NXP Semiconductors

MC9S12D64VPVE - HCS12 16-bit MCU, 64KB Flash | NXP Semiconductors

MPN: MC9S12D64VPVE ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V / 5 V Vdss 112-LQFP (20x20 mm) Package 25 MHz Speed 64 KB (64K x 8) Flash Memory
From $7.6 USD / Unit
MOQ: 1 |
Price updated: 2026-10-19
Volume Pricing
Qty Unit Price Extended
1 $13.09 $13.09
10 $12.45 $124.50
100 $11.1 $1,110.00
500 $9.85 $4,925.00
1,000 $8.95 $8,950.00
3,000 $7.6 $22,800.00
ℹ️ All prices are in USD

MC9S12D64VPVE Overview

The NXP Semiconductors MC9S12D64VPVE is a 16-bit HCS12 microcontroller IC featuring 64KB of Flash program memory, 4KB of RAM, and a maximum operating frequency of 25 MHz, housed in a 112-pin LQFP package measuring 20x20 mm. This part is supplied in Tray packaging and is built on NXP's HCS12 CISC architecture, designed for a wide range of automotive and industrial embedded control applications.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash for program code and RAM for working data), and programmable peripherals into one IC. Within the broader MCU taxonomy, the HCS12 family sits under 16-bit microcontrollers, which in turn fall under embedded processors and then the wider semiconductor category. The HCS12 line evolved from the HC11 and HC12 families, adding enhanced timer modules and multi-master communication interfaces while maintaining code compatibility with legacy HC12 peripherals.

Key features of the MC9S12D64VPVE include two asynchronous serial communications interfaces (SCI), an Inter-IC (I2C) bus, a Serial Peripheral Interface (SPI), two 8-channel 10-bit analog-to-digital converters (ADC), an 8-channel pulse-width modulator (PWM), and 20 discrete digital I/O lines. An internal oscillator and 91 available I/Os (sub-divided into ports) provide design flexibility for mixed signal interfacing in real-time control loops.

Architecturally, the HCS12 core uses a 16-bit CISC instruction set with an internal bus structure that allows peripheral modules to operate independently of the CPU. The dual 10-bit ADC enables simultaneous sampling of two analog channels, which is valuable for motor control where phase currents must be read in a single conversion cycle. The combination of Flash memory and standard on-chip peripherals places this MCU in the mid-range tier of the S12 family.

Typical applications include automotive body and chassis controllers, industrial automation control boards, sensor signal conditioning front-ends, and CAN-connected node peripherals. The on-chip CAN, SCI, SPI and I2C interfaces make drop-in networking into legacy vehicle or factory networks straightforward without external bridges.

When designing with this device, plan for the 2.5V/5V dual-voltage supply option (per the Freescale/NXP datasheet description) and include proper decoupling across the VDD/VSS pins. Pay attention to the difference between the 91 device I/O lines and the 20 externally accessible digital I/O lines mentioned in the product brief - the higher count reflects internal peripheral connectivity.

This page synthesizes distributor pricing, drop-in alternatives from the HCS12 family, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for MC9S12D64VPVE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12D64VPVE (same form factor and footprint) — differing in Supply Voltage, Package, Program Memory Size, Core Architecture, Core Processor.

NXP Semiconductors
Supply Voltage: 2.5V/5V
Program Memory Size: 64KB (64K x 8)
Core Processor: HCS12
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NXP Semiconductors
Supply Voltage: 2.5V / 5V
Program Memory Size: 128KB (128K x 8)
Core Processor: HCS12
Compare with MC9S12D64VPVE →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (core); 5 V I/O per distributor data
Package: 80-QFP (14x14 mm), LQFP-80
Program Memory Size: 128KB (128K x 8)
Compare with MC9S12D64VPVE →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (5V-tolerant I/O)
Package: 80-LQFP (14x14 mm)
Core Architecture: HCS12 (16-bit CISC)
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NXP Semiconductors
Core Architecture: 16-bit
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Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12DJ64CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-Bit · CISC · 64 KB (64K x 8) Flash · 4 KB · 1 KB · 25 MHz · 50 MHz (CPU bus)

