MC9S08GB60CFUE - 8-bit HCS08 MCU, 60KB Flash, 40MHz | NXP
부품 번호: MC9S08GB60CFUE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.58 | $75.80 |
| 100 | $6.74 | $674.00 |
| 500 | $5.89 | $2,945.00 |
| 1,000 | $5.05 | $5,050.00 |
MC9S08GB60CFUE 개요
An 8-bit microcontroller (MCU) is a single-chip computer containing a CPU, program memory (Flash), data memory (RAM), and peripheral interfaces on one die. The HCS08 family is NXP's (formerly Freescale's) low-power 8-bit core architecture positioned between 4-bit basic controllers and 32-bit ARM Cortex-M devices in the embedded hierarchy. Within the broader taxonomy, the MC9S08GB60CFUE sits at: microcontroller -> 8-bit MCU -> HCS08 family -> GB60 sub-family (high-pin-count Flash variant) -> embedded system-on-chip. This positioning makes it suitable for cost-sensitive, low-power applications that require moderate computational throughput.
Key specifications include 60KB (60K x 8) of on-chip Flash for program storage, 4KB of RAM for runtime data, a 40MHz bus clock derived from an internal oscillator or external crystal, and an operating voltage range of 2.5V to 3.3V (with 5V-tolerant I/O on selected pins). The integrated peripherals reduce BOM count by eliminating external ADC, communication controllers, and timer ICs.
The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer and 16-bit index registers (H:X), enabling efficient C-language compilation despite the 8-bit data path. Background debug mode (BDM) is built into every S08 device, allowing non-intrusive in-circuit programming and debugging without requiring a special bond-out version of the chip.
Typical applications include home appliances (washing machines, microwave ovens, induction cookers), industrial control (sensor nodes, motor drive controllers), automotive body electronics (door modules, seat controllers), consumer electronics (remote controls, toys), and USB human-interface devices. The 64-pin LQFP package with 56 I/O pins provides generous pin budget for multi-interface products.
When designing with this device, ensure your linker script correctly partitions the 60KB Flash into boot, application, and EEPROM-emulation regions. The internal bandgap reference should be enabled for accurate ADC readings at temperatures below -10C, and decoupling capacitors (100nF plus 4.7uF bulk) must be placed within 5mm of the VDD pins.
드롭인 대체품: MC9S08GB60CFUE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08GB60CFUE (동일 폼 팩터 및 풋프린트) — 차이점: Supply Voltage Range, Package, Communication Interfaces, Core Processor, RAM Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08GB60CFUER
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08GB60CFU
✅ 드롭인✓ 재고 있음
$4.61 / 개
데이터시트 보기 →MC9S08GB32CFUE
✅ 드롭인✓ 재고 있음
$5.41 / 개
