MMG3004NT1528 - 400-2200 MHz 17dB 27dBm InGaP HBT GPA | NXP
MPN: MMG3004NT1528 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.85 | $6,425.00 |
| 1,000 | $11.6 | $11,600.00 |
MMG3004NT1528 Overview
A general-purpose amplifier (GPA) is a broadband RF amplifier IC designed to provide stable gain and linearity across a wide frequency range, typically serving as a gain block, driver stage, or buffer between the transceiver and the power amplifier (PA) in a wireless front end. GPAs are typically fabricated in GaAs HBT, SiGe HBT, or InGaP HBT processes; the MMG3004NT1528 specifically uses Indium Gallium Phosphide (InGaP) HBT, which offers excellent thermal stability, high linearity, and reliable single-supply (+5 V typical) operation. Within the RF front-end signal chain, the GPA sits hierarchically below the LNA and above the driver/power amplifier stages.
Key features include broadband 400-2200 MHz coverage without external matching, internal prematching to 50 ohms for drop-in PCB use, +5 V single-supply operation with a built-in active bias network, and high linearity suitable for multicarrier and W-CDMA waveforms. The MMG3004NT1528 is the RoHS-compliant tape-and-reel variant (528 suffix) of the base MMG3004NT1 part, providing automated-assembly-ready packaging.
Technically, the device integrates input and output matching networks, an active bias regulator, and ESD protection on the RF pins. The InGaP HBT process delivers stable gain versus temperature and superior ruggedness under output mismatch (VSWR) conditions. The exposed thermal pad beneath the PQFN package must be soldered to the PCB ground plane to achieve the rated thermal resistance.
Typical applications include cellular base-station driver stages, PCS/WLL/PHS transmit chains, UMTS/W-CDMA driver amplifiers, VHF/UHF transceivers, broadband industrial/scientific RF links, and general-purpose 50-ohm gain blocks where a single broadband part replaces multiple narrowband stages.
When designing with the MMG3004NT1528, ensure the exposed pad is well-grounded with multiple thermal vias, RF traces are 50-ohm controlled-impedance, and a minimum of 8 dB return loss is presented at both RF ports by the surrounding matching network if fine-tuning is required.
This page synthesizes current distributor pricing, drop-in pin-compatible alternatives, and practical RF design notes not found in the standalone manufacturer datasheet, helping engineers shorten sourcing cycles for broadband RF amplifier designs.
Drop-in alternatives for MMG3004NT1528 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MMG3004NT1528 (same form factor and footprint) — differing in Package, Small-Signal Gain.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MMG3004NT1
✅ Drop-In✓ In Stock
$2.45 / Unit
View Datasheet →MMG3004NT1G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MMG3021NT1
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MMG3014NT1
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MMG3004NT1528 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Description | InGaP HBT Broadband General-Purpose Amplifier |
| Process Technology | Indium Gallium Phosphide HBT (InGaP HBT) |
| Frequency Range | 400 MHz to 2200 MHz |
| Small-Signal Gain | 17 dB |
| Output P1dB | +27 dBm |
| Operating Temperature | -40C to +85C |
| Package | 16-pin PQFN (5x5 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tape and Reel (1500-unit reel, 528 suffix) |
| RoHS Status | Compliant |
MMG3004NT1528 Pin Configuration
| Pin 1 | RF IN — RF input (internally prematched to 50 ohms) |
| Pin 2 | GND — Ground |
| Pin 3 | GND — Ground |
| Pin 4 | GND — Ground |
| Pin 5 | VBIAS — Active bias network reference |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | NC — Not connected (per datasheet) |
| Pin 8 | VCC — DC supply voltage (typ +5 V) |
| Pin 9 | NC — Not connected (per datasheet) |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | GND — Ground |
| Pin 12 | GND — Ground |
| Pin 13 | GND — Ground |
| Pin 14 | GND — Ground |
| Pin 15 | GND — Ground |
| Pin 16 | RF OUT — RF output (internally prematched to 50 ohms) |
Typical Applications
MMG3004NT1528 is suitable for 6 applications: Cellular Base-Station Driver Stage, PCS / WLL / PHS Transmit Driver, UMTS / W-CDMA Driver Amplifier, VHF / UHF Broadband Gain Block, Industrial / Scientific RF Link, General-Purpose 50-ohm Gain Block.
Cellular Base-Station Driver Stage
The MMG3004NT1528 is well suited as a driver stage between the transceiver and the final PA in cellular base-station transmit chains. Its 17 dB gain and +27 dBm P1dB provide enough linear output power to drive subsequent high-power stages, while its 400-2200 MHz broadband coverage handles GSM (900/1800), PCS (1900), and UMTS/LTE (700/850/2100/2600) bands with a single part - eliminating band-switched matching networks typical of narrowband alternatives. The internal 50-ohm prematch and active bias network simplify PCB layout, reducing BOM cost and design time for multi-band infrastructure.
Recommended
PCS / WLL / PHS Transmit Driver
For PCS, WLL, and PHS transmit drivers, the MMG3004NT1528's InGaP HBT linearity preserves signal integrity under multicarrier and high-PAPR modulation (QPSK, QAM, OFDM). The 17 dB gain provides comfortable drive margin for downstream stages, and the +27 dBm P1dB comfortably exceeds typical PCS driver requirements of +20 to +24 dBm linear output. Single +5 V supply operation eliminates the negative-rail requirement that GaAs pHEMT alternatives impose, simplifying power-supply design.
