MC8640DTHX1067NE - Dual-Core PowerPC e600 SoC, 2x1067MHz | NXP
부품 번호: MC8640DTHX1067NE ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205.2 | $102,600.00 |
| 1,000 | $185.25 | $185,250.00 |
MC8640DTHX1067NE 개요
What is a Power Architecture SoC? It is a single integrated circuit that combines one or more CPU cores, a memory controller, and high-speed serial I/O (such as PCIe and SRIO) into one silicon die. Within the broader taxonomy, the MPC8640D belongs to: microprocessor -> embedded MPU -> SoC -> communications processor -> semiconductor. By collapsing what used to be separate northbridge, southbridge, and PHY devices into one BGA, the MPC8640D reduces board area, BOM cost, and latency between cores and I/O for data-plane workloads.
Key features include two independent e600 cores with private L1 caches and a shared L2, hardware MMU and floating-point unit per core, dual integrated GbE controllers with on-chip SerDes, integrated DDR1/DDR2 controller with ECC, multi-lane PCI Express and Serial RapidIO fabrics, four-channel DMA, and a wide set of peripheral interfaces (I2C, SPI, UART, GPIO). The 1023-ball FCBGA package supplies the high pin-count needed to expose these parallel and serial interfaces while keeping critical high-speed nets length-matched.
Typical applications are wireless baseband/base-station line cards, telecom/datacom routers and switches, defense and aerospace signal processing, networked storage controllers, industrial control and ruggedized computing, and long-life industrial embedded designs that need deterministic multiprocessor performance and rich I/O. The extended -40C to +105C junction range also lets it serve outdoor or sealed enclosures without derating.
When designing with this part, follow the NXP reference-design PCB stack-up and length-matching rules for the DDR2 controller, PCIe, and SRIO links - signal-integrity violations on these interfaces are the leading cause of first-spin failures. Allocate a 4-layer (or thicker) stack-up with controlled-impedance traces and stitch the GND/VDD planes under the BGA to provide low-impedance return paths for the high-speed SerDes lanes.
This page synthesizes cross-distributor pricing, Rev 3.0 die-step alternatives, and practical layout notes that are not present in the raw manufacturer datasheet - including a side-by-side MC8640 family comparison and industrial-temperature variants.
드롭인 대체품: MC8640DTHX1067NE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC8640DTHX1067NE (동일 폼 팩터 및 풋프린트) — 차이점: Core Frequency, Ethernet, Memory Controller, Operating Temperature, PCI Express.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC8640DTHJ1067NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8640DHJ1067NE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC8640DTVJ1067NE
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →MC8640DTHX1067NE 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e600 (dual-core) |
| Number of Cores | 2 |
| Core Frequency | 1.067 GHz per core (2x1067 MHz) |
| SIMD Engine | AltiVec |
| Data Width | 32-Bit |
| Core Voltage | 0.95 V |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | Dual integrated GbE MACs |
| PCI Express | Integrated multi-lane PCIe |
| Serial RapidIO | Integrated SRIO |
| Die Revision | Rev 3.0 (G8 stepping) |
| 패키지 | 1023-ball FCBGA (33x33 mm) |
| 동작 온도 | -40C to +105C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
MC8640DTHX1067NE 1023-ball fcbga (33x33 mm) 핀 구성 가이드
MC8640DTHX1067NE(1023-ball fcbga (33x33 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC8640DTHX1067NE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC8640DTHX1067NE 적합 용도: 6 애플리케이션s: Wireless Base-Station Line Cards, Telecom / Datacom Routers and Switches, Defense and Aerospace Signal Processing, Networked Storage Controllers, Industrial Control and Ruggedized Computing, Embedded Networking Long-Life Computing.
Wireless Base-Station Line Cards
The MC8640DTHX1067NE's dual PowerPC e600 cores at 2x1067 MHz with AltiVec SIMD accelerate baseband PHY processing, ciphering, and packet classification in WCDMA / LTE base-station line cards. Each e600 runs independent threads while the integrated DDR1/DDR2 controller with ECC keeps memory coherency for the radio pipeline, and the on-chip PCI Express + Serial RapidIO links feed data to companion FPGAs and DSP arrays without an external northbridge. Industrial -40C to +105C grading lets the SoC sit on outdoor base-station cards alongside RF front ends, and the 1023-ball FCBGA (33x33 mm) footprint concentrates a complete data-plane compute node in one placement.
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Telecom / Datacom Routers and Switches
In edge routers, multi-service switches, and aggregation line cards, the MC8640DTHX1067NE delivers dual 1067 MHz e600 cores for control-plane and forwarding-plane tasks, while the integrated PCI Express lanes connect to switching ASICs and the Serial RapidIO ports tie into TDM fabrics. The dual GbE MACs with on-chip SerDes eliminate external PHY glue and reduce board area, while the DDR2 controller with ECC supplies the high-bandwidth memory channel needed for routing-table lookups. The 0.95 V Rev 3.0 silicon lowers per-core power versus earlier revisions, helping meet NEBS thermal budgets in central-office chassis.
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Defense and Aerospace Signal Processing
Rugged defense and aerospace subsystems benefit from the MC8640DTHX1067NE's industrial -40C to +105C temperature class, dual AltiVec-capable e600 cores, and deterministic PCI Express / Serial RapidIO interfaces for radar, SIGINT, and electronic-warfare payloads. The 1023-ball FCBGA (33x33 mm) supplies the high pin-count needed to expose dual GbE, multi-lane PCIe, and SRIO to FPGAs and ADC/DAC front ends, while the integrated DDR2 controller with ECC sustains the high memory bandwidth that vector DSP routines demand. Long-life-cycle availability and the mature PowerPC tool chain make this part attractive for long-field-life programs.