데이터시트 보기 →MC9S08GT60CFUE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08AC60CFGE
✅ 드롭인✓ 재고 있음
$3.42 / 개
데이터시트 보기 →MC9S08GB60CFUE 최대 정격 & 전기적 특성
| Core Architecture | HCS08 (S08 CISC) |
| 데이터 버스 폭 | 8-bit |
| Maximum CPU Frequency | 40 MHz |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O Pins | 56 |
| 패키지 | 64-LQFP (10x10 mm) |
| Supply Voltage Range | 2.5 V to 3.3 V |
| 동작 온도 범위 | -40C to +85C (industrial) |
| 실장 유형 | Surface Mount |
| Communication Interfaces | SCI, SPI, I2C |
| Debug Interface | Background Debug Mode (BDM) |
MC9S08GB60CFUE 핀 구성
| 핀 1 | PTE0/TxD1 — Port E bit 0 / SCI1 transmit (per datasheet pinout) |
| 핀 2 | PTE1/RxD1 — Port E bit 1 / SCI1 receive |
| 핀 3 | PTE2 — Port E bit 2 |
| 핀 4 | PTE3 — Port E bit 3 |
| 핀 5 | PTE4 — Port E bit 4 |
| 핀 6 | PTE5 — Port E bit 5 |
| 핀 7 | PTE6 — Port E bit 6 |
| 핀 8 | PTE7 — Port E bit 7 |
| 핀 9 | VDD — Supply voltage (2.5V-3.3V) |
| 핀 10 | VSS — Ground |
| 핀 11 | PTG0 — Port G bit 0 |
| 핀 12 | PTG1 — Port G bit 1 |
| 핀 13 | PTG2 — Port G bit 2 |
| 핀 14 | PTG3 — Port G bit 3 |
| 핀 15 | PTG4 — Port G bit 4 |
| 핀 16 | PTG5 — Port G bit 5 |
| 핀 17 | PTG6 — Port G bit 6 |
| 핀 18 | PTG7 — Port G bit 7 |
| 핀 19 | PTH0 — Port H bit 0 |
| 핀 20 | PTH1 — Port H bit 1 |
| 핀 21 | PTH2 — Port H bit 2 |
| 핀 22 | PTH3 — Port H bit 3 |
| 핀 23 | PTH4 — Port H bit 4 |
| 핀 24 | PTH5 — Port H bit 5 |
| 핀 25 | PTH6 — Port H bit 6 |
| 핀 26 | PTH7 — Port H bit 7 |
| 핀 27 | PTF0 — Port F bit 0 |
| 핀 28 | PTF1 — Port F bit 1 |
| 핀 29 | PTF2 — Port F bit 2 |
| 핀 30 | PTF3 — Port F bit 3 |
| 핀 31 | PTF4 — Port F bit 4 |
| 핀 32 | PTF5 — Port F bit 5 |
| 핀 33 | PTF6 — Port F bit 6 |
| 핀 34 | PTF7 — Port F bit 7 |
| 핀 35 | VDD — Supply voltage (2.5V-3.3V) |
| 핀 36 | VSS — Ground |
| 핀 37 | PTA0 — Port A bit 0 |
| 핀 38 | PTA1 — Port A bit 1 |
| 핀 39 | PTA2 — Port A bit 2 |
| 핀 40 | PTA3 — Port A bit 3 |
| 핀 41 | PTA4 — Port A bit 4 |
| 핀 42 | PTA5 — Port A bit 5 |
| 핀 43 | PTA6 — Port A bit 6 |
| 핀 44 | PTA7 — Port A bit 7 |
| 핀 45 | PTB0 — Port B bit 0 |
| 핀 46 | PTB1 — Port B bit 1 |
| 핀 47 | PTB2 — Port B bit 2 |
| 핀 48 | PTB3 — Port B bit 3 |
| 핀 49 | PTB4 — Port B bit 4 |
| 핀 50 | PTB5 — Port B bit 5 |
| 핀 51 | PTB6 — Port B bit 6 |
| 핀 52 | PTB7 — Port B bit 7 |
| 핀 53 | PTC0 — Port C bit 0 |
| 핀 54 | PTC1 — Port C bit 1 |
| 핀 55 | PTC2 — Port C bit 2 |
| 핀 56 | PTC3 — Port C bit 3 |
| 핀 57 | PTC4 — Port C bit 4 |
| 핀 58 | PTC5 — Port C bit 5 |
| 핀 59 | PTC6 — Port C bit 6 |
| 핀 60 | PTC7 — Port C bit 7 |
| 핀 61 | PTD0 — Port D bit 0 |
| 핀 62 | PTD1 — Port D bit 1 |
| 핀 63 | BKGD — Background Debug Mode pin |
| 핀 64 | RESET — Reset input (active low) |
일반적인 애플리케이션
MC9S08GB60CFUE 적합 용도: 6 애플리케이션s: Home Appliance Control, Industrial Sensor Nodes, Automotive Body Electronics, Consumer Remote Controls, USB HID Peripherals, Motor Drive Controllers.
