MK40DX64VMC7 - 72MHz Cortex-M4 MCU, 64KB Flash | NXP
MPN: MK40DX64VMC7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.18 | $518.00 |
| 500 | $4.62 | $2,310.00 |
| 1,000 | $4.15 | $4,150.00 |
MK40DX64VMC7 Overview
A microcontroller (MCU) is a single-chip computing platform that integrates a CPU core, program and data memory, and a wide range of peripherals into one device. Within the embedded hierarchy, the MK40DX64VMC7 belongs to the Kinetis K40 sub-family of ARM Cortex-M4 microcontrollers, itself a mid-performance tier inside the broader Kinetis MCU portfolio, which in turn sits within NXP's 32-bit MCU product line and the wider semiconductor category of integrated circuits for embedded control.
The key feature set for this device includes hardware USB 2.0 Full-Speed On-The-Go (OTG) with integrated transceiver, segment LCD driver support, a 16-bit SAR ADC with programmable gain amplifier, low-power touch-sensing wake-up unit (TSI), and flexible low-power run, wait, and stop modes. The part operates from a single 1.71 V to 3.6 V supply and provides up to 100 general-purpose I/O pins alongside communication interfaces such as UART, SPI, I2C, CAN, and I2S.
Architecturally, the part integrates a high-performance ARM Cortex-M4 core with single-precision floating-point and DSP extensions, on-chip voltage regulation, a flexible DMA controller (eDMA), and an analog block combining ADC, DAC, comparators, and voltage reference. This high level of analog and peripheral integration enables designers to eliminate external components, lower bill of materials cost, and shrink PCB footprint in segment-LCD human-machine interface (HMI) designs.
Typical applications for the MK40DX64VMC7 include segment-LCD display human-machine interfaces, USB-connected industrial control nodes, low-power metering endpoints, point-of-sale (POS) terminals, and consumer appliances that require an integrated LCD glass interface together with USB device or host connectivity.
When designing with this MCU, careful PCB layout is required because the 121-ball MAPBGA package demands controlled-impedance signal routing and multiple ground vias under the ball grid for thermal dissipation; overshoot and undershoot specifications on USB lines must also be observed to maintain USB compliance.
This page synthesizes authorized distributor stock, drop-in Kinetis alternatives, comparison data with related K40/K20 family members, and practical design notes that are not consolidated anywhere in the NXP datasheet alone.
Drop-in alternatives for MK40DX64VMC7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK40DX64VMC7 (same form factor and footprint) — differing in Program Memory Size, Package, ADC, Connectivity, Core Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK40DX128VMC7
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.42 / Unit
View Datasheet →MK20DX64VMC7
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.78 / Unit
View Datasheet →MK40DX256VMC7
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.2 / Unit
View Datasheet →MK40DX64VML7
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MK20DX128VMC7
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MK40DX64VMC7 Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4 (with FPU and DSP extensions) |
| Maximum CPU Frequency | 72 MHz |
| Program Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Operating Temperature Range | -40C to +105C |
| Package | 121-MAPBGA (8 mm x 8 mm) |
| Mounting Type | Surface Mount |
| Number of I/O Pins | 100 (max) |
| USB Interface | USB 2.0 Full-Speed On-The-Go (OTG) with integrated transceiver |
| Display Interface | Segment LCD driver |
| ADC | 16-bit SAR ADC with PGA |
| Touch-Sensing Interface | Low-power TSI (Touch Sensing Input) |
| Communication Interfaces | UART, SPI, I2C, CAN, I2S |
| DMA | 16-channel eDMA |
| Low-Power Modes | Run, Wait, Stop with RTC retention |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
MK40DX64VMC7 121-mapbga (8 mm x 8 mm) Pin Configuration Guide
Pin configuration for MK40DX64VMC7 (121-mapbga (8 mm x 8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MK40DX64VMC7.
Refer to the datasheet for full pin configuration.
Typical Applications
MK40DX64VMC7 is suitable for 7 applications: Segment LCD Human-Machine Interface Panel, USB-Connected Industrial Sensor Node, Battery-Powered Metering Endpoint, Point-of-Sale Terminal Controller, Consumer Appliance Control Board, Industrial Communication Bridge, Low-Power Touch-Activated Device.
Segment LCD Human-Machine Interface Panel
The MK40DX64VMC7's integrated segment LCD controller makes it a strong fit for front-panel HMIs on white goods, industrial controllers, and metering devices. With 100 GPIO, 16 KB SRAM, and 1.71-3.6 V single-supply operation, the chip drives multiplexed segment glass without external LCD driver ASICs. Compared to discrete MCU + LCD driver two-chip designs, a K40-based board typically reduces PCB area by 20-30% and BOM cost by 15-25% while keeping the 64 KB Flash sufficient for typical UI state machines and a real-time operating system kernel.
Recommended
USB-Connected Industrial Sensor Node
The on-chip USB 2.0 Full-Speed OTG transceiver with DMA support makes the MK40DX64VMC7 well-suited for USB-attached industrial sensor modules and configuration tools. The 72 MHz Cortex-M4 core executes signal processing and protocol stacks while the OTG interface handles bus enumeration, suspend, and resume. Putting firmware updates over USB requires a bootloader in protected Flash rows, so design should reserve an 8 KB bootloader region - this is feasible within the 64 KB program Flash budget for many industrial sensor applications.
Recommended
Battery-Powered Metering Endpoint
Low-power Run, Wait, and Stop modes with RTC retention make the K40 family a fit for portable metering or remote-monitoring endpoints. The integrated 16-bit SAR ADC and gain amplifier (PGA) deliver the dynamic range needed for analog sensor front-ends (typically 4-12 measurement channels) while the touch-sensing wake-up unit (TSI) awakens the device from stop on touch, with no external wake controller required. In typical 3.6 V lithium battery designs the part can sustain multi-year battery life when the MCU spends most of its time in stop mode with RTC active.
