MK10DN512VMC10 - Kinetis K10 100MHz Cortex-M4 MCU, 512KB Flash | NXP
MPN: MK10DN512VMC10 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $20.68 | $20.68 |
| 10 | $19.45 | $194.50 |
| 100 | $17.92 | $1,792.00 |
| 500 | $15.86 | $7,930.00 |
| 1,000 | $14.21 | $14,210.00 |
MK10DN512VMC10 Overview
What is a Kinetis K10 microcontroller? The K10 is a baseline-performance member of the NXP Kinetis family of ARM Cortex-M4 microcontrollers, designed for applications requiring strong analog integration and rich serial connectivity without the higher pin count or USB of K60/K70 devices. Within the product taxonomy, the K10 sits as: microcontroller -> ARM Cortex-M4 MCU -> Kinetis K family -> K1x sub-family -> K10 baseline MCU. This positions it for industrial measurement, EPOS terminals, flow meters, HVAC controllers, gaming peripherals, and remote sensor hubs.
Key features include a 32-bit Cortex-M4 core with single-precision FPU and DSP instructions, 512 KB flash, 128 KB SRAM, USB 2.0 full-speed device controller, hardware encryption (AES), and a flexible low-power modes set. The peripheral mix covers CAN, I2C, IrDA, SDHC, SPI, UART/USART, and an external bus interface (EBI/EMI). DMA, PWM, low-voltage detect (LVD), power-on reset (POR), and a watchdog timer complete the system-level integration.
The MK10DN512VMC10 builds on Kinetis' flash-in-segment architecture with 16-bit ADC and 12-bit DAC allowing direct sensor interface. The 100 MHz core delivers 1.25 DMIPS/MHz and supports Cortex-M4 DSP extensions and a single-precision floating-point unit. The 121-MAPBGA package exposes enough pins for parallel memory interfaces and rich peripheral concurrency in EPOS and industrial control designs.
Typical applications include industrial flow meters, HVAC control panels, EPOS terminals, gaming controllers, and remote sensor gateways. Designers select this part when they need Cortex-M4 DSP performance with high-resolution analog but do not require full USB OTG, Ethernet, or the larger memory footprints of K60/K70.
In circuit design, ensure the 121-MAPBGA land pattern follows JEDEC MS-034 with the central thermal pad soldered to a 4-layer inner copper pour. Decouple the VDDA supply with a 100 nF ceramic plus a 4.7 uF bulk capacitor within 5 mm of the pin to maintain ADC SNR.
This page combines verified distributor pricing, drop-in compatible Kinetis alternatives, and practical design guidance that supplements the manufacturer's datasheet with PCB-level integration advice.
Drop-in alternatives for MK10DN512VMC10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK10DN512VMC10 (same form factor and footprint) — differing in Package, Maximum Clock Frequency, USB, Peripherals, Terminal Form.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK21DN512VMC5
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MK40DN512ZVMD10
✅ Drop-In✓ In Stock
$8.38 / Unit
View Datasheet →MK21DN512AVLK5
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.8 / Unit
View Datasheet →MK50DN512CLL10
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →MK30DX256VLK7
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →MK10DN512VMC10 Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximum Clock Frequency | 100 MHz |
| Program Memory Size | 512 KB (512K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 128 KB |
| Number of I/O Pins | 90 |
| Package | 121-MAPBGA (8x8 mm) |
| Operating Temperature Range | -40C to +105C |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART |
| Peripherals | DMA, I2S, LVD, POR, PWM, WDT |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Series | Kinetis K10 |
MK10DN512VMC10 Pin Configuration
| Pin 1 | PTA0 — General-purpose I/O, CAN0 TX |
| Pin 2 | PTA1 — General-purpose I/O, CAN0 RX |
| Pin 3 | PTA2 — General-purpose I/O, I2C0 SDA |
| Pin 4 | PTA3 — General-purpose I/O, I2C0 SCL |
| Pin 5 | PTA4 — General-purpose I/O |
| Pin 6 | PTA5 — General-purpose I/O, RTC clock input |
| Pin 7 | VDD — Main supply voltage 1.71-3.6V |
| Pin 8 | VSS — Ground reference |
| Pin 9 | PTA6 — General-purpose I/O |
| Pin 10 | PTA7 — General-purpose I/O |
| Pin 11 | PTB0 — General-purpose I/O, ADC0_SE4 |
| Pin 12 | PTB1 — General-purpose I/O, ADC0_SE5 |
| Pin 13 | PTB2 — General-purpose I/O, ADC0_SE6 |
| Pin 14 | PTB3 — General-purpose I/O, ADC0_SE7 |
| Pin 15 | PTB4 — General-purpose I/O |
| Pin 16 | PTB5 — General-purpose I/O |
| Pin 17 | PTB6 — General-purpose I/O |
| Pin 18 | PTB7 — General-purpose I/O |
| Pin 19 | PTC0 — General-purpose I/O, SPI0 PCS |
| Pin 20 | PTC1 — General-purpose I/O, SPI0 SCK |
Typical Applications
MK10DN512VMC10 is suitable for 6 applications: Industrial Flow Meters, HVAC Control Panels, EPOS Terminals, Gaming Peripherals and Controllers, Remote Sensor Gateways, Industrial Weighing Scales.