Home Appliance Control
The MC9S08GB60CFUE's 8-bit HCS08 core at 40MHz and 56 GPIO pins are well-matched to home appliance controllers such as washing machines, microwave ovens, and induction cooktops. With 60KB of Flash, the MCU can host a full state-machine plus user-interface code with EEPROM emulation, while the 4KB RAM is sufficient for sensor buffers and display refresh. The integrated SCI/SPI/I2C interfaces connect directly to inverter boards, keypads, and LED/LCD modules, eliminating external glue logic and reducing BOM cost. The 2.5V-3.3V supply matches low-voltage digital subsections, with internal LDO support on the AC-family siblings for 5V-tolerant I/O. Industrial -40C to +85C temperature rating enables reliable operation inside appliance enclosures where ambient temperatures rise during operation. Estimated: a typical washing-machine controller uses about 35-45KB of code, leaving comfortable headroom in the 60KB Flash for future feature additions.
추천
Industrial Sensor Nodes
In industrial sensor-node applications such as process monitoring, environmental telemetry, and machine-condition sensing, the MC9S08GB60CFUE offers the right balance of analog integration, communication peripherals, and low cost. The HCS08's SCI ports interface directly to RS-485 transceivers, while the SPI/I2C buses drive digital sensors and EEPROMs. With 56 I/O pins, multiple sensor channels and indicator LEDs can be wired without external I/O expanders. The 40MHz core runs PID control loops and digital filters in real time, and the 60KB Flash supports over-the-air (OTA) bootloader plus dual-application banking for failsafe firmware updates. Industrial temperature grade ensures operation in factory-floor enclosures. Estimated: a 4-channel thermocouple monitor with PID output uses approximately 28KB of Flash and 2KB of RAM, well within the GB60's resources.
추천
Automotive Body Electronics
Body-electronics modules such as door-zone controllers, seat-adjustment modules, mirror controllers, and lighting drivers use the MC9S08GB60CFUE where moderate Flash, multiple LIN/CAN-friendly peripherals, and cost-effectiveness are required. The 56 GPIO pins handle multiplexed switch inputs, LED driver outputs, and motor-driver enable signals, while the SCI ports interface to LIN transceivers. The 40MHz HCS08 core handles debounce, fault detection, and PWM generation for motor control. Although the GB60 is industrial-grade (-40C to +85C), the AC-family sibling supports 5V I/O for direct 12V-bus tolerant designs. Estimated: a seat-controller with three motor channels, eight switch inputs, and LED backlight typically uses 32-40KB of Flash, fitting comfortably inside the 60KB available.
추천
Consumer Remote Controls
For consumer remote controls - TV remotes, set-top box controllers, smart-home IR/RF bridges - the MC9S08GB60CFUE provides ample Flash for protocol stacks (RC-5, RC-6, NEC, Zigbee RF4CE) plus user-interface handling. The low pin count of the 64-LQFP is overkill for a simple remote, but the GB60 variant is selected when the design also drives an LCD or OLED display and supports voice or motion sensors. SCI/SPI/I2C peripherals connect to IR/RF transceivers and accelerometer chips. The HCS08 core's low-power modes extend battery life, while 60KB of Flash supports multiple protocol libraries plus a configurable user interface. Estimated: an RC6 + RF4CE + accelerometer remote uses about 45-55KB of Flash, which fits in the GB60 but exceeds the GB32.
추천
USB HID Peripherals
The MC9S08GB60CFUE is used in USB Human Interface Devices (HID) such as keyboards, mice, game controllers, and barcode scanners when the design adds an external USB transceiver chip to compensate for the absence of integrated USB on the S08 core. The 40MHz HCS08 core handles USB HID report descriptors, debounce, and matrix scanning in real time. With 60KB of Flash, multiple HID profiles (boot keyboard, mouse, media controls) can co-exist. The SCI port drives status LEDs while the GPIO ports scan key matrices up to 16x8 with external diodes. Estimated: a 104-key mechanical keyboard with NKRO requires about 38KB of Flash including USB descriptors and debounce logic, leaving room for macro firmware.
