MPC555LFMVR40 - 40MHz PowerPC MCU 448KB Flash | NXP | 272-BGA
MPN: MPC555LFMVR40 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.85 | $3,385.00 |
| 500 | $29.1 | $14,550.00 |
| 1,000 | $24.95 | $24,950.00 |
MPC555LFMVR40 Overview
What is a Qorivva MPC5xx microcontroller? The Qorivva MPC555 is a 32-bit single-chip microcontroller built around the PowerPC Book E instruction set architecture. It belongs to the broader MPC500 family of automotive-grade microcontrollers, sitting within the hierarchy: PowerPC core -> RISC microprocessor -> 32-bit microcontroller -> embedded MCU. MPC5xx devices integrate CPU, memory, and a rich set of automotive peripherals onto a single die, eliminating the need for external companion logic.
Key features of the MPC555LFMVR40 include 448KB of embedded FLASH with 32KB of SRAM, an integrated floating-point unit (FPU), 32-channel dual-port Time Processing Unit (TPU), 22-channel modular I/O system, two CAN 2.0B controller modules, and a queued serial module (QSM) supporting SPI and SCI. The part is rated for 5V single-supply operation with automotive temperature grade.
Architecturally, the MPC555LFMVR40 is built on a 0.5 micron HCMOS process, combining deterministic interrupt latency with hardware multiply-accumulate and a hardware debug port for real-time trace. The 40MHz core delivers 52 MIPS of integer throughput, and the integrated peripherals communicate via a unified bus to minimize DMA contention in engine-control or robotics loops.
Typical applications include automotive engine and transmission control units (ECU/TCU), robotics motion controllers, avionics flight control systems, and industrial PLCs. Its wide operating temperature and ruggedized design make it especially suited for under-hood automotive deployment where -40C to +125C ambient is routine.
Designers should note the part is flagged End-of-Life on the NXP product page, and that 5V tolerance and the 272-PBGA footprint are fixed by the device's automotive application profile. Stock is held primarily through authorized distributors and the open market; lead times vary.
This page synthesizes distributor stock, pricing as of 2026-10-09, drop-in compatible variants within the MPC555 family, and design notes that go beyond the manufacturer's product brief to support supply-chain decisions and PCB redesigns.
Drop-in alternatives for MPC555LFMVR40 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC555LFMVR40 (same form factor and footprint) — differing in Core Architecture, RAM Size, Number of I/O, Package, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC555LFCZP40
✅ Drop-In✓ In Stock
$36.75 / Unit
View Datasheet →MPC555LFAVR40
✅ Drop-In✓ In Stock
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View Datasheet →MPC555LFAZP40
✅ Drop-In📋 Reference alternative (not in catalog)
MPC555LFCVR40
✅ Drop-In📋 Reference alternative (not in catalog)
MPC555LFMZP40
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →MPC555CZP40
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC555LFMVR40 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | MPC500 / Qorivva |
| Core Processor | PowerPC e500 / MPC5xx |
| Core Architecture | 32-bit RISC |
| Core Speed | 40 MHz |
| Program Memory | 448 KB FLASH |
| RAM | 32 KB SRAM |
| Supply Voltage | 5 V nominal |
| Operating Temperature | -40C to +125C |
| Package | 272-PBGA (27x27 mm) |
| Mounting Type | Surface Mount |
| Number of I/O | 56 (approximate) |
| Peripherals | TPU, QSM, CAN, MIOS |
| Connectivity | CAN 2.0B (x2), SCI, SPI |
| FPU | Yes (integrated) |
| Automotive Grade | AEC-Q100 qualified |
MPC555LFMVR40 272-pbga (27x27 mm) Pin Configuration Guide
Pin configuration for MPC555LFMVR40 (272-pbga (27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC555LFMVR40.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC555LFMVR40 is suitable for 6 applications: Automotive Engine Control Unit (ECU), Automatic Transmission Control Unit (TCU), Robotics Motion Controller, Avionics Flight Control System, Industrial PLC and Process Controller, Automotive Body Control Module.
Automotive Engine Control Unit (ECU)
The MPC555LFMVR40's 40 MHz PowerPC core, 448 KB FLASH, and 32-channel dual-port Time Processing Unit (TPU) deliver the deterministic interrupt latency required for fuel-injection and ignition-timing loops. Its dual CAN 2.0B controllers interface directly with vehicle networks, while AEC-Q100 qualification and -40C to +125C operation handle under-hood thermal stress. Compared with external timer ASICs the integrated TPU removes glue logic and reduces BOM cost. The 272-PBGA package supports the wide parallel data bus needed for real-time crank/cam signal processing.
Recommended
Automatic Transmission Control Unit (TCU)
Transmission control demands precise solenoid timing and robust serial communications, which the MPC555LFMVR40 provides via its 22-channel Modular I/O System (MIOS) and QSM supporting SPI/SCI. The 32 KB SRAM is sufficient for adaptive shift-schedule lookup tables, while 448 KB FLASH accommodates shift maps, diagnostic routines, and OBD-II firmware. The PowerPC core's hardware multiply-accumulate accelerates torque-converter slip calculations, and AEC-Q100 grade suits the harsh transmission-housing environment with high vibration and thermal cycling.