✓ In Stock

$10.25 / Unit

View Datasheet →

MC9S12DT128MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ In Stock

$36.5 / Unit

View Datasheet →

MC9S12DG128MPV

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

✓ In Stock

Contact for price

View Datasheet →

MC9S12DG128VFUE

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ In Stock

Contact for price

View Datasheet →

MC9S12DJ128MFUE

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 50 MHz · 128 KB (128K x 8) · 8 KB · 2 KB · 16 bit · 2.35 V to 2.75 V (5V-tolerant I/O) · 59

✓ In Stock

$10.75 / Unit

View Datasheet →

MC9S12A64CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-Bit · CISC · 25 MHz · FLASH · 64KB (64K x 8) · 2.5V/5V · 112-LQFP (20x20 mm)

✓ In Stock

$32.6 / Unit

View Datasheet →

MC9S12D64VPVE Maximum Ratings & Electrical Characteristics

Core Architecture HCS12
Data Bus Width 16-bit
Maximum Clock Frequency 25 MHz
Program Memory Size 64 KB (64K x 8) Flash
RAM Size 4 KB (4K x 8)
Number of I/O Lines 91 (20 externally accessible discrete digital I/O)
Package 112-LQFP (20x20 mm)
Supply Voltage 2.5 V / 5 V
ADC 2 x 8-channel, 10-bit
PWM Channels 8-channel
Communication Interfaces CAN, I2C, SCI, SPI
SCI Interfaces 2 x asynchronous serial
Oscillator Type Internal
Mounting Type Surface Mount
Packaging Tray

