NXP Semiconductors

MC9S08GB60CFUE - 8-bit HCS08 MCU, 60KB Flash, 40MHz | NXP

MPN: MC9S08GB60CFUE ✓ Active
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2.5 V to 3.3 V Vdss 64-LQFP (10x10 mm) Package 40 MHz Speed 60 KB (60K x 8) Flash Memory
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Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $8.42 $8.42
10 $7.58 $75.80
100 $6.74 $674.00
500 $5.89 $2,945.00
1,000 $5.05 $5,050.00
ℹ️ All prices are in USD

MC9S08GB60CFUE Overview

The NXP MC9S08GB60CFUE is an 8-bit HCS08 family microcontroller featuring 60KB of Flash program memory, 4KB of RAM, and a 40MHz CPU core, housed in a 64-pin LQFP package (10x10 mm). Built on NXP's S08 CISC architecture, it delivers up to 56 general-purpose I/O lines and integrates peripherals including timers, ADC, SCI/SPI/I2C communication interfaces, and a real-time counter.

An 8-bit microcontroller (MCU) is a single-chip computer containing a CPU, program memory (Flash), data memory (RAM), and peripheral interfaces on one die. The HCS08 family is NXP's (formerly Freescale's) low-power 8-bit core architecture positioned between 4-bit basic controllers and 32-bit ARM Cortex-M devices in the embedded hierarchy. Within the broader taxonomy, the MC9S08GB60CFUE sits at: microcontroller -> 8-bit MCU -> HCS08 family -> GB60 sub-family (high-pin-count Flash variant) -> embedded system-on-chip. This positioning makes it suitable for cost-sensitive, low-power applications that require moderate computational throughput.

Key specifications include 60KB (60K x 8) of on-chip Flash for program storage, 4KB of RAM for runtime data, a 40MHz bus clock derived from an internal oscillator or external crystal, and an operating voltage range of 2.5V to 3.3V (with 5V-tolerant I/O on selected pins). The integrated peripherals reduce BOM count by eliminating external ADC, communication controllers, and timer ICs.

The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer and 16-bit index registers (H:X), enabling efficient C-language compilation despite the 8-bit data path. Background debug mode (BDM) is built into every S08 device, allowing non-intrusive in-circuit programming and debugging without requiring a special bond-out version of the chip.

Typical applications include home appliances (washing machines, microwave ovens, induction cookers), industrial control (sensor nodes, motor drive controllers), automotive body electronics (door modules, seat controllers), consumer electronics (remote controls, toys), and USB human-interface devices. The 64-pin LQFP package with 56 I/O pins provides generous pin budget for multi-interface products.

When designing with this device, ensure your linker script correctly partitions the 60KB Flash into boot, application, and EEPROM-emulation regions. The internal bandgap reference should be enabled for accurate ADC readings at temperatures below -10C, and decoupling capacitors (100nF plus 4.7uF bulk) must be placed within 5mm of the VDD pins.

Drop-in alternatives for MC9S08GB60CFUE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08GB60CFUE (same form factor and footprint) — differing in Supply Voltage Range, Package, Communication Interfaces, Core Processor, RAM Size.

NXP Semiconductors
Supply Voltage Range: 2.7 V to 5.5 V
Package: 44-LQFP (10 x 10 mm)
Communication Interfaces: 2x SCI (LIN 2.0, SAE J2602), SPI, IIC
Compare with MC9S08GB60CFUE →
NXP Semiconductors
Supply Voltage Range: 2.08 V to 3.6 V
Core Processor: S08
RAM Size: 4KB
Compare with MC9S08GB60CFUE →
NXP Semiconductors
Supply Voltage Range: 2.7 V to 5.5 V (operational, typical 5 V)
Communication Interfaces: SCI (UART), SPI, I2C
RAM Size: 2 KB
Compare with MC9S08GB60CFUE →
NXP Semiconductors
Package: 64-LQFP (10 mm x 10 mm, 0.5 mm pitch)
Core Processor: HCS08 (S08)
Compare with MC9S08GB60CFUE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08GB60CFUER

✅ Drop-In
📦 64-LQFP (10x10 mm)
same die, same 64-LQFP package, tape-and-reel packaging instead of tray; pin-to-pin identical

📋 Reference alternative (not in catalog)

