MPC555LFMVR40 - 40MHz PowerPC MCU 448KB Flash | NXP | 272-BGA
부품 번호: MPC555LFMVR40 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.85 | $3,385.00 |
| 500 | $29.1 | $14,550.00 |
| 1,000 | $24.95 | $24,950.00 |
MPC555LFMVR40 개요
What is a Qorivva MPC5xx microcontroller? The Qorivva MPC555 is a 32-bit single-chip microcontroller built around the PowerPC Book E instruction set architecture. It belongs to the broader MPC500 family of automotive-grade microcontrollers, sitting within the hierarchy: PowerPC core -> RISC microprocessor -> 32-bit microcontroller -> embedded MCU. MPC5xx devices integrate CPU, memory, and a rich set of automotive peripherals onto a single die, eliminating the need for external companion logic.
Key features of the MPC555LFMVR40 include 448KB of embedded FLASH with 32KB of SRAM, an integrated floating-point unit (FPU), 32-channel dual-port Time Processing Unit (TPU), 22-channel modular I/O system, two CAN 2.0B controller modules, and a queued serial module (QSM) supporting SPI and SCI. The part is rated for 5V single-supply operation with automotive temperature grade.
Architecturally, the MPC555LFMVR40 is built on a 0.5 micron HCMOS process, combining deterministic interrupt latency with hardware multiply-accumulate and a hardware debug port for real-time trace. The 40MHz core delivers 52 MIPS of integer throughput, and the integrated peripherals communicate via a unified bus to minimize DMA contention in engine-control or robotics loops.
Typical applications include automotive engine and transmission control units (ECU/TCU), robotics motion controllers, avionics flight control systems, and industrial PLCs. Its wide operating temperature and ruggedized design make it especially suited for under-hood automotive deployment where -40C to +125C ambient is routine.
Designers should note the part is flagged End-of-Life on the NXP product page, and that 5V tolerance and the 272-PBGA footprint are fixed by the device's automotive application profile. Stock is held primarily through authorized distributors and the open market; lead times vary.
This page synthesizes distributor stock, pricing as of 2026-10-09, drop-in compatible variants within the MPC555 family, and design notes that go beyond the manufacturer's product brief to support supply-chain decisions and PCB redesigns.
드롭인 대체품: MPC555LFMVR40 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC555LFMVR40 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, RAM Size, Number of I/O, Package, Program Memory Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC555LFCZP40
✅ 드롭인✓ 재고 있음
$36.75 / 개
데이터시트 보기 →MPC555LFAVR40
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MPC555LFAZP40
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC555LFCVR40
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC555LFMZP40
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →MPC555CZP40
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC555LFMVR40 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors |
| Series | MPC500 / Qorivva |
| Core Processor | PowerPC e500 / MPC5xx |
| Core Architecture | 32-bit RISC |
| Core Speed | 40 MHz |
| Program Memory | 448 KB FLASH |
| RAM | 32 KB SRAM |
| 공급 전압 | 5 V nominal |
| 동작 온도 | -40C to +125C |
| 패키지 | 272-PBGA (27x27 mm) |
| 실장 유형 | Surface Mount |
| Number of I/O | 56 (approximate) |
| Peripherals | TPU, QSM, CAN, MIOS |
| Connectivity | CAN 2.0B (x2), SCI, SPI |
| FPU | Yes (integrated) |
| Automotive Grade | AEC-Q100 qualified |
MPC555LFMVR40 272-pbga (27x27 mm) 핀 구성 가이드
MPC555LFMVR40(272-pbga (27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC555LFMVR40.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC555LFMVR40 적합 용도: 6 애플리케이션s: Automotive Engine Control Unit (ECU), Automatic Transmission Control Unit (TCU), Robotics Motion Controller, Avionics Flight Control System, Industrial PLC and Process Controller, Automotive Body Control Module.
Automotive Engine Control Unit (ECU)
The MPC555LFMVR40's 40 MHz PowerPC core, 448 KB FLASH, and 32-channel dual-port Time Processing Unit (TPU) deliver the deterministic interrupt latency required for fuel-injection and ignition-timing loops. Its dual CAN 2.0B controllers interface directly with vehicle networks, while AEC-Q100 qualification and -40C to +125C operation handle under-hood thermal stress. Compared with external timer ASICs the integrated TPU removes glue logic and reduces BOM cost. The 272-PBGA package supports the wide parallel data bus needed for real-time crank/cam signal processing.
추천
Automatic Transmission Control Unit (TCU)
Transmission control demands precise solenoid timing and robust serial communications, which the MPC555LFMVR40 provides via its 22-channel Modular I/O System (MIOS) and QSM supporting SPI/SCI. The 32 KB SRAM is sufficient for adaptive shift-schedule lookup tables, while 448 KB FLASH accommodates shift maps, diagnostic routines, and OBD-II firmware. The PowerPC core's hardware multiply-accumulate accelerates torque-converter slip calculations, and AEC-Q100 grade suits the harsh transmission-housing environment with high vibration and thermal cycling.
추천
Robotics Motion Controller
Industrial robotics requires deterministic servo-loop execution, and the MPC555LFMVR40's hardware FPU and 32-channel TPU deliver precise PWM generation for multi-axis motor control. Its 40 MHz core processes kinematic calculations and inverse-Jacobian transforms with deterministic interrupt latency under 1 microsecond, while dual CAN 2.0B interfaces integrate seamlessly with CANopen drives common in robotic arms. The wide operating temperature range suits factory-floor deployment. Engineers transitioning to newer designs should evaluate MPC5644A or Qorivva MPC57xx successors.
추천
Avionics Flight Control System
Avionics flight control demands deterministic real-time response and radiation-tolerant design practices. The MPC555LFMVR40's PowerPC core with hardware FPU executes flight-control laws at 40 MHz with bounded interrupt latency, while 448 KB FLASH stores flight-critical code and 32 KB SRAM holds state variables. Dual CAN channels interface with avionics buses. Note: this part is not formally DO-178C certified, so it suits experimental/light-avionics use; for certified avionics NXP recommends MPC5644A or MPC57xx with available certification artifacts.
추천
Industrial PLC and Process Controller
Programmable Logic Controllers (PLCs) running complex process-control algorithms benefit from the MPC555LFMVR40's PowerPC core with hardware FPU, executing PID loops and signal conditioning at 40 MHz. Its 22-channel MIOS handles digital I/O for plant instrumentation, while SPI and SCI interfaces integrate with sensor networks. AEC-Q100 grade and the rugged 272-PBGA package suit factory-floor environments with electrical noise and wide temperature swings. The 448 KB FLASH supports IEC 61131-3 ladder-logic runtimes and persistent process recipes.
추천
Automotive Body Control Module
Body control modules managing lighting, door locks, mirror positioning, and accessory control benefit from the MPC555LFMVR40's abundant I/O and dual CAN controllers. The 448 KB FLASH stores body-comfort firmware, while 32 KB SRAM handles CAN message buffers and switch-debounce state machines. AEC-Q100 qualification suits passenger-compartment temperature extremes. The PowerPC core provides ample headroom for CAN-based diagnostics, while the TPU generates accurate PWM signals for lighting fade and mirror positioning without external timer ASICs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC555LFMVR40 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC555LFCZP40 | MPC555LFAVR40 | MPC555LFAZP40 | MPC555LFCVR40 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-PBGA (27x27) | 272-PBGA (27x27) - same | 272-PBGA (27x27) - same | 272-PBGA (27x27) - same | 272-PBGA (27x27) - same |
| Core Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Memory | 448 KB FLASH | 448 KB FLASH | 448 KB FLASH | 448 KB FLASH | 448 KB FLASH |
| RAM | 32 KB SRAM | 32 KB SRAM | 32 KB SRAM | 32 KB SRAM | 32 KB SRAM |
| Core Architecture | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx | PowerPC e500 / MPC5xx |
| CAN Controllers | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B |
| TPU Channels | 32 channels | 32 channels | 32 channels | 32 channels | 32 channels |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
주요 차별점
- Same 272-PBGA footprint across the MPC555 suffix family (vs MPC555LFAVR40)
- Dual-port TPU with 32 channels and integrated FPU (vs MPC555LFCZP40)
- AEC-Q100 qualification and -40C to +125C operation (vs MPC555LFAZP40)
설계 노트
The MPC555LFMVR40's 272-PBGA package requires careful PCB thermal management for continuous operation at full 40 MHz clock across the -40C to +125C automotive temperature range. Use a multi-layer PCB with at least 4 layers and dedicated inner copper pours stitched with thermal vias beneath the BGA to spread heat from the die to the PCB. Without adequate thermal vias the die temperature may exceed the package rating under sustained computation. Validate thermal performance with a thermal probe or simulation before locking the layout.
The 272-PBGA footprint demands strict PCB land-pattern compliance with NXP's reference design. Use NSMD (non-solder-mask-defined) pads with the exact ball-pitch specified in the datasheet to avoid solder-joint fatigue under thermal cycling. Add teardrops on traces exiting the BGA and place bulk-decoupling capacitors within 5 mm of each power pin. Route high-speed signals on inner layers with controlled impedance, and keep the BGAs reserved for shortest return paths.
Do not assume all MPC555 suffix variants are pin-compatible: the MVR, AVR, AZP, CZP, CVR suffixes encode BGA ball-map variants, temperature grades, and screening levels. Verify the exact ball map against your PCB land pattern before substituting a 'drop-in' variant. Failure to confirm ball-out will result in incorrect signal routing and likely board rework. Also note that FLASH programming requires NXP's specific algorithm via the Background Debug Mode - third-party gang programmers must support the MPC555 protocol.
The MPC555LFMVR40 operates on a single 5V supply with internal regulation. Provide a clean 5V rail with at least 200 mA of headroom and 10 uF bulk plus 100 nF ceramic decoupling at every VDD/VSS pair. Power-rail noise directly couples into the analog CAN transceiver reference and may cause CAN error-frame spikes. Use an LDO or DC-DC with low output ripple (<25 mVpp) and adequate thermal margin at -40C cold-crank conditions.
규정 준수 정보
AEC-Q100 automotive qualification per NXP MPC555 product brief. RoHS/REACH/lead-free status flagged as [DATA_NEEDED] because the verified web data did not contain a definitive manufacturer statement; designers should request the latest material declaration from NXP for production compliance. Conflict-minerals compliance inferred from NXP standard corporate policy.