MC8640DTHX1067NE - Dual-Core PowerPC e600 SoC, 2x1067MHz | NXP
MPN: MC8640DTHX1067NE ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205.2 | $102,600.00 |
| 1,000 | $185.25 | $185,250.00 |
MC8640DTHX1067NE Overview
What is a Power Architecture SoC? It is a single integrated circuit that combines one or more CPU cores, a memory controller, and high-speed serial I/O (such as PCIe and SRIO) into one silicon die. Within the broader taxonomy, the MPC8640D belongs to: microprocessor -> embedded MPU -> SoC -> communications processor -> semiconductor. By collapsing what used to be separate northbridge, southbridge, and PHY devices into one BGA, the MPC8640D reduces board area, BOM cost, and latency between cores and I/O for data-plane workloads.
Key features include two independent e600 cores with private L1 caches and a shared L2, hardware MMU and floating-point unit per core, dual integrated GbE controllers with on-chip SerDes, integrated DDR1/DDR2 controller with ECC, multi-lane PCI Express and Serial RapidIO fabrics, four-channel DMA, and a wide set of peripheral interfaces (I2C, SPI, UART, GPIO). The 1023-ball FCBGA package supplies the high pin-count needed to expose these parallel and serial interfaces while keeping critical high-speed nets length-matched.
Typical applications are wireless baseband/base-station line cards, telecom/datacom routers and switches, defense and aerospace signal processing, networked storage controllers, industrial control and ruggedized computing, and long-life industrial embedded designs that need deterministic multiprocessor performance and rich I/O. The extended -40C to +105C junction range also lets it serve outdoor or sealed enclosures without derating.
When designing with this part, follow the NXP reference-design PCB stack-up and length-matching rules for the DDR2 controller, PCIe, and SRIO links - signal-integrity violations on these interfaces are the leading cause of first-spin failures. Allocate a 4-layer (or thicker) stack-up with controlled-impedance traces and stitch the GND/VDD planes under the BGA to provide low-impedance return paths for the high-speed SerDes lanes.
This page synthesizes cross-distributor pricing, Rev 3.0 die-step alternatives, and practical layout notes that are not present in the raw manufacturer datasheet - including a side-by-side MC8640 family comparison and industrial-temperature variants.
Drop-in alternatives for MC8640DTHX1067NE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC8640DTHX1067NE (same form factor and footprint) — differing in Core Frequency, Ethernet, Memory Controller, Operating Temperature, PCI Express.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC8640DTHJ1067NE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DHJ1067NE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTVJ1067NE
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →MC8640DTHX1067NE Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e600 (dual-core) |
| Number of Cores | 2 |
| Core Frequency | 1.067 GHz per core (2x1067 MHz) |
| SIMD Engine | AltiVec |
| Data Width | 32-Bit |
| Core Voltage | 0.95 V |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | Dual integrated GbE MACs |
| PCI Express | Integrated multi-lane PCIe |
| Serial RapidIO | Integrated SRIO |
| Die Revision | Rev 3.0 (G8 stepping) |
| Package | 1023-ball FCBGA (33x33 mm) |
| Operating Temperature | -40C to +105C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
MC8640DTHX1067NE 1023-ball fcbga (33x33 mm) Pin Configuration Guide
Pin configuration for MC8640DTHX1067NE (1023-ball fcbga (33x33 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC8640DTHX1067NE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC8640DTHX1067NE is suitable for 6 applications: Wireless Base-Station Line Cards, Telecom / Datacom Routers and Switches, Defense and Aerospace Signal Processing, Networked Storage Controllers, Industrial Control and Ruggedized Computing, Embedded Networking Long-Life Computing.
Wireless Base-Station Line Cards
The MC8640DTHX1067NE's dual PowerPC e600 cores at 2x1067 MHz with AltiVec SIMD accelerate baseband PHY processing, ciphering, and packet classification in WCDMA / LTE base-station line cards. Each e600 runs independent threads while the integrated DDR1/DDR2 controller with ECC keeps memory coherency for the radio pipeline, and the on-chip PCI Express + Serial RapidIO links feed data to companion FPGAs and DSP arrays without an external northbridge. Industrial -40C to +105C grading lets the SoC sit on outdoor base-station cards alongside RF front ends, and the 1023-ball FCBGA (33x33 mm) footprint concentrates a complete data-plane compute node in one placement.
Recommended
Telecom / Datacom Routers and Switches
In edge routers, multi-service switches, and aggregation line cards, the MC8640DTHX1067NE delivers dual 1067 MHz e600 cores for control-plane and forwarding-plane tasks, while the integrated PCI Express lanes connect to switching ASICs and the Serial RapidIO ports tie into TDM fabrics. The dual GbE MACs with on-chip SerDes eliminate external PHY glue and reduce board area, while the DDR2 controller with ECC supplies the high-bandwidth memory channel needed for routing-table lookups. The 0.95 V Rev 3.0 silicon lowers per-core power versus earlier revisions, helping meet NEBS thermal budgets in central-office chassis.
Recommended
Defense and Aerospace Signal Processing
Rugged defense and aerospace subsystems benefit from the MC8640DTHX1067NE's industrial -40C to +105C temperature class, dual AltiVec-capable e600 cores, and deterministic PCI Express / Serial RapidIO interfaces for radar, SIGINT, and electronic-warfare payloads. The 1023-ball FCBGA (33x33 mm) supplies the high pin-count needed to expose dual GbE, multi-lane PCIe, and SRIO to FPGAs and ADC/DAC front ends, while the integrated DDR2 controller with ECC sustains the high memory bandwidth that vector DSP routines demand. Long-life-cycle availability and the mature PowerPC tool chain make this part attractive for long-field-life programs.