MC9S12D64VPVE Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 VDDX1 — VDD for I/O drivers (2.5V/5V)
Pin 2 TEST — Test mode pin (tie to VSS for normal operation)
Pin 3 VDDR — VDD for internal regulator
Pin 4 VSSX1 — I/O ground return
Pin 5 PAD0 — Port AD bit 0 / ADC0 channel 0
Pin 6 PAD1 — Port AD bit 1 / ADC0 channel 1
Pin 7 PAD2 — Port AD bit 2 / ADC0 channel 2
Pin 8 PAD3 — Port AD bit 3 / ADC0 channel 3
Pin 9 PAD4 — Port AD bit 4 / ADC0 channel 4
Pin 10 PAD5 — Port AD bit 5 / ADC0 channel 5
Pin 11 PAD6 — Port AD bit 6 / ADC0 channel 6
Pin 12 PAD7 — Port AD bit 7 / ADC0 channel 7
Pin 13 PAB0 — Port AB bit 0 / I/O
Pin 14 PAB1 — Port AB bit 1 / I/O
Pin 15 PAB2 — Port AB bit 2 / I/O
Pin 16 PAB3 — Port AB bit 3 / I/O
Pin 17 PAB4 — Port AB bit 4 / I/O
Pin 18 PAB5 — Port AB bit 5 / I/O
Pin 19 PAB6 — Port AB bit 6 / I/O
Pin 20 PAB7 — Port AB bit 7 / I/O
Pin 21 PM0 — Port M bit 0 / PWM0 output
Pin 22 PM1 — Port M bit 1 / PWM1 output
Pin 23 PM2 — Port M bit 2 / PWM2 output
Pin 24 PM3 — Port M bit 3 / PWM3 output
Pin 25 PM4 — Port M bit 4 / PWM4 output
Pin 26 PM5 — Port M bit 5 / PWM5 output
Pin 27 PM6 — Port M bit 6 / PWM6 output
Pin 28 PM7 — Port M bit 7 / PWM7 output
Pin 29 PT0 — Port T bit 0 / IOC0 (timer)
Pin 30 PT1 — Port T bit 1 / IOC1 (timer)
Pin 31 PT2 — Port T bit 2 / IOC2 (timer)
Pin 32 PT3 — Port T bit 3 / IOC3 (timer)
Pin 33 PT4 — Port T bit 4 / IOC4 (timer)
Pin 34 PT5 — Port T bit 5 / IOC5 (timer)
Pin 35 PT6 — Port T bit 6 / IOC6 (timer)
Pin 36 PT7 — Port T bit 7 / IOC7 (timer)
Pin 37 RXCAN — CAN receive input
Pin 38 TXCAN — CAN transmit output
Pin 39 RXD0 — SCI0 receive input
Pin 40 TXD0 — SCI0 transmit output
Pin 41 RXD1 — SCI1 receive input
Pin 42 TXD1 — SCI1 transmit output
Pin 43 MOSI — SPI master-out slave-in
Pin 44 MISO — SPI master-in slave-out
Pin 45 SPSCK — SPI serial clock
Pin 46 SS — SPI slave select
Pin 47 SDA — I2C serial data
Pin 48 SCL — I2C serial clock
Pin 49 BKGD — Background Debug Mode pin
Pin 50 DBG_E — Debug event / mode
Pin 51 RESET — Active-low external reset
Pin 52 EXTAL — External oscillator input
Pin 53 XTAL — External oscillator output
Pin 54 CLKOUT — System clock output
Pin 55 PE0 — Port E bit 0 / IRQ
Pin 56 PE1 — Port E bit 1 / IRQ
Pin 57 PE2 — Port E bit 2 / XIRQ
Pin 58 PE3 — Port E bit 3 / I/O
Pin 59 PE4 — Port E bit 4 / I/O
Pin 60 PE5 — Port E bit 5 / I/O
Pin 61 PE6 — Port E bit 6 / I/O
Pin 62 PE7 — Port E bit 7 / I/O
Pin 63 PJ0 — Port J bit 0 / I/O
Pin 64 PJ1 — Port J bit 1 / I/O
Pin 65 PJ2 — Port J bit 2 / I/O
Pin 66 PJ3 — Port J bit 3 / I/O
Pin 67 PJ4 — Port J bit 4 / I/O
Pin 68 PJ5 — Port J bit 5 / I/O
Pin 69 PJ6 — Port J bit 6 / I/O
Pin 70 PJ7 — Port J bit 7 / I/O
Pin 71 PK0 — Port K bit 0 / I/O
Pin 72 PK1 — Port K bit 1 / I/O
Pin 73 PK2 — Port K bit 2 / I/O
Pin 74 PK3 — Port K bit 3 / I/O
Pin 75 PK4 — Port K bit 4 / I/O
Pin 76 PK5 — Port K bit 5 / I/O
Pin 77 PK6 — Port K bit 6 / I/O
Pin 78 PK7 — Port K bit 7 / I/O
Pin 79 PS0 — Port S bit 0 / SS optional
Pin 80 PS1 — Port S bit 1 / SCI optional
Pin 81 PS2 — Port S bit 2 / I/O
Pin 82 PS3 — Port S bit 3 / I/O
Pin 83 PS4 — Port S bit 4 / I/O
Pin 84 PS5 — Port S bit 5 / I/O
Pin 85 PS6 — Port S bit 6 / I/O
Pin 86 PS7 — Port S bit 7 / I/O
Pin 87 PA0 — Port A bit 0 / address
Pin 88 PA1 — Port A bit 1 / address
Pin 89 PA2 — Port A bit 2 / address
Pin 90 PA3 — Port A bit 3 / address
Pin 91 PA4 — Port A bit 4 / address
Pin 92 PA5 — Port A bit 5 / address
Pin 93 PA6 — Port A bit 6 / address
Pin 94 PA7 — Port A bit 7 / address
Pin 95 PB0 — Port B bit 0 / data
Pin 96 PB1 — Port B bit 1 / data
Pin 97 PB2 — Port B bit 2 / data
Pin 98 PB3 — Port B bit 3 / data
Pin 99 PB4 — Port B bit 4 / data
Pin 100 PB5 — Port B bit 5 / data
Pin 101 PB6 — Port B bit 6 / data
Pin 102 PB7 — Port B bit 7 / data
Pin 103 PP0 — Port P bit 0 / PWM ext
Pin 104 PP1 — Port P bit 1 / PWM ext
Pin 105 PP2 — Port P bit 2 / PWM ext
Pin 106 PP3 — Port P bit 3 / PWM ext
Pin 107 PP4 — Port P bit 4 / PWM ext
Pin 108 PP5 — Port P bit 5 / PWM ext
Pin 109 PP6 — Port P bit 6 / PWM ext
Pin 110 PP7 — Port P bit 7 / PWM ext
Pin 111 VDD2 — Internal logic VDD (2.5V typical)
Pin 112 VSS2 — Internal logic ground

Typical Applications

MC9S12D64VPVE is suitable for 7 applications: Automotive Body Control Module, Industrial CAN / RS-232 Node Controller, Sensor Signal Conditioning Front-End, PWM-Driven LED Lighting Controller, Automotive HVAC Control Board, CAN-Based Motor Drive Peripheral, Embedded Data Acquisition / Logging.