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Networked Storage Controllers
For RAID controllers, iSCSI targets, and networked-attached-storage appliances, the MC8640DTHX1067NE's two e600 cores handle storage-stack processing (file system, deduplication, encryption) while the integrated PCI Express lanes attach to SATA / SAS / NVMe host-bus adapters and the Serial RapidIO ports bridge to co-processors. DDR1/DDR2 with ECC provides the protected memory bandwidth needed for cache and write-coalescing operations, and the dual GbE MACs offer 2 Gbps of bonded Ethernet for storage traffic. Industrial temperature grading lets the same SoC serve in ruggedized near-line storage deployed in industrial enclosures.
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Industrial Control and Ruggedized Computing
Industrial controllers, machine-vision processors, and rugged HMI computers can rely on the MC8640DTHX1067NE's dual 1067 MHz e600 cores for deterministic control loops and on-board analytics, with AltiVec SIMD accelerating image-processing kernels. The integrated GbE, PCIe, and SRIO let designers attach industrial Ethernet, machine-vision cameras, and motion-control co-processors without an external bridge, while DDR2 with ECC keeps memory transactions protected against single-bit errors common in electrically noisy factories. The -40C to +105C junction rating covers outdoor cabinets, factory floors, and remote-site enclosures.
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Embedded Networking Long-Life Computing
The MC8640DTHX1067NE is well suited to long-life embedded networking designs - printers, industrial gateways, edge routers - that need a mature dual-core compute platform with abundant I/O. Each e600 core runs at 1067 MHz and shares access to the integrated DDR2 controller and the four-channel DMA engine, while the PCI Express and SRIO fabrics expose expansion to encryption accelerators or co-processors. Two GbE MACs reduce the external bill of materials and the 1023-ball FCBGA (33x33 mm) integrates the entire data-plane node on one component, simplifying the long-term BOM for industrial product lifecycles spanning 10-15 years.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC8640DTHX1067NE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC8640DTHJ1067NE | MC8640DHJ1067NE | MC8640DTVJ1067NE |
|---|---|---|---|---|
| Package | 1023-ball FCBGA (33x33 mm) | 1023-ball FCBGA (33x33 mm) - same | 1023-ball FCBGA (33x33 mm) - same | 1023-ball FCBGA (33x33 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 dual-core |
| Core Frequency | 2x1067 MHz | 2x1067 MHz | 2x1067 MHz | 2x1067 MHz |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | 0C to +105C (Commercial) | 0C to +105C (Commercial) |
| Core Voltage | 0.95 V (Rev 3.0) | 0.95 V (Rev 3.0) | 0.95 V (Rev 3.0) | 0.95 V (Rev 3.0) |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Integrated I/O | Dual GbE + PCIe + SRIO | Dual GbE + PCIe + SRIO | Dual GbE + PCIe + SRIO | Dual GbE + PCIe + SRIO |
주요 차별점
- Industrial -40C to +105C temperature class on the same Rev 3.0 silicon (vs MC8640DHJ1067NE / MC8640DTVJ1067NE)
- Last-Time-Buy status with verified distributor stock at announcement (vs MC8640DTHJ1067NE)
- Dual e600 cores with AltiVec SIMD integrated in a single BGA (vs Single-core PowerQUICC II Pro predecessors)
설계 노트
The 1023-ball FCBGA (33x33 mm) package of the MC8640DTHX1067NE requires a minimum 4-layer PCB stack-up with continuous GND and VDD planes stitched directly under the BGA. For DDR2, PCIe, and SRIO interfaces use matched-length traces within the tolerance specified in the NXP MPC8640 device summary, and follow the reference-design via-in-pad escape pattern to keep stub lengths short. Estimated: with a 6-layer stack-up, expect a 25-30% margin improvement in SI margin over the minimum 4-layer implementation.
Design the heatsink and thermal-via pattern assuming worst-case dual-core 1067 MHz at 0.95 V with all GbE, PCIe, and SRIO lanes active. Estimated: a top-side heatsink plus a 6x6 thermal-via array under the BGA thermal pad is the minimum to keep the junction below +105C in still air. For sealed outdoor enclosures, add a bottom-side copper pour and consider a small blower; validate against the package theta-JA in the manufacturer's reliability report rather than the package-only number.
Generate the 0.95 V core rail with a high-efficiency buck regulator that can supply at least 30-40 A peak transient current (the MPC8640D's dv/dt events are steep). Place the input bulk capacitors as close as possible to the BGA's power balls, and decouple each power pin group with a 0.1 uF + 10 uF + 47 uF local capacitor bank. Use a dedicated sequencer or supervisor IC to enforce the 1.0 V/1.5 V/3.3 V power-up order required by the device summary, otherwise the SoC may latch-up or draw uncontrolled inrush current.
Do not substitute MC8640DTHX1067NE (industrial -40C to +105C) with MC8640DHJ1067NE or MC8640DTVJ1067NE (commercial 0C to +105C) in outdoor or cold-storage designs - cold-start below 0C is not qualified on the commercial parts. Verify the exact order code suffix against the NXP product change notice before placing volume orders, because mid-life PCNs occasionally revise the boot ROM or errata list without changing the ball-map. Always program the SerDes reference clock from a low-jitter oscillator and lock the PCIe/SRIO reference clock to the system clock tree.
규정 준수 정보
RoHS, REACH, lead-free, and halogen-free status were not provided in the verified distributor snippets; treat as 'unknown' until cross-checked against the latest NXP product compliance letter. AEC-Q100 is not applicable because this is an industrial/communications MPU, not an automotive-qualified part.