F bit 7 |
| Pin 27 | PTA0 — Port A bit 0 / ADC channel |
| Pin 28 | PTA1 — Port A bit 1 / ADC channel |
| Pin 29 | PTA2 — Port A bit 2 / ADC channel |
| Pin 30 | PTA3 — Port A bit 3 / ADC channel |
| Pin 31 | PTA4 — Port A bit 4 / ADC channel |
| Pin 32 | PTA5 — Port A bit 5 / ADC channel / RESET |
Typical Applications
MC9S08DZ60CLC is suitable for 6 applications: Industrial CAN Node Controller, Automotive Body Electronics, HVAC Climate Control, Small Appliance Control Board, Battery-Management Slave Module, Sensor Hub / Data Aggregator.
Industrial CAN Node Controller
The MC9S08DZ60CLC is engineered for distributed industrial CAN networks requiring deterministic 8-bit performance and robust on-chip peripherals. Its integrated MSCAN module supports CAN 2.0A/B protocols at up to 1 Mbit/s, while the 40-MHz HCS08 core delivers enough throughput for protocol stack handling plus application logic. The 60KB Flash accommodates CANopen or DeviceNet stack implementations alongside customer application code, and the 24-channel 12-bit ADC handles multi-sensor monitoring typical of process-control nodes. With 25 I/O pins and 32 interrupt sources, the part interfaces cleanly with industrial sensors, actuators, and isolated transceivers.
Recommended
Automotive Body Electronics
The MC9S08DZ60CLC's S08DZ family heritage makes it well suited for automotive body-control modules including lighting controllers, door modules, and seat controllers. The integrated CAN interface enables seamless communication with the vehicle body network, while the 60KB Flash supports LIN slave node stacks and body-electronics application code. The 24-channel 12-bit ADC with 2.5 us conversion time captures multi-position sensor data for mirror, window, and seat-position feedback. The 32-LQFP footprint with 25 I/O pins provides flexible PCB routing within space-constrained body modules operating across automotive temperature grades.
Recommended
HVAC Climate Control
Climate control systems benefit from the MC9S08DZ60CLC's 24-channel 12-bit ADC for temperature, humidity, and pressure sensing, paired with its PWM timers for fan and valve actuator control. The 60KB Flash accommodates lookup-table-driven PID control loops and user-interface logic, while the 4KB RAM buffers sensor history for adaptive control algorithms. The HC08 instruction set with BGND background-debug mode simplifies in-system firmware tuning during HVAC platform development. The 32-LQFP package with 25 I/O pins cleanly supports multiple sensor inputs and PWM-driven outputs in wall-thermostat and air-handler designs.
Recommended
Small Appliance Control Board
Small appliances such as washing machines, dishwashers, and coffee machines leverage the MC9S08DZ60CLC's balance of Flash headroom, ADC channels, and serial peripherals. The 40-MHz HCS08 core runs user-interface logic, motor-control algorithms, and safety-monitoring routines without external memory. The 24-channel 12-bit ADC reads water-level sensors, temperature probes, and motor current feedback simultaneously. CAN or SCI connectivity supports service-diagnostic interfaces, while the 32-LQFP package and 25 I/O pins simplify integration into compact appliance control boards where cost and reliability are paramount.
Recommended
Battery-Management Slave Module
Battery-management systems use the MC9S08DZ60CLC as a slave monitoring node communicating over CAN or SCI to a master controller. The 24-channel 12-bit ADC scans multiple cell voltages and thermistor inputs, while the 60KB Flash supports cell-balancing algorithms and state-of-health calculations. The HCS08 core's deterministic interrupt response ensures accurate timing for synchronized cell monitoring across large battery stacks. The 32-LQFP package with 25 I/O pins accommodates daisy-chained battery modules where compact, low-cost monitoring ICs are essential to overall system economics.
Recommended
Sensor Hub / Data Aggregator
Industrial sensor hubs aggregate multiple analog and digital sensors and report consolidated data over CAN or UART. The MC9S08DZ60CLC fits this role with its 24-channel 12-bit ADC, multiple serial peripherals (SCI, SPI, I2C), and CAN interface for upstream communication. The 60KB Flash stores sensor calibration tables and protocol-framing logic, while the 4KB RAM buffers data between acquisition and transmission. The 25 I/O pins and 32-LQFP footprint enable compact sensor-hub PCB designs where one MCU replaces several discrete interface chips.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08DZ60CLC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08DZ60ACLC | S9S08DZ60F2MLC |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Core | HCS08 8-bit | HCS08 8-bit | S08 8-bit (newer revision) |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 60 KB | 60 KB | 60 KB |
| RAM | 4 KB | 4 KB | 4 KB |
| ADC | 24-ch 12-bit | 24-ch 12-bit | 24-ch 12-bit |
| I/O Pins | 25 | 25 | 25 |
| CAN Peripheral | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) |
Key Differentiators
- Original silicon revision with longest field-deployment history (vs S9S08DZ60F2MLC)
- Same die with potential errata improvements (vs MC9S08DZ60ACLC)
- Generous 60KB Flash for 8-bit class (vs S9S08DZ60F2MLC)
Design Notes
Apply proper decoupling per NXP MC9S08DZ60 datasheet recommendations: place a 0.1 uF ceramic bypass capacitor as close as practical to each VDD pin to suppress high-frequency noise, and add a bulk 10 uF tantalum capacitor across the supply rails for bulk charge storage. This two-capacitor scheme is mandatory for reliable ADC operation and CAN-bus communication in electrically noisy industrial environments.
Route the external oscillator traces with short, symmetrical lengths and keep them away from switching nodes and high-current traces to minimize EMI coupling. The 32-LQFP 7x7 mm footprint with 0.8 mm pitch requires careful trace routing on inner PCB layers; consider a 4-layer stack-up with a dedicated ground plane beneath the MCU to reduce EMI emissions from the CAN and SCI interfaces.
Ensure the BGND background-debug mode pin is correctly pulled during reset to select normal versus debug mode, otherwise the MCU may fail to start. The RESET pin on PTA5 is bidirectional; an external reset supervisor is recommended for CAN-node designs to meet automotive transient and brownout requirements. Verify the oscillator configuration matches the crystal or resonator characteristics specified in the datasheet.
The 32-LQFP package provides reasonable thermal dissipation for typical 8-bit MCU operating currents (tens of mA). At maximum CPU activity with all peripherals enabled, total current draw remains well below 100 mA, so junction temperature rise is minimal. However, in sealed enclosures or near heat sources, derate ambient temperature appropriately for reliable long-term operation.
Compliance Information
Compliance data not provided in verified web sources - set to unknown per Data Authenticity Rules. AEC-Q100 not applicable for the C-suffix (commercial) temperature grade; Q-suffix variants may exist.