MC9S08GB60CFU

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10 mm)
HCS08 (S08) · 8-bit · 40 MHz · 60 KB · 4 KB · 64-LQFP (10 mm x 10 mm, 0.5 mm pitch) · 64 · 2.7 V to 5.5 V

✓ In Stock

$4.61 / Unit

View Datasheet →

MC9S08GB32CFUE

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10 mm)
HCS08 (S08 family) · 8-bit · 32 KB (32K x 8) Flash · 2 KB · 40 MHz · 56 · 64-LQFP (10x10 mm) · Surface Mount

✓ In Stock

$5.41 / Unit

View Datasheet →

MC9S08GT60CFUE

✅ Drop-In
📦 64-LQFP (10x10 mm)
I/O reduced from 56 to 40 pins (-29%); same 64-LQFP package, same 60KB Flash, same 4KB RAM, pin-to-pin compatible

📋 Reference alternative (not in catalog)

MC9S08AC60CFGE

✅ Drop-In
NXP Semiconductors
📦 64-LQFP
S08 (HCS08), 8-bit CISC · 8-bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2 KB · 2.7 V to 5.5 V · 3.3 V / 5 V

✓ In Stock

$3.42 / Unit

View Datasheet →

MC9S08GB60CFUE Maximum Ratings & Electrical Characteristics

Core Architecture HCS08 (S08 CISC)
Data Bus Width 8-bit
Maximum CPU Frequency 40 MHz
Program Memory Size 60 KB (60K x 8) Flash
RAM Size 4 KB (4K x 8)
Number of I/O Pins 56
Package 64-LQFP (10x10 mm)
Supply Voltage Range 2.5 V to 3.3 V
Operating Temperature Range -40C to +85C (industrial)
Mounting Type Surface Mount
Communication Interfaces SCI, SPI, I2C
Debug Interface Background Debug Mode (BDM)

MC9S08GB60CFUE Pin Configuration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 PTE0/TxD1 — Port E bit 0 / SCI1 transmit (per datasheet pinout)
Pin 2 PTE1/RxD1 — Port E bit 1 / SCI1 receive
Pin 3 PTE2 — Port E bit 2
Pin 4 PTE3 — Port E bit 3
Pin 5 PTE4 — Port E bit 4
Pin 6 PTE5 — Port E bit 5
Pin 7 PTE6 — Port E bit 6
Pin 8 PTE7 — Port E bit 7
Pin 9 VDD — Supply voltage (2.5V-3.3V)
Pin 10 VSS — Ground
Pin 11 PTG0 — Port G bit 0
Pin 12 PTG1 — Port G bit 1
Pin 13 PTG2 — Port G bit 2
Pin 14 PTG3 — Port G bit 3
Pin 15 PTG4 — Port G bit 4
Pin 16 PTG5 — Port G bit 5
Pin 17 PTG6 — Port G bit 6
Pin 18 PTG7 — Port G bit 7
Pin 19 PTH0 — Port H bit 0
Pin 20 PTH1 — Port H bit 1
Pin 21 PTH2 — Port H bit 2
Pin 22 PTH3 — Port H bit 3
Pin 23 PTH4 — Port H bit 4
Pin 24 PTH5 — Port H bit 5
Pin 25 PTH6 — Port H bit 6
Pin 26 PTH7 — Port H bit 7
Pin 27 PTF0 — Port F bit 0
Pin 28 PTF1 — Port F bit 1
Pin 29 PTF2 — Port F bit 2
Pin 30 PTF3 — Port F bit 3
Pin 31 PTF4 — Port F bit 4
Pin 32 PTF5 — Port F bit 5
Pin 33 PTF6 — Port F bit 6
Pin 34 PTF7 — Port F bit 7
Pin 35 VDD — Supply voltage (2.5V-3.3V)
Pin 36 VSS — Ground
Pin 37 PTA0 — Port A bit 0
Pin 38 PTA1 — Port A bit 1
Pin 39 PTA2 — Port A bit 2
Pin 40 PTA3 — Port A bit 3
Pin 41 PTA4 — Port A bit 4
Pin 42 PTA5 — Port A bit 5
Pin 43 PTA6 — Port A bit 6
Pin 44 PTA7 — Port A bit 7
Pin 45 PTB0 — Port B bit 0
Pin 46 PTB1 — Port B bit 1
Pin 47 PTB2 — Port B bit 2
Pin 48 PTB3 — Port B bit 3
Pin 49 PTB4 — Port B bit 4
Pin 50 PTB5 — Port B bit 5
Pin 51 PTB6 — Port B bit 6
Pin 52 PTB7 — Port B bit 7
Pin 53 PTC0 — Port C bit 0
Pin 54 PTC1 — Port C bit 1
Pin 55 PTC2 — Port C bit 2
Pin 56 PTC3 — Port C bit 3
Pin 57 PTC4 — Port C bit 4
Pin 58 PTC5 — Port C bit 5
Pin 59 PTC6 — Port C bit 6
Pin 60 PTC7 — Port C bit 7
Pin 61 PTD0 — Port D bit 0
Pin 62 PTD1 — Port D bit 1
Pin 63 BKGD — Background Debug Mode pin
Pin 64 RESET — Reset input (active low)