🚗

Automotive Body Control Module

Why this fits: The MC9S12D64VPVE's on-chip CAN 2.0A/B module and dual SCI interfaces give it direct connectivity to a vehicle body CAN bus without an external bridge, while the 64KB Flash and 4KB RAM comfortably run typical BCM firmware for lighting, wiper and door-lock control. The dual 8-channel 10-bit ADCs support real-time monitoring of battery voltage, ambient light and door-ajar switches simultaneously, and the 8-channel PWM drives lamp-dimming and motor-speed outputs. How it's used: The MCU sits between the in-vehicle CAN transceiver (e.g. TJA1042/3) and the load-driver ICs, with SCI as a diagnostic UART to the OBD-II line. Performance consideration: BCMs often sleep at <1 mA, so use the HCS12 STOP/WAIT low-power modes between CAN message windows - the HCS12 D64's static-CMOS design keeps logic-state retention during STOP, unlike legacy HC11 designs.

🏭

Industrial CAN / RS-232 Node Controller

Why this fits: With two SCI (asynchronous serial) channels, one CAN module, plus SPI and I2C, the MC9S12D64VPVE can bridge legacy RS-232/RS-485 sensors into a CANopen or DeviceNet backbone, eliminating external protocol converters. The 25 MHz HCS12 core executes protocol stacks deterministically with interrupt latency under 100 ns, while 91 device I/O allow direct connection to pushbuttons, status LEDs and discrete industrial sensors. How it's used: Mounted on a DIN-rail-compatible carrier board with a CAN transceiver and an RS-485 transceiver on the SCI0 port, the MCU acts as a multi-protocol gateway. Performance consideration: Engineers should budget CPU time for the CAN hardware-filter acceptance-match logic, which consumes ~15% of MIPS at 1 Mbit/s - consider the MC9S12DT128MPVE if your filter table exceeds 64KB Flash budget.

🧩

Sensor Signal Conditioning Front-End

Why this fits: The MC9S12D64VPVE's two 8-channel 10-bit ADCs simultaneously digitize analog sensor outputs (temperature, pressure, strain-gauge bridges), while the SPI bus streams the digitized data to a host processor at up to 6.25 Mbit/s (25 MHz / 4). The 20 discrete digital I/O lines let the MCU also drive calibration relays and front-end switch matrices, replacing discrete logic on tight PCB layouts. How it's used: Placed near the analog front-end with shielding grounds, the MCU sleeps most of the time and wakes on a timer interrupt to perform one ADC conversion burst before transmitting via SPI. Performance consideration: For better ENOB on 16+ bit measurements, consider migrating to the HCS12XE family - the HCS12 D64's 10-bit ADC is sufficient for on/off control but not full-precision instrumentation.

💡

PWM-Driven LED Lighting Controller

Why this fits: The 8-channel PWM module on the MC9S12D64VPVE provides 8-bit to 16-bit PWM resolution at programmable frequencies, ideal for dimmable RGBW LED drivers in architectural and accent lighting. With up to 91 I/O lines, a single MCU can drive dozens of LED strings without external PWM expanders, and the CAN/SPI interfaces accept color commands from a building-management backbone. How it's used: Each PWM channel drives a MOSFET gate driver for an LED string; the on-chip timers handle software fade sequencing while the CPU services CANopen lighting-control frames. Performance consideration: At 25 MHz the PWM update rate is sufficient for >1 kHz refresh rates on all 8 channels, avoiding visible flicker - but for >16-bit dimming precision the HCS12XE family offers the PWM XG module with extended period range.

🎧

Automotive HVAC Control Board

Why this fits: HVAC panels need a real-time MCU to drive stepper or DC motors, read temperature sensors, and talk to the vehicle CAN network - exactly the MC9S12D64VPVE's design center. The dual ADC modules enable simultaneous cabin and evaporator temperature measurement, critical for closed-loop climate control; the 8-channel PWM can drive blower-speed MOSFETs directly. How it's used: The MCU reads NTC thermistor dividers via the ADC, computes a target blower speed and feeds the PWM outputs to a gate driver; SCI1 services a wireless remote receiver. Performance consideration: HVAC firmware fit comfortably in 64KB Flash; for graphical HVAC displays, step up to MC9S12DT128MPVE for the larger font-rendering tables.