Recommended
UMTS / W-CDMA Driver Amplifier
In UMTS and W-CDMA transmit chains, the MMG3004NT1528's high linearity (InGaP HBT OIP3) maintains EVM and ACLR compliance under 3GPP W-CDMA modulation. The 400-2200 MHz range covers UMTS Band I (2100), II (1900), V (850), and VIII (900), making the part a versatile single-stage driver for multi-band W-CDMA picocells and femtocells. Its broadband flatness simplifies production tuning versus narrowband ceramic-filter-coupled alternatives.
Recommended
VHF / UHF Broadband Gain Block
For general VHF (30-300 MHz) and UHF (300-3000 MHz) gain-block use, the MMG3004NT1528 delivers 17 dB of flat broadband gain from 400 to 2200 MHz with internal 50-ohm matching, eliminating the external LC matching networks that narrowband gain blocks require. It is ideal as a buffer between low-level signal sources (signal generators, synthesizers) and downstream mixers or data converters, and its InGaP HBT process delivers stable gain versus temperature.
Recommended
Industrial / Scientific RF Link
For industrial and scientific RF link applications (ISM, RFID, telemetry, remote sensing), the MMG3004NT1528's broadband 400-2200 MHz range covers many sub-1 GHz and 2.4 GHz-adjacent industrial bands with a single part. The +27 dBm P1dB supports modest transmit-power needs, and the rugged InGaP HBT process survives output mismatches common in laboratory and field-deployed antennas, reducing field-return rates versus more fragile GaAs pHEMT parts.
Recommended
General-Purpose 50-ohm Gain Block
As a general-purpose 50-ohm gain block for prototype and lab use, the MMG3004NT1528's internal prematch means engineers can drop it onto an evaluation PCB with no external matching, get 17 dB of broadband gain instantly, and use it as a reusable building block across multiple projects. The PQFN-16 exposed-pad footprint is small (5x5 mm), making it suitable for dense prototype layouts.
Recommended
Recommended Products Summary
Engineering reference data for MMG3004NT1528 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MMG3004NT1 | MMG3004NT1G | MMG3021NT1 | MMG3014NT1 |
|---|---|---|---|---|---|
| Package | 16-pin PQFN (5x5 mm) | 16-pin PQFN (5x5 mm) - same | 16-pin PQFN (5x5 mm) - same | 16-pin PQFN (5x5 mm) - same | 16-pin PQFN (5x5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Frequency Range | 400-2200 MHz | 400-2200 MHz | 400-2200 MHz | 400-3600 MHz (wider) | 100-4000 MHz (wider) |
| Output P1dB | +27 dBm | +27 dBm | +27 dBm | ~+29 dBm (higher) | ~+27 dBm |
| Process Technology | InGaP HBT | InGaP HBT | InGaP HBT | InGaP HBT | InGaP HBT |
| Packaging Variant | 1500-unit reel (528 suffix) | Standard reel | Lead-free reel | Standard reel | Standard reel |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Single-part broadband 400-2200 MHz coverage replaces multiple narrowband gain blocks (vs Narrowband MMIC alternatives in the same PQFN-16 family)
- Internally prematched 50-ohm RF ports (vs External-matching MMIC alternatives)
- InGaP HBT process delivers superior thermal stability versus GaAs pHEMT (vs GaAs pHEMT GPAs)
Design Notes
The 16-pin PQFN (5x5 mm) exposed thermal pad MUST be soldered to the PCB ground plane and stitched with at least 9 thermal vias (3x3 array) to achieve the rated thermal resistance. Without proper thermal management, junction temperature can rise above 150C under sustained P1dB output, degrading linearity and shortening MTBF. For continuous +27 dBm output into a VSWR 5:1 mismatch, the part relies on this thermal path to survive.
Use 50-ohm controlled-impedance microstrip or coplanar-waveguide RF traces on the top metal layer for the RF IN and RF OUT ports. Place decoupling capacitors (100 pF + 10 nF + 100 nF) as close as possible to the VCC pin (pin 8). Minimize the distance between the RF IN (pin 1) and the source to preserve return loss and gain flatness; every 1 mm of additional trace length above 50 ohms adds ~0.05 dB of loss at 2 GHz.
Do not operate the MMG3004NT1528 without a proper VCC supply - the active bias network requires VCC to be present before RF input is applied, otherwise the internal bias can drift and stress the HBT die. Do not apply RF input before VCC ramps up. Always sequence VCC first, then RF input. Additionally, do not exceed the absolute maximum input power of +10 dBm - higher input levels will drive the part into deep compression and may permanently degrade gain.
Keep digital, clock, and switching-converter traces away from the RF input and output traces to avoid coupling noise into the broadband amplifier. Use a Faraday-like via fence (grounded vias at lambda/4 spacing or denser) along the edges of the RF traces to suppress radiated coupling. The exposed pad ground plane should be a continuous pour on layer 2, stitched to top-layer ground with the thermal via array.
Compliance Information
RoHS compliant per NXP product page and DigiKey Marketplace environmental flags. Lead-free (G suffix variant is the lead-free version). Halogen-free status not explicitly verified in the provided web data; flagged as 'unknown'. Not AEC-Q100 qualified - this is an RF amplifier for commercial/industrial wireless, not automotive.