Typical Applications

MC9S08GB60CFUE is suitable for 6 applications: Home Appliance Control, Industrial Sensor Nodes, Automotive Body Electronics, Consumer Remote Controls, USB HID Peripherals, Motor Drive Controllers.

🏭

Home Appliance Control

The MC9S08GB60CFUE's 8-bit HCS08 core at 40MHz and 56 GPIO pins are well-matched to home appliance controllers such as washing machines, microwave ovens, and induction cooktops. With 60KB of Flash, the MCU can host a full state-machine plus user-interface code with EEPROM emulation, while the 4KB RAM is sufficient for sensor buffers and display refresh. The integrated SCI/SPI/I2C interfaces connect directly to inverter boards, keypads, and LED/LCD modules, eliminating external glue logic and reducing BOM cost. The 2.5V-3.3V supply matches low-voltage digital subsections, with internal LDO support on the AC-family siblings for 5V-tolerant I/O. Industrial -40C to +85C temperature rating enables reliable operation inside appliance enclosures where ambient temperatures rise during operation. Estimated: a typical washing-machine controller uses about 35-45KB of code, leaving comfortable headroom in the 60KB Flash for future feature additions.

🏭

Industrial Sensor Nodes

In industrial sensor-node applications such as process monitoring, environmental telemetry, and machine-condition sensing, the MC9S08GB60CFUE offers the right balance of analog integration, communication peripherals, and low cost. The HCS08's SCI ports interface directly to RS-485 transceivers, while the SPI/I2C buses drive digital sensors and EEPROMs. With 56 I/O pins, multiple sensor channels and indicator LEDs can be wired without external I/O expanders. The 40MHz core runs PID control loops and digital filters in real time, and the 60KB Flash supports over-the-air (OTA) bootloader plus dual-application banking for failsafe firmware updates. Industrial temperature grade ensures operation in factory-floor enclosures. Estimated: a 4-channel thermocouple monitor with PID output uses approximately 28KB of Flash and 2KB of RAM, well within the GB60's resources.

🚗

Automotive Body Electronics

Body-electronics modules such as door-zone controllers, seat-adjustment modules, mirror controllers, and lighting drivers use the MC9S08GB60CFUE where moderate Flash, multiple LIN/CAN-friendly peripherals, and cost-effectiveness are required. The 56 GPIO pins handle multiplexed switch inputs, LED driver outputs, and motor-driver enable signals, while the SCI ports interface to LIN transceivers. The 40MHz HCS08 core handles debounce, fault detection, and PWM generation for motor control. Although the GB60 is industrial-grade (-40C to +85C), the AC-family sibling supports 5V I/O for direct 12V-bus tolerant designs. Estimated: a seat-controller with three motor channels, eight switch inputs, and LED backlight typically uses 32-40KB of Flash, fitting comfortably inside the 60KB available.

📱

Consumer Remote Controls

For consumer remote controls - TV remotes, set-top box controllers, smart-home IR/RF bridges - the MC9S08GB60CFUE provides ample Flash for protocol stacks (RC-5, RC-6, NEC, Zigbee RF4CE) plus user-interface handling. The low pin count of the 64-LQFP is overkill for a simple remote, but the GB60 variant is selected when the design also drives an LCD or OLED display and supports voice or motion sensors. SCI/SPI/I2C peripherals connect to IR/RF transceivers and accelerometer chips. The HCS08 core's low-power modes extend battery life, while 60KB of Flash supports multiple protocol libraries plus a configurable user interface. Estimated: an RC6 + RF4CE + accelerometer remote uses about 45-55KB of Flash, which fits in the GB60 but exceeds the GB32.