Recommended
Networked Storage Controllers
For RAID controllers, iSCSI targets, and networked-attached-storage appliances, the MC8640DTHX1067NE's two e600 cores handle storage-stack processing (file system, deduplication, encryption) while the integrated PCI Express lanes attach to SATA / SAS / NVMe host-bus adapters and the Serial RapidIO ports bridge to co-processors. DDR1/DDR2 with ECC provides the protected memory bandwidth needed for cache and write-coalescing operations, and the dual GbE MACs offer 2 Gbps of bonded Ethernet for storage traffic. Industrial temperature grading lets the same SoC serve in ruggedized near-line storage deployed in industrial enclosures.
Recommended
Industrial Control and Ruggedized Computing
Industrial controllers, machine-vision processors, and rugged HMI computers can rely on the MC8640DTHX1067NE's dual 1067 MHz e600 cores for deterministic control loops and on-board analytics, with AltiVec SIMD accelerating image-processing kernels. The integrated GbE, PCIe, and SRIO let designers attach industrial Ethernet, machine-vision cameras, and motion-control co-processors without an external bridge, while DDR2 with ECC keeps memory transactions protected against single-bit errors common in electrically noisy factories. The -40C to +105C junction rating covers outdoor cabinets, factory floors, and remote-site enclosures.
Recommended
Embedded Networking Long-Life Computing
The MC8640DTHX1067NE is well suited to long-life embedded networking designs - printers, industrial gateways, edge routers - that need a mature dual-core compute platform with abundant I/O. Each e600 core runs at 1067 MHz and shares access to the integrated DDR2 controller and the four-channel DMA engine, while the PCI Express and SRIO fabrics expose expansion to encryption accelerators or co-processors. Two GbE MACs reduce the external bill of materials and the 1023-ball FCBGA (33x33 mm) integrates the entire data-plane node on one component, simplifying the long-term BOM for industrial product lifecycles spanning 10-15 years.
Recommended
Recommended Products Summary
Engineering reference data for MC8640DTHX1067NE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC8640DTHJ1067NE | MC8640DHJ1067NE | MC8640DTVJ1067NE |
|---|---|---|---|---|
| Package | 1023-ball FCBGA (33x33 mm) | 1023-ball FCBGA (33x33 mm) - same | 1023-ball FCBGA (33x33 mm) - same | 1023-ball FCBGA (33x33 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 dual-core |
| Core Frequency | 2x1067 MHz | 2x1067 MHz | 2x1067 MHz | 2x1067 MHz |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | 0C to +105C (Commercial) | 0C to +105C (Commercial) |
| Core Voltage | 0.95 V (Rev 3.0) | 0.95 V (Rev 3.0) | 0.95 V (Rev 3.0) | 0.95 V (Rev 3.0) |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Integrated I/O | Dual GbE + PCIe + SRIO | Dual GbE + PCIe + SRIO | Dual GbE + PCIe + SRIO | Dual GbE + PCIe + SRIO |
Key Differentiators
- Industrial -40C to +105C temperature class on the same Rev 3.0 silicon (vs MC8640DHJ1067NE / MC8640DTVJ1067NE)
- Last-Time-Buy status with verified distributor stock at announcement (vs MC8640DTHJ1067NE)
- Dual e600 cores with AltiVec SIMD integrated in a single BGA (vs Single-core PowerQUICC II Pro predecessors)
Design Notes
The 1023-ball FCBGA (33x33 mm) package of the MC8640DTHX1067NE requires a minimum 4-layer PCB stack-up with continuous GND and VDD planes stitched directly under the BGA. For DDR2, PCIe, and SRIO interfaces use matched-length traces within the tolerance specified in the NXP MPC8640 device summary, and follow the reference-design via-in-pad escape pattern to keep stub lengths short. Estimated: with a 6-layer stack-up, expect a 25-30% margin improvement in SI margin over the minimum 4-layer implementation.
Design the heatsink and thermal-via pattern assuming worst-case dual-core 1067 MHz at 0.95 V with all GbE, PCIe, and SRIO lanes active. Estimated: a top-side heatsink plus a 6x6 thermal-via array under the BGA thermal pad is the minimum to keep the junction below +105C in still air. For sealed outdoor enclosures, add a bottom-side copper pour and consider a small blower; validate against the package theta-JA in the manufacturer's reliability report rather than the package-only number.
Generate the 0.95 V core rail with a high-efficiency buck regulator that can supply at least 30-40 A peak transient current (the MPC8640D's dv/dt events are steep). Place the input bulk capacitors as close as possible to the BGA's power balls, and decouple each power pin group with a 0.1 uF + 10 uF + 47 uF local capacitor bank. Use a dedicated sequencer or supervisor IC to enforce the 1.0 V/1.5 V/3.3 V power-up order required by the device summary, otherwise the SoC may latch-up or draw uncontrolled inrush current.
Do not substitute MC8640DTHX1067NE (industrial -40C to +105C) with MC8640DHJ1067NE or MC8640DTVJ1067NE (commercial 0C to +105C) in outdoor or cold-storage designs - cold-start below 0C is not qualified on the commercial parts. Verify the exact order code suffix against the NXP product change notice before placing volume orders, because mid-life PCNs occasionally revise the boot ROM or errata list without changing the ball-map. Always program the SerDes reference clock from a low-jitter oscillator and lock the PCIe/SRIO reference clock to the system clock tree.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not provided in the verified distributor snippets; treat as 'unknown' until cross-checked against the latest NXP product compliance letter. AEC-Q100 is not applicable because this is an industrial/communications MPU, not an automotive-qualified part.