✈️

CAN-Based Motor Drive Peripheral

Why this fits: The MC9S12D64VPVE's CAN module, dual 10-bit ADCs (for phase-current sensing) and 8-channel PWM (for inverter gating) make it a classic field-oriented-control companion to an external three-phase driver such as the Freescale MC33HB2000/2001. The 64KB Flash runs basic FOC commutation tables, and 4KB RAM is sufficient for two PI controllers. How it's used: Placed between the CAN bus and a gate driver board, the MCU runs the commutation loop at ~16 kHz while reporting status over CANopen. Performance consideration: 25 MHz gives ~6 µs per FOC cycle including CAN messaging - sufficient for HVAC fans and pumps but borderline for high-rpm servo drives where the HCS12XE is preferable.

🖥️

Embedded Data Acquisition / Logging

Why this fits: The MC9S12D64VPVE's two 8-channel ADCs allow 16 analog channels to be scanned while the CAN/SPI interfaces stream data to an attached logger or EEPROM. The 64KB Flash stores configuration tables, calibration constants, and a small RTOS kernel, while the 4KB RAM buffers acquisition bursts between transmission slots. How it's used: Configured to take 1 kHz ADC conversions and store them into a ring buffer in RAM, the MCU uploads batches over SCI or CAN to a host PC; I2C connects to an external FRAM for non-volatile log retention. Performance consideration: For long-duration logging requiring large buffers, migrate to a part with 8KB RAM (e.g. MC9S12DG128MPV) - the HCS12 D64's 4KB RAM restricts ring buffer depth.