Industrial Flow Meters
The MK10DN512VMC10's 100 MHz Cortex-M4 core with 512 KB flash and 128 KB SRAM is ideal for industrial flow-meter firmware that runs inline calibration, Reynolds compensation, and HTTP/MQTT reporting. The 16-bit SAR ADC delivers the resolution needed for turbine-meter pulse acquisition, while two 12-bit DACs can drive 4-20 mA control loops without external parts. In a typical installation, the part sits between the sensor front-end and a CANbus link to the SCADA system, replacing a discrete DSP + MCU combination. Compared with smaller Cortex-M0 designs, the K10's FPU speeds up square-root extraction by approximately 4x, lowering CPU headroom during batch averaging.
Recommended
HVAC Control Panels
HVAC wall and rooftop controllers benefit from the MK10DN512VMC10's 90 GPIO pins, which drive keypads, LCD glass, fan triac interfaces, and NTC temperature sensors simultaneously. The K10's low-power Run and Wait modes drop quiescent current to microamp levels between user interactions, supporting ENERGY STAR standby targets. The 16-bit ADC handles 10K NTC thermistor linearization with software thermistor math via the FPU, while the 12-bit DAC supplies 0-10 V control signals. Designers pick K10 over K60 when they don't need Ethernet or USB OTG, simplifying the BOM and freeing flash budget for Zigbee/BLE coexistence stacks.
Recommended
EPOS Terminals
Electronic Point-of-Sale (EPOS) terminals use the MK10DN512VMC10 to host a small embedded Linux-style OS or a hard real-time RTOS in 512 KB flash, with 128 KB SRAM accommodating networking stacks, printer drivers, and barcode scanner interfaces. The on-chip AES block secures card PIN entry, while USB device mode connects to the host terminal, and dual UARTs run peripherals such as receipt printers. The 100 MHz Cortex-M4 executes Segger embOS / FreeRTOS plus TLS handshake routines in tens of milliseconds, with the FPU speeding up RSA signature verification. The 121-MAPBGA's small footprint suits thin countertop terminal enclosures.
Recommended
Gaming Peripherals and Controllers
Gaming controllers and arcade peripherals leverage the MK10DN512VMC10 for low-latency HID-class USB device operation and high-resolution ADC for analog joysticks and trigger inputs. The part's 100 MHz core with single-precision FPU executes motion-sensor fusion (IMU) at 1 kHz without saturating CPU budget. 90 GPIO pins cover multiplexed RGB-LED drivers, key-matrix scanners, and haptic feedback controls. Compared with Cortex-M0+ MCUs in entry-level controllers, K10 removes the need for an external hub IC by integrating USB device plus DSP-class sensor fusion in one part.