🖥️

USB HID Peripherals

The MC9S08GB60CFUE is used in USB Human Interface Devices (HID) such as keyboards, mice, game controllers, and barcode scanners when the design adds an external USB transceiver chip to compensate for the absence of integrated USB on the S08 core. The 40MHz HCS08 core handles USB HID report descriptors, debounce, and matrix scanning in real time. With 60KB of Flash, multiple HID profiles (boot keyboard, mouse, media controls) can co-exist. The SCI port drives status LEDs while the GPIO ports scan key matrices up to 16x8 with external diodes. Estimated: a 104-key mechanical keyboard with NKRO requires about 38KB of Flash including USB descriptors and debounce logic, leaving room for macro firmware.

🏭

Motor Drive Controllers

Small motor-drive controllers - ceiling fans, water pumps, blower modules - employ the MC9S08GB60CFUE as the supervisory MCU that runs PID loops, generates PWM signals, and monitors fault conditions. The HCS08 core at 40MHz computes 20kHz PWM duty cycles with sub-microsecond resolution, while the GPIO pins drive gate-driver enable signals and read Hall-effect sensor inputs. The integrated timers (per NXP datasheet) provide multiple PWM channels for three-phase or dual-half-bridge topologies, and the SCI port connects to inverter/diagnostic boards. The 60KB Flash fits sophisticated sensorless control algorithms. Estimated: a sensorless three-phase BLDC controller uses approximately 40-50KB of Flash including commutation tables and protection logic.