Recommended
Robotics Motion Controller
Industrial robotics requires deterministic servo-loop execution, and the MPC555LFMVR40's hardware FPU and 32-channel TPU deliver precise PWM generation for multi-axis motor control. Its 40 MHz core processes kinematic calculations and inverse-Jacobian transforms with deterministic interrupt latency under 1 microsecond, while dual CAN 2.0B interfaces integrate seamlessly with CANopen drives common in robotic arms. The wide operating temperature range suits factory-floor deployment. Engineers transitioning to newer designs should evaluate MPC5644A or Qorivva MPC57xx successors.
Recommended
Avionics Flight Control System
Avionics flight control demands deterministic real-time response and radiation-tolerant design practices. The MPC555LFMVR40's PowerPC core with hardware FPU executes flight-control laws at 40 MHz with bounded interrupt latency, while 448 KB FLASH stores flight-critical code and 32 KB SRAM holds state variables. Dual CAN channels interface with avionics buses. Note: this part is not formally DO-178C certified, so it suits experimental/light-avionics use; for certified avionics NXP recommends MPC5644A or MPC57xx with available certification artifacts.
Recommended
Industrial PLC and Process Controller
Programmable Logic Controllers (PLCs) running complex process-control algorithms benefit from the MPC555LFMVR40's PowerPC core with hardware FPU, executing PID loops and signal conditioning at 40 MHz. Its 22-channel MIOS handles digital I/O for plant instrumentation, while SPI and SCI interfaces integrate with sensor networks. AEC-Q100 grade and the rugged 272-PBGA package suit factory-floor environments with electrical noise and wide temperature swings. The 448 KB FLASH supports IEC 61131-3 ladder-logic runtimes and persistent process recipes.
Recommended
Automotive Body Control Module
Body control modules managing lighting, door locks, mirror positioning, and accessory control benefit from the MPC555LFMVR40's abundant I/O and dual CAN controllers. The 448 KB FLASH stores body-comfort firmware, while 32 KB SRAM handles CAN message buffers and switch-debounce state machines. AEC-Q100 qualification suits passenger-compartment temperature extremes. The PowerPC core provides ample headroom for CAN-based diagnostics, while the TPU generates accurate PWM signals for lighting fade and mirror positioning without external timer ASICs.
Recommended
Recommended Products Summary
Engineering reference data for MPC555LFMVR40 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC555LFCZP40 | MPC555LFAVR40 | MPC555LFAZP40 | MPC555LFCVR40 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-PBGA (27x27) | 272-PBGA (27x27) - same | 272-PBGA (27x27) - same | 272-PBGA (27x27) - same | 272-PBGA (27x27) - same |
| Core Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Memory | 448 KB FLASH | 448 KB FLASH | 448 KB FLASH | 448 KB FLASH | 448 KB FLASH |
| RAM | 32 KB SRAM | 32 KB SRAM | 32 KB SRAM | 32 KB SRAM | 32 KB SRAM |
| Core Architecture | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx |
| CAN Controllers | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B |
| TPU Channels | 32 channels | 32 channels | 32 channels | 32 channels | 32 channels |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Key Differentiators
- Same 272-PBGA footprint across the MPC555 suffix family (vs MPC555LFAVR40)
- Dual-port TPU with 32 channels and integrated FPU (vs MPC555LFCZP40)
- AEC-Q100 qualification and -40C to +125C operation (vs MPC555LFAZP40)
Design Notes
The MPC555LFMVR40's 272-PBGA package requires careful PCB thermal management for continuous operation at full 40 MHz clock across the -40C to +125C automotive temperature range. Use a multi-layer PCB with at least 4 layers and dedicated inner copper pours stitched with thermal vias beneath the BGA to spread heat from the die to the PCB. Without adequate thermal vias the die temperature may exceed the package rating under sustained computation. Validate thermal performance with a thermal probe or simulation before locking the layout.
The 272-PBGA footprint demands strict PCB land-pattern compliance with NXP's reference design. Use NSMD (non-solder-mask-defined) pads with the exact ball-pitch specified in the datasheet to avoid solder-joint fatigue under thermal cycling. Add teardrops on traces exiting the BGA and place bulk-decoupling capacitors within 5 mm of each power pin. Route high-speed signals on inner layers with controlled impedance, and keep the BGAs reserved for shortest return paths.
Do not assume all MPC555 suffix variants are pin-compatible: the MVR, AVR, AZP, CZP, CVR suffixes encode BGA ball-map variants, temperature grades, and screening levels. Verify the exact ball map against your PCB land pattern before substituting a 'drop-in' variant. Failure to confirm ball-out will result in incorrect signal routing and likely board rework. Also note that FLASH programming requires NXP's specific algorithm via the Background Debug Mode - third-party gang programmers must support the MPC555 protocol.
The MPC555LFMVR40 operates on a single 5V supply with internal regulation. Provide a clean 5V rail with at least 200 mA of headroom and 10 uF bulk plus 100 nF ceramic decoupling at every VDD/VSS pair. Power-rail noise directly couples into the analog CAN transceiver reference and may cause CAN error-frame spikes. Use an LDO or DC-DC with low output ripple (<25 mVpp) and adequate thermal margin at -40C cold-crank conditions.
Compliance Information
AEC-Q100 automotive qualification per NXP MPC555 product brief. RoHS/REACH/lead-free status flagged as [DATA_NEEDED] because the verified web data did not contain a definitive manufacturer statement; designers should request the latest material declaration from NXP for production compliance. Conflict-minerals compliance inferred from NXP standard corporate policy.