Recommended
Point-of-Sale Terminal Controller
USB OTG enables cable-attached POS peripheral designs (barcode readers, payment terminals, receipt printers) that rely on the K40 for keyboard scanning, display refresh, and host-side authentication. The 16 KB SRAM and 72 MHz core handle lightweight TCP/IP and encryption stacks; designers requiring stronger cryptography or larger buffers should migrate to a Kinetis K60/K66 with hardware crypto and 256 KB+ SRAM. The 121-MAPBGA package is not ideal for hand-held POS form factors - consider a 64-LQFP K40 variant for handheld geometries.
Recommended
Consumer Appliance Control Board
Household and appliance control boards benefit from the K40's mix of analog integration, segment LCD, USB service port, and motor-control timers. The 16-bit SAR ADC plus PGA tailors directly to temperature, pressure, and humidity sensor front-ends common in ovens, dishwashers, and refrigerators. Designers typically combine the MCU with triac/SCR-based AC load drivers and a low-side BLDC motor driver, with the K40 running a small RTOS for cooperative scheduling of UI updates, sensor sampling, and motor commutation.
Recommended
Industrial Communication Bridge
With integrated CAN, UART, SPI, I2C, and USB, the MK40DX64VMC7 serves as a multi-protocol industrial bridge translating between legacy RS-485/CAN field buses and USB-attached SCADA hosts. At 72 MHz the core runs Modbus, CANopen, and USB-CDC stacks in parallel with little CPU margin to spare, so dual-protocol streams above ~10 frames/sec benefit from a K60-class device. Using the eDMA controller offloads framing and checksum work from the CPU, freeing headroom for concurrent protocol handling.
Recommended
Low-Power Touch-Activated Device
The K40's touch-sensing input (TSI) peripheral enables touch-button and touch-slider wake-up with no external analog front-end. A button-press event wakes the part from stop mode, runs a finger-detect algorithm, and returns to standby - keeping idle system power in the single-digit microwatts. The combination of TSI, segment LCD, USB, and battery-direct operation in one package makes the K40 a uniquely integrated choice for battery-powered touch appliances such as remote controls, smart locks, and alarm keypads.
Recommended
Recommended Products Summary
Engineering reference data for MK40DX64VMC7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK40DX128VMC7 | MK20DX64VMC7 | MK40DX256VMC7 | MK40DX64VML7 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum CPU Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 96 MHz |
| Flash Memory | 64 KB | 128 KB | 64 KB | 256 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 32 KB | 16 KB |
| Segment LCD Driver | Yes | Yes | No (K20 family) | Yes | Yes |
| USB OTG | Full-Speed with on-chip transceiver | Full-Speed with on-chip transceiver | Full-Speed with on-chip transceiver | Full-Speed with on-chip transceiver | Full-Speed with on-chip transceiver |
Key Differentiators
- Doubling Flash for firmware headroom on the same PCB footprint (vs MK40DX128VMC7)
- Higher CPU bandwidth at the same Flash density (vs MK40DX64VML7)
- Same package family for K20 retrofit if LCD not needed (vs MK20DX64VMC7)
Design Notes
The MK40DX64VMC7 in the 121-MAPBGA package has a thermal resistance (theta_JA) in the 30-40 C/W range for JEDEC test boards. Estimated: at 72 MHz active core, VDD=3.3 V, the core consumption is in the 20-30 mA range (~70-100 mW). With the integrated voltage regulator and GPIO toggle current, total IC power dissipation is typically 100-200 mW; the junction rise above ambient is therefore modest (5-10 C) and no external heatsink is required.
Route USB DP and DM traces as a 90-ohm differential pair on the top layer with a continuous ground reference beneath. Keep trace length under 50 mm, maintain 2x trace width to ground spacing, and place the 15 kohm pull-down resistors on both DP and DM close to the connector. For the 121-MAPBGA footprint, escape the inner-row balls with 0.4 mm pitch microvia stackups (4-6 layer PCB recommended). Do not route signals under the BGA unless on an internal ground/power layer.
Estimated: When migrating firmware between MK40DX64VMC7 (64 KB Flash) and the MK40DX128VMC7 (128 KB Flash), verify that the linker script's Flash-region end address matches the new variant - otherwise the bootROM configuration field may be overwritten and trigger a flash-protection violation. Similarly, do not exceed the 1.71 V minimum supply at power-up; a slow-rising supply below 0.9 V for an extended period can cause the on-chip regulator to latch up. Use an external power-on-reset (POR) supervisor if the upstream supply ramp is below NXP's specified T-rise envelope.
Place the 1.0 uF ceramic regulator decoupling capacitor within 5 mm of the MCU's VDDA/VREGIN pins with a direct via to the ground plane. Provide a 0.1 uF bypass capacitor adjacent to every VDD pin pair. Keep analog sensor traces short and away from high-speed USB pair routing to minimize crosstalk into the SAR ADC. For segment-LCD glass connection, route COMn and SEGx lines as a star from the BGA to the LCD connector to avoid waveform distortion caused by capacitive mismatch.
Compliance Information
RoHS / REACH / lead-free / halogen-free status inferred from NXP product page disclosures as of 2026-10-19. AEC-Q100 not applicable - this is an industrial-grade Kinetis MCU; an AEC-Q100-licensed K40 variant exists separately. No PVC or phthalate materials used in packaging per NXP environmental disclosure.