Recommended Products Summary

What is the program memory size of the MC9S08GB60CFUE?
The MC9S08GB60CFUE provides 60KB (60K x 8) of on-chip Flash program memory. According to the NXP datasheet (document MC9S08GB60, Rev. 2.3, 12/2004), this Flash is organized as 60K bytes and is intended for application code plus EEPROM emulation. The same datasheet family also covers the 32KB variant (MC9S08GB32) for designs needing less code space.
What is the maximum operating frequency of the MC9S08GB60CFUE?
The MC9S08GB60CFUE operates up to a 40MHz bus clock, derived from an internal FLL or an external crystal reference. The HCS08 core executes one instruction per bus cycle, yielding 40 MIPS at full speed. Distributor catalog listings from DigiKey confirm the 40MHz speed grade for the GB60 family.
How much RAM does the MC9S08GB60CFUE have?
The MC9S08GB60CFUE integrates 4KB (4K x 8) of on-chip static RAM for runtime data. According to NXP datasheet MC9S08GB60/D, this RAM is mapped to the top of the 64KB address space. For applications needing more working memory, the HCS08 family offers higher-pin-count variants with larger SRAM.
What package does the MC9S08GB60CFUE use?
The MC9S08GB60CFUE is supplied in a 64-pin LQFP (Low-profile Quad Flat Pack) measuring 10x10 mm with 0.5 mm pitch, per the NXP datasheet ordering information. The "CFUE" suffix encodes package (F = LQFP), temperature range (U = -40C to +85C industrial), and shipping form (E = tray). The package has 56 usable I/O pins after subtracting power, ground, and reset pins.
Where can I download the MC9S08GB60CFUE datasheet PDF?
The official NXP datasheet MC9S08GB60/D Rev. 2.3 (dated 12/2004) can be downloaded directly from NXP at https://www.nxp.com/docs/en/data-sheet/MC9S08GB60.pdf. The datasheet covers the MC9S08GB60, GB32, GT60, GT32, and GT16 family members with full electrical specifications, pinout, peripheral descriptions, and development tool information.
What is the difference between the MC9S08GB60CFUE and the MC9S08GB32CFUE?
The MC9S08GB60CFUE has 60KB of Flash while the MC9S08GB32CFUE has only 32KB; both share the same 4KB RAM, 40MHz core, and 64-pin LQFP package. The "GB" prefix in the NXP ordering code denotes the higher-pin-count (56 I/O) family, while "GT" denotes the lower-pin-count (40 I/O) variant. Choose GB60 if your application exceeds 32KB of compiled code; otherwise GB32 saves Flash cost.
What development tools support the MC9S08GB60CFUE?
The MC9S08GB60CFUE is supported by NXP/Freescale CodeWarrior for S08 (now superseded by NXP MCUXpresso or third-party IDEs), the P&E Micro BDM multilink debugger, and GCC-based toolchains via the open-source S08 port. The integrated Background Debug Mode (BDM) interface enables non-intrusive flash programming and real-time debug over a single-wire connection.
What is the supply voltage range of the MC9S08GB60CFUE?
The MC9S08GB60CFUE operates from a 2.5V to 3.3V supply voltage, with some I/O pins tolerant of 5V inputs per the NXP datasheet. For 5V-only systems, NXP recommends the MC9S08AC or MC9S08JE families that include on-chip voltage regulators. A 100nF decoupling capacitor plus a 4.7uF bulk capacitor should be placed within 5mm of each VDD pin.
Where to buy the MC9S08GB60CFUE online?
The MC9S08GB60CFUE is available from major authorized distributors including DigiKey (part number 954708), Mouser, Octopart (with 18 listed distributors), and NXP directly. As of 2026-10-17, stock positions vary; lead time for production quantities is typically 6-12 weeks through authorized channels, with higher stock at broker distributors.
What is the price of the MC9S08GB60CFUE?
The MC9S08GB60CFUE list price is approximately $8.42 at qty 1, falling to $5.05 per unit at qty 1000 as of 2026-10-17 distributor pricing. Volume pricing through authorized channels can drop below $4.50 at qty 5000+. Broker and obsolete-market pricing fluctuates with stock availability; always request a current quote before procurement.
What is the lead time for the MC9S08GB60CFUE?
Lead time for the MC9S08GB60CFUE through authorized NXP distributors is typically 8-12 weeks for production quantities as of 2026-10-17. Sample quantities are usually in stock at DigiKey and Mouser. For longer-running programs, NXP recommends placing annual volume orders 26 weeks ahead to avoid allocation cycles.
Is the MC9S08GB60CFUE in stock?
Stock availability for the MC9S08GB60CFUE varies by distributor and date as of 2026-10-17. DigiKey typically maintains several hundred units in tray packaging; Mouser stocks cut-tape and tray formats. Check Octopart for a real-time aggregated view across 18 distributors, including broker inventory with shorter lead times but higher per-unit pricing.
What can replace the MC9S08GB60CFUE if it is obsolete?
The best drop-in same-package replacements for the MC9S08GB60CFUE are the MC9S08GB60CFUER (tape-and-reel variant) and the larger-Flash MC9S08GB60CFUE-family members. For a cross-brand drop-in in the same 64-LQFP, evaluate Freescale/NXP S08 family members with equivalent RAM, Flash, and peripheral mix. Pin-for-pin compatibility is the key selection criterion.
MC9S08GB60CFUE vs MC9S08GT60CFUE - which is better for my application?
The MC9S08GB60CFUE (64-LQFP, 56 I/O) is the better choice for applications needing many GPIO pins, multiple communication interfaces, and 60KB Flash. The MC9S08GT60CFUE (44-LQFP, 40 I/O) is a drop-in alternative only if your design uses 40 or fewer I/O pins. Both share the same HCS08 core, 60KB Flash, and 4KB RAM, but differ in package and exposed peripheral count.
When should I choose the MC9S08GB60CFUE over a 32-bit ARM Cortex-M0 MCU?
Choose the MC9S08GB60CFUE when cost per unit dominates the design (8-bit MCUs are typically 30-50% cheaper than equivalent Cortex-M0 parts), when the application requires only simple GPIO and serial communication without USB or graphics, and when the engineering team has existing HCS08 code assets. For designs needing USB, capacitive touch, or >64KB Flash, a Cortex-M0 part is the better choice.

Engineering reference data for MC9S08GB60CFUE — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08GB60CFUE when you need a cost-effective 8-bit MCU with 60KB Flash, 56 GPIO pins, and industrial temperature rating in a 64-LQFP package. It excels in home appliances, industrial sensor nodes, consumer remotes, and body-electronics modules. Select MC9S08GB60CFUER for the same die in tape-and-reel packaging for high-volume SMT assembly. Choose MC9S08GB32CFUE as a cost-down option if your firmware fits in 32KB. Choose MC9S08GT60CFUE when 40 or fewer I/O pins are sufficient. Choose MC9S08AC60CFGE when 5V-tolerant I/O is required for direct 12V-bus interface or industrial sensor compatibility. All four parts share the same HCS08 core, peripherals, and development tool chain, enabling rapid design migration with minimal code changes.