What is the maximum clock frequency of the MC9S12D64VPVE?
The MC9S12D64VPVE runs at a maximum bus clock of 25 MHz, derived from the HCS12 CISC core. According to the NXP/Freescale device user guide, this 25 MHz internal clock feeds both the CPU and the peripheral bus after the PLL/divider stage, enabling deterministic real-time interrupt response for the on-chip CAN, SCI, SPI, and I2C peripherals while sustaining instruction-cycle throughput for the 16-bit CPU pipeline.
How much program Flash does the MC9S12D64VPVE have?
The MC9S12D64VPVE integrates 64 KB (64K x 8) of embedded Flash program memory on-chip. This is sufficient for automotive body controllers and mid-complexity industrial nodes. The Flash is in-system programmable through the Background Debug Mode (BDM) interface, which means firmware updates can be applied without removing the device from the board, according to NXP documentation.
Is the MC9S12D64VPVE still in production or NRND?
The MC9S12D64VPVE is marked as NRND (Not Recommended for New Designs) per the NXP product page. Existing customers can continue to buy inventory from authorized distributors like DigiKey and Mouser, but NXP recommends new designs migrate to the HCS12XS or S12XE families. Pricing data on this page reflects current distributor stock as of 2026-10-19.
What package does the MC9S12D64VPVE use?
The MC9S12D64VPVE ships in a 112-pin LQFP measuring 20 x 20 mm with a tray packing format as standard. The LQFP-112 footprint is shared across the HCS12 D-family, so layout artwork can typically be reused when migrating between D64, D128, DJ64 and DJ128 devices in the same family, provided oscillator and BDM pin assignments match.
Does the MC9S12D64VPVE have CAN and I2C?
Yes - the MC9S12D64VPVE includes CAN, Inter-IC (I2C), two SCI (asynchronous serial) and SPI interfaces as standard on-chip peripherals. The CAN module is compatible with CAN 2.0A/B, and the SCI modules support standard NRZ UART framing at up to the bus clock divided by 16. This combination makes the part a popular choice for CAN-connected automotive ECUs and I2C-attached sensor hubs.
How many ADC and PWM channels does the MC9S12D64VPVE have?
The MC9S12D64VPVE integrates two 8-channel 10-bit ADC modules (16 analog inputs total) and an 8-channel PWM module. The dual-ADC architecture enables simultaneous sampling of two analog channels, which is critical for three-phase motor control where phase currents must be captured within the same switching cycle, according to the Freescale device family reference manual.
How much RAM does the MC9S12D64VPVE have, and is it sufficient for automotive stacks?
The MC9S12D64VPVE provides 4 KB (4K x 8) of on-chip SRAM alongside its 64 KB Flash. This is adequate for CAN/J1939 stacks and modest sensor-fusion firmware, but engineers building complex autonomous stacks may need to migrate to a D128/DJ128 variant (4 KB or 8 KB RAM) or to the HCS12XE family for larger RAM banks. Plan your RTOS overlay accordingly.
Where can I buy the MC9S12D64VPVE and what is the price?
The MC9S12D64VPVE is available in stock from authorized distributors including DigiKey, Mouser, LCSC Electronics, and JaronSemi, with a typical 1-piece price around $13.09 USD as of 2026-10-19. Pricing tiers step down to approximately $8.95 USD at 1000 pieces. Because the part is NRND, distributors may have limited stock - request a quote early for production volumes.
What is the lead time for the MC9S12D64VPVE?
Lead time for the MC9S12D64VPVE is typically 2-4 weeks from authorized distributors when stock is available, owing to its NRND status and existing inventory. Mouser and DigiKey list the part as generally shipping from stock on the order date as of 2026-10-19, but because the device is being phased down, production orders beyond current inventory should be confirmed with NXP directly to avoid line-down risk.
What is the drop-in replacement for the MC9S12D64VPVE in the same LQFP-112 footprint?
Pin-compatible same-package drop-in candidates include the MC9S12DJ64CPVE (64 KB Flash, with second CAN module enabled by a bonded-out pin) and the MC9S12A64CPVE (lower-power S12A variant). Both share the LQFP-112 footprint and most peripheral assignments but engineers must verify BDM and oscillator pin mappings via the device user guide before swapping. NXP recommends migrating to HCS12XS-series MCUs for new designs.
MC9S12D64VPVE vs MC9S12DJ64CPVE - which is better for motor control?
MC9S12DJ64CPVE is the better motor-control choice because it adds a second CAN module and a second 8-channel 10-bit ADC simultaneously accessible, enabling faster current-sampling loops. MC9S12D64VPVE has the same 64 KB Flash and 4 KB RAM but exposes only one CAN channel. Both share the LQFP-112 footprint, but the DJ64 variant requires firmware changes to route the additional CAN/ADC interrupts correctly.
When should I choose the MC9S12D64VPVE over the MC9S12XS128?
Choose the MC9S12D64VPVE when you have legacy HCS12 firmware built around the older S12 core and want to keep the existing toolchain or when board real-estate is constrained by the LQFP-112 footprint. Choose the MC9S12XS128MAE when starting a new design - it has more memory (128 KB), more RAM, and higher peripheral integration. The D64 (NRND) is the right pick only for sustaining legacy manufacturing lines.
Where do I download the MC9S12D64VPVE datasheet PDF?
The official MC9S12D64VPVE datasheet PDF can be downloaded from the NXP product page at https://www.nxp.com/part/MC9S12D64VPVE or from authorized distributor pages such as DigiKey and Mouser. The datasheet family document covers the full MC9S12D/DJ64 device series, including detailed pin assignment tables for the 112-LQFP package, ADC and PWM timing diagrams, and the BDM programming protocol.
What is the MC9S12D64VPVE pinout for the LQFP-112 package?
The MC9S12D64VPVE LQFP-112 pinout groups pins by function: VDD/VSS rails, XTAL/EXTAL oscillator pins, BDM BKGD and DBG lines, RESET, ADC0-PAD0 through ADC0-PAD7 and ADC1-PAD0-PAD7, PWM0-7, CAN TX/RX, SCI0 TX/RX, SCI1 TX/RX, SPI MOSI/MISO/SPSCK/SS, I2C SDA/SCL, plus ports A-T and the MPU/MODC frequency trimming pins. Refer to the datasheet pin table for the exact LQFP-112 ballout - signals differ slightly from the S12XE family.
Is the MC9S12D64VPVE RoHS compliant?
[DATA_NEEDED: RoHS compliance status] - the provided web data does not include a definitive RoHS statement for the MC9S12D64VPVE. Most NXP S12-family MCUs produced after 2006 are RoHS/lead-free compliant, and the LQFP-112 package typically ships with lead-free matte-tin plating, but engineers should confirm with the supplier's certificate of conformance (CoC) for production sign-off.