추천
Motor Drive Controllers
Small motor-drive controllers - ceiling fans, water pumps, blower modules - employ the MC9S08GB60CFUE as the supervisory MCU that runs PID loops, generates PWM signals, and monitors fault conditions. The HCS08 core at 40MHz computes 20kHz PWM duty cycles with sub-microsecond resolution, while the GPIO pins drive gate-driver enable signals and read Hall-effect sensor inputs. The integrated timers (per NXP datasheet) provide multiple PWM channels for three-phase or dual-half-bridge topologies, and the SCI port connects to inverter/diagnostic boards. The 60KB Flash fits sophisticated sensorless control algorithms. Estimated: a sensorless three-phase BLDC controller uses approximately 40-50KB of Flash including commutation tables and protection logic.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08GB60CFUE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08GB60CFUER | MC9S08GB32CFUE | MC9S08GT60CFUE | MC9S08AC60CFGE |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 (8-bit, CISC) | HCS08 (8-bit, CISC) | HCS08 (8-bit, CISC) | HCS08 (8-bit, CISC) | HCS08 (8-bit, CISC) |
| Maximum CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 60 KB | 60 KB | 32 KB | 60 KB | 60 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Number of I/O Pins | 56 | 56 | 56 | 40 | 56 |
| Supply Voltage | 2.5 V - 3.3 V | 2.5 V - 3.3 V | 2.5 V - 3.3 V | 2.5 V - 3.3 V | 2.7 V - 5.5 V (with 5V-tolerant I/O) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
주요 차별점
- Higher pin count (56 I/O) in the same 64-LQFP footprint (vs MC9S08GT60CFUE)
- Larger Flash than the GB32 sibling without changing the package (vs MC9S08GB32CFUE)
- Industrial temperature grade and Freescale/NXP ecosystem maturity (vs MC9S08AC60CFGE)
설계 노트
The MC9S08GB60CFUE operates from a single 2.5V-3.3V supply. Place a 100nF ceramic decoupling capacitor within 5mm of every VDD pin and a 4.7uF bulk capacitor at the board's power entry. The HCS08 core draws roughly 20-30 mA at 40MHz full activity; reduce the clock frequency in firmware for power-sensitive applications. The internal voltage regulator (if enabled in the AC-family siblings) requires an external bulk capacitor; consult the NXP datasheet MC9S08GB60/D for the recommended capacitance and ESR.
Route the BKGD (Background Debug Mode) and RESET lines away from high-frequency switching nodes. Both are sensitive to noise that can cause spurious resets or BDM communication errors. Use a 4.7kOhm pull-up on RESET and a 10kOhm pull-up on BKGD if not driven externally. Place the external crystal (or resonator) within 5mm of the EXTAL/XTAL pins and guard the traces with a grounded copper pour to minimize EMI coupling.
Do not assume the HCS08's Flash is byte-erasable like EEPROM - it is sector-erasable in 512-byte or 1KB blocks depending on the variant. Implement EEPROM emulation using a wear-leveling algorithm when storing persistent parameters. Avoid driving I/O pins above VDD + 0.3V on the GB60 (industrial) variant - the AC-family siblings have 5V-tolerant I/O. Estimated: a watchdog timer not serviced for more than the configured timeout (typically 1-2 seconds at 40MHz) will reset the MCU; always enable the watchdog in production firmware.
The HCS08's SCI and SPI ports can drive cables up to about 30cm at 115200 baud without termination. For longer runs, lower the baud rate, add series resistors (22-100 ohm), or use a differential transceiver (RS-485, RS-422). The I2C bus requires external pull-up resistors (typically 4.7kOhm at 100kHz, 2.2kOhm at 400kHz); the S08 internal pull-ups are weak (typically 50kOhm) and should not be relied upon for bus compliance.
The 64-LQFP package has a thermal resistance (theta_JA) of approximately 60-70 C/W on a standard 4-layer PCB with 1oz copper. At full 40MHz activity, the MCU dissipates roughly 100-150 mW, yielding a junction temperature rise of 6-10 C above ambient - well within the -40C to +85C industrial range. For high-ambient enclosures (above 70C), use thermal vias under the exposed pad (LQFP has a small die-attached pad) and ensure at least 1 square inch of ground-plane copper for heat spreading.
규정 준수 정보
RoHS/REACH compliance status not explicitly stated in the verified web data; compliance_info values set to 'unknown' pending manufacturer datasheet confirmation. AEC-Q100 qualification is not indicated - this is an industrial-grade part, not automotive-qualified. For automotive applications, evaluate the S08 automotive family (e.g., MC9S08DZxx series) instead.