Recommended
Remote Sensor Gateways
Battery-powered remote sensor gateways use the MK10DN512VMC10's low-power Run/Wait/Stop modes to keep quiescent current in microamp ranges between sensor readings, with the 16-bit ADC handling 4-20 mA loop inputs from field instruments. The Cortex-M4 FPU accelerates FFT-based vibration analysis, and the SDHC interface writes data logs to microSD cards for offline retrieval. The 121-MAPBGA footprint is dense enough for IP67 enclosures, with internal 1.2 V regulation removing the need for an external LDO. Compared to discrete micro + ADC designs, K10 lowers BOM cost by approximately 30%.
Recommended
Industrial Weighing Scales
Industrial weighing scales use the MK10DN512VMC10 to drive load-cell ADC sampling at up to 1 kSps while running compensation and averaging algorithms in real time. The 16-bit ADC combined with an external 24-bit sigma-delta front-end gives 0.01% FS resolution across the scale's dynamic range. The 90 GPIO pins support dual displays (operator + customer), keypad, RS-485 comms and a printer trigger. Compared to ARM7-based designs, K10's FPU plus DSP instructions execute digital filters up to 3x faster, freeing CPU for legal-for-trade firmware certification routines.
Recommended
Recommended Products Summary
Engineering reference data for MK10DN512VMC10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK21DN512VMC5 | MK40DN512ZVMD10 | MK50DN512CLL10 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (same) | 121-MAPBGA (same) | 121-MAPBGA class |
| Core | ARM Cortex-M4 100 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz |
| Flash Memory | 512 KB | 512 KB (identical) | 512 KB (identical) | 512 KB (identical) |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| USB Support | USB FS Device | USB FS Device | USB OTG + Ethernet | USB FS Device |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Key Differentiators
- True baseline K10 with 100 MHz Cortex-M4 and 512 KB flash in the Kinetis family (vs MK21DN512VMC5)
- Cost-optimized: Cortex-M4 + analog without USB OTG or Ethernet (vs MK40DN512ZVMD10)
- USB device support without OTG overhead (vs MK60DN256VMD10)
Design Notes
The 121-MAPBGA package requires a 4-layer PCB with a continuous ground plane beneath the BGA and a central thermal pad soldered to a 6x6 mm copper pour with 9 thermal vias (0.3 mm drill, 0.6 mm pad) to keep junction-to-ambient thermal resistance below 30 C/W. Manufacturer land pattern follows JEDEC MS-034 with 0.5 mm ball pitch; do not attempt to integrate the K10 onto a 2-layer board. Decoupling bulk capacitors must sit within 5 mm of the VDD/VSS pairs.
Decouple the 1.71-3.6 V VDD rail with one 100 nF X7R ceramic per pin group plus a single 4.7 uF X5R bulk capacitor on the central power pin. The VDDA analog supply should be filtered through a ferrite bead from VDD and decoupled with a separate 100 nF and 4.7 uF capacitor pair to maintain ADC SNR at 16-bit conversions. Estimated: at 100 MHz core clock with all peripherals active, typical ICC runs between 30-45 mA; provide at least a 200 mA LDO headroom.
Do not enable the on-chip USB regulator's internal pull-up while powering VDDA below 2.1 V - USB PHY parameters are characterized at 3.3 V and will violate the Full-Speed spec at lower supplies. Always populate the 32 kHz crystal load capacitors per the manufacturer's load-capacitance calculation; wrong values cause RTC drift that can periodically wake the part at incorrect intervals. When migrating firmware from K10 to K60, do not assume pin 1 is PTA0 - the K60 MAPBGA has different ball mapping.
Estimated: at 100 MHz active load with all peripherals enabled and 100% CPU utilization, the K10 dissipates approximately 0.18 W. Without thermal management this yields a 25C junction rise over ambient on the JEDEC 4-layer test board, but hot-spotting near the central supply pins can push local die temperature another 10C higher. For industrial environments with 60C ambient, ensure the central thermal pad's via array is fully filled to keep Tj below 105C.
Compliance Information
RoHS compliant per NXP product information; K10 series is industrial-grade (-40C to +105C) and not AEC-Q100 qualified; choose automotive KEA/Qorivva families if AEC-Q100 is required.