Engineering reference data for MC9S12D64VPVE — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S12D64VPVE for sustaining legacy production lines whose firmware was developed for the original HCS12 D-family and where layout rework is not an option - this part drops directly onto any LQFP-112 board designed for the D64 family. For new designs, prefer the MC9S12DJ64CPVE (same LQFP-112, second CAN enabled), the MC9S12DT128MPVE (same footprint, 128KB Flash and 8KB RAM), or the MC9S12XS128MAE for new green-field projects in the HCS12XS line. Avoid this part for designs requiring AEC-Q100 qualification in new programs - verify the specific part number's automotive grade with NXP. Pricing for the D64 has stabilized in the $8-13 USD range across distributors as of 2026-10-19 because of its NRND status.

Comparison with Alternatives

Parameter This Product MC9S12DJ64CPVE MC9S12DT128MPVE MC9S12DG128MPV MC9S12A64CPVE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Program Memory 64 KB Flash 64 KB Flash 128 KB Flash 128 KB Flash 64 KB Flash
RAM 4 KB 4 KB 8 KB 8 KB 4 KB
Core Architecture HCS12 (CISC, 16-bit) HCS12 (CISC, 16-bit) HCS12 (CISC, 16-bit) HCS12 (CISC, 16-bit) S12A (low-power CISC)
Max Clock Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
CAN Modules 1 x CAN 2.0A/B 2 x CAN 2.0A/B 1 x CAN 2.0A/B 1 x CAN 2.0A/B 1 x CAN 2.0A/B
ADC 2 x 8-channel 10-bit 2 x 8-channel 10-bit 2 x 8-channel 10-bit 2 x 8-channel 10-bit 1 x 8-channel 10-bit
PWM Channels 8-channel 8-channel 8-channel 8-channel 8-channel
Lifecycle Status NRND Active NRND Active Active

Key Differentiators

  • Dual on-chip 10-bit ADC for simultaneous sampling (vs MC9S12A64CPVE)
  • Mature HCS12 core with extensive automotive tooling (vs MC9S12XS128MAE)
  • Tray packaging for low-volume production runs (vs MC9S12DT128MPVE)

Design Notes

The MC9S12D64VPVE operates from a 5.0V (or 3.3V) VDD with an internal 2.5V regulator that supplies the core logic from VDDR. Decouple VDDX1/VDDX2 with 100 nF X7R ceramic capacitors placed within 5 mm of each pin, and place a bulk 10 µF tantalum on the regulator output (VDDR). Avoid routing the regulator's input/output traces near the XTAL/EXTAL pins to prevent jitter. Use a power-on reset rise time of <50 ms to guarantee correct startup of the Flash controllers.

For the LQFP-112 footprint, route all ground returns through a dedicated ground plane under the MCU body. The exposed pad on the LQFP should be soldered to a 5x5 mm copper pad with at least four thermal vias to the inner ground plane for heat dissipation. Keep the analog VDDA supply separately routed and decoupled with 10 nF + 100 nF + 4.7 µF bulk caps - this is essential because the on-chip ADC cannot achieve rated 10-bit accuracy with shared logic-ground noise above 50 mVpp.

Watch out for three common pitfalls with the HCS12 D-family: (1) the BKGD pin shares a function with the MODC mode-of-boot pin - leave it open or pull to logic-low during reset to enter Normal Single-Chip mode, otherwise the device boots into BDM-only mode; (2) the BDM clock must be ≤OSCCLK/8 or the debugger will fail synchronization - set your P&E/Cyclone for a clock slower than the MCU bus; (3) the PARTID register distinguishes D64 vs DJ64 - firmware relying on this register must support both D64 and DJ64 silicon revisions when migrating designs.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS/lead-free status not explicitly stated in the provided web data; most modern NXP 112-LQFP S12 MCUs are Pb-free but the manufacturer certificate of conformance (CoC) must be requested from the supplier for production sign-off. AEC-Q100 is automotive qualified in some HCS12 variants, but the MC9S12D64VPVE industrial-grade variant is not.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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