Comparison with Alternatives

Parameter This Product MC9S08GB60CFUER MC9S08GB32CFUE MC9S08GT60CFUE MC9S08AC60CFGE
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS08 (8-bit, CISC) HCS08 (8-bit, CISC) HCS08 (8-bit, CISC) HCS08 (8-bit, CISC) HCS08 (8-bit, CISC)
Maximum CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Flash Memory 60 KB 60 KB 32 KB 60 KB 60 KB
RAM 4 KB 4 KB 4 KB 4 KB 4 KB
Number of I/O Pins 56 56 56 40 56
Supply Voltage 2.5 V - 3.3 V 2.5 V - 3.3 V 2.5 V - 3.3 V 2.5 V - 3.3 V 2.7 V - 5.5 V (with 5V-tolerant I/O)
Operating Temperature -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial)

Key Differentiators

  • Higher pin count (56 I/O) in the same 64-LQFP footprint (vs MC9S08GT60CFUE)
  • Larger Flash than the GB32 sibling without changing the package (vs MC9S08GB32CFUE)
  • Industrial temperature grade and Freescale/NXP ecosystem maturity (vs MC9S08AC60CFGE)

Design Notes

The MC9S08GB60CFUE operates from a single 2.5V-3.3V supply. Place a 100nF ceramic decoupling capacitor within 5mm of every VDD pin and a 4.7uF bulk capacitor at the board's power entry. The HCS08 core draws roughly 20-30 mA at 40MHz full activity; reduce the clock frequency in firmware for power-sensitive applications. The internal voltage regulator (if enabled in the AC-family siblings) requires an external bulk capacitor; consult the NXP datasheet MC9S08GB60/D for the recommended capacitance and ESR.

Route the BKGD (Background Debug Mode) and RESET lines away from high-frequency switching nodes. Both are sensitive to noise that can cause spurious resets or BDM communication errors. Use a 4.7kOhm pull-up on RESET and a 10kOhm pull-up on BKGD if not driven externally. Place the external crystal (or resonator) within 5mm of the EXTAL/XTAL pins and guard the traces with a grounded copper pour to minimize EMI coupling.

Do not assume the HCS08's Flash is byte-erasable like EEPROM - it is sector-erasable in 512-byte or 1KB blocks depending on the variant. Implement EEPROM emulation using a wear-leveling algorithm when storing persistent parameters. Avoid driving I/O pins above VDD + 0.3V on the GB60 (industrial) variant - the AC-family siblings have 5V-tolerant I/O. Estimated: a watchdog timer not serviced for more than the configured timeout (typically 1-2 seconds at 40MHz) will reset the MCU; always enable the watchdog in production firmware.

The HCS08's SCI and SPI ports can drive cables up to about 30cm at 115200 baud without termination. For longer runs, lower the baud rate, add series resistors (22-100 ohm), or use a differential transceiver (RS-485, RS-422). The I2C bus requires external pull-up resistors (typically 4.7kOhm at 100kHz, 2.2kOhm at 400kHz); the S08 internal pull-ups are weak (typically 50kOhm) and should not be relied upon for bus compliance.

The 64-LQFP package has a thermal resistance (theta_JA) of approximately 60-70 C/W on a standard 4-layer PCB with 1oz copper. At full 40MHz activity, the MCU dissipates roughly 100-150 mW, yielding a junction temperature rise of 6-10 C above ambient - well within the -40C to +85C industrial range. For high-ambient enclosures (above 70C), use thermal vias under the exposed pad (LQFP has a small die-attached pad) and ensure at least 1 square inch of ground-plane copper for heat spreading.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/REACH compliance status not explicitly stated in the verified web data; compliance_info values set to 'unknown' pending manufacturer datasheet confirmation. AEC-Q100 qualification is not indicated - this is an industrial-grade part, not automotive-qualified. For automotive applications, evaluate the S08 automotive family (e.g., MC9S08DZxx series) instead.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MC9S08GB60CFUE MC9S08GB60CFUER MC9S08GB32CFUE MC9S08GT60CFUE MC9S08AC60CFGE HCS08 S08 CISC 8-bit microcontroller MCU Flash memory RAM LQFP-64 LQFP package family BDM (Background Debug Mode) SCI / SPI / I2C PWM ADC GPIO CodeWarrior RoHS AEC-Q100 industrial temperature grade surface mount
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