MPC8349VVAGDB - PowerQUICC II Pro 400MHz SoC | NXP
MPN: MPC8349VVAGDB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $65.4 | $6,540.00 |
| 250 | $60.25 | $15,062.50 |
| 500 | $56.9 | $28,450.00 |
MPC8349VVAGDB Overview
An integrated communications processor (ICP) such as the PowerQUICC II Pro is a system-on-chip that combines a general-purpose microprocessor with dedicated communications peripherals - typically Ethernet MACs, PCI bridges, and memory controllers - on a single die. The MPC8349 family sits in the hierarchy: PowerPC e300 core -> PowerQUICC II Pro family -> MPC83xx SoC series -> 32-bit embedded communications processor -> NXP/Freescale networking silicon. This consolidation reduces board area, BOM cost, and design complexity compared with discrete CPU-plus-ASIC solutions.
Key features include 400MHz e300 core frequency, dual PCI interfaces (one 64-bit, one 32-bit), one 10/100/1000 Mbps Ethernet MAC, USB 2.0 Full/Low Speed controller, DDR1/DDR2 memory controller, and security engine (SEC 2.0). The device operates from 1.8V/2.5V/3.3V supplies and supports an industrial 0 to 105C junction temperature range. The TBGA-672 package exposes a wide I/O set while the integrated peripherals remove the need for companion bridge chips in typical designs.
The architecture pairs the e300 core (a PowerPC 603e-derived superscalar core) with the QUICC Engine block, which offloads communications tasks via microcode running on dedicated RISC engines. This split allows the host CPU to focus on application/OS layers while the QUICC Engine handles TDM, Ethernet, and ATM framing in hardware. The MPC8349 series omits the QUICC Engine RISC block (the MPC8349E variant includes it), trading flexibility for simpler firmware and lower cost.
Typical applications include industrial routers and gateways, SOHO networking equipment, networked storage (NAS), print server controllers, and embedded control with Ethernet connectivity. The combination of dual PCI and integrated GbE suits designs that previously required an external bridge plus a discrete MAC.
When designing with this part, allocate the TBGA-672 land pattern carefully - 1.0mm pitch with a thermal pad demands a 4-layer PCB minimum and controlled-impedance routing for DDR memory and Gigabit Ethernet. The 0.13um CMOS process and 1.8V core make thermal management manageable but adequate decoupling is still essential for the high-speed serial and parallel interfaces.
This page synthesizes distributor pricing, same-family NXP variants, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for MPC8349VVAGDB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8349VVAGDB (same form factor and footprint) — differing in Memory Controller, Operating Temperature, Core Architecture, Mounting Type, Ethernet.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8349EVVAJDB
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →MPC8349CVVAJDB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8349EVVAJFB
✅ Drop-In✓ In Stock
$56.9 / Unit
View Datasheet →MPC8349VVAGD
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8349VVAGDB Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro, MPC83xx |
| Core Processor | PowerPC e300 |
| Core Architecture | 32-bit PowerPC |
| Number of Cores | 1 |
| Core Frequency | 400 MHz |
| Process Technology | 0.13 um CMOS |
| Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | 0 C to +105 C |
| Package | 672-LBGA (TBGA), 35 x 35 mm |
| Memory Controller | DDR1 / DDR2 |
| PCI Interfaces | 2 (one 64-bit, one 32-bit) |
| Ethernet MAC | 1 x 10/100/1000 Mbps (GbE) |
| USB Controller | USB 2.0 Full/Low Speed |
| Security Engine | Not included (non-E variant) |
| RoHS Status | Compliant (lead-free, NO-PB per Mouser SKU) |
| Mounting Type | Surface Mount (TBGA) |
MPC8349VVAGDB 672-lbga (tbga), 35 x 35 mm Pin Configuration Guide
Pin configuration for MPC8349VVAGDB (672-lbga (tbga), 35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8349VVAGDB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8349VVAGDB is suitable for 6 applications: SOHO Router / Gateway, Network Attached Storage (NAS), Industrial Control with Ethernet, Print Server / Imaging Controller, Embedded Networking Appliance, VoIP Media Gateway.
SOHO Router / Gateway
The MPC8349VVAGDB fits SOHO router and residential gateway designs because its integrated 1 Gbps Ethernet MAC, dual PCI controllers, and DDR1/DDR2 memory controller cover the full data-plane and control-plane needs without companion bridge chips. At 400 MHz the e300 core handles routing table lookups, NAT, and a lightweight Linux or VxWorks network stack with headroom. The 0 to 105 C junction temperature rating supports fanless enclosures used in living-room and small-office equipment. Dual PCI allows one slot for a Wi-Fi mini-PCI card and the other for an optional xDSL modem daughter card, a common SOHO gateway topology. Designers save board area and BOM cost versus a discrete CPU-plus-NPU split architecture.
Recommended
Network Attached Storage (NAS)
The MPC8349VVAGDB is well matched to entry-level NAS controllers because the 400 MHz e300 core plus GbE MAC delivers wire-speed 1 Gbps throughput for sequential file transfers while the DDR2 controller sustains the disk-cache working set. Dual PCI slots accommodate two SATA or SCSI HBAs via standard add-in cards, and the USB 2.0 controller supports external backup drives. The integrated peripheral set eliminates a northbridge chip, reducing cost for two- and four-bay SOHO/SMB NAS enclosures. Industrial temperature rating allows deployment in closets and small server rooms without active cooling. Power consumption at typical NAS idle loads stays within passive heatsink limits for the TBGA package.
Recommended
Industrial Control with Ethernet
Industrial control and SCADA gateway applications benefit from the MPC8349VVAGDB because the 0 to 105 C junction range, integrated GbE, and dual PCI together support factory-floor protocols and uplink to plant Ethernet backbones. The e300 core runs real-time operating systems (VxWorks, INTEGRITY, RTEMS) commonly used in industrial controllers, with the DDR2 controller providing deterministic memory access. Dual PCI slots allow integration of fieldbus cards (Profibus, DeviceNet, CAN) without external bridge logic. Compared with a host CPU plus discrete Ethernet MAC, the integrated design lowers PCB complexity, an important factor for long-life industrial deployments. Engineers can leverage existing PowerPC toolchains and BSPs to accelerate certification timelines.
Recommended
Print Server / Imaging Controller
Office print servers and multifunction-printer controllers are a natural fit for the MPC8349VVAGDB because its combination of 400 MHz e300 core, GbE MAC, USB 2.0, and dual PCI supports the printer's connectivity, image processing, and optional scanner/finisher interfaces. The DDR2 memory controller handles large image buffers for high-DPI rendering, while dual PCI slots can host scanner modules or additional USB host ports. The integrated peripheral set reduces the controller board footprint, allowing thinner printer chassis designs. Power dissipation at typical print-job duty cycles stays within passive thermal limits. The NXP ecosystem provides BSPs and Linux board-support packages commonly used by printer OEMs.
Recommended
Embedded Networking Appliance
Small-form-factor networking appliances - VPN terminators, UTM-lite firewalls, and protocol gateways - use the MPC8349VVAGDB because the integrated GbE plus dual PCI deliver the throughput and expansion slots needed in a single chip. At 400 MHz, the e300 core can run an embedded Linux distribution with iptables/Netfilter or OpenVPN with headroom for typical SOHO WAN speeds. The DDR2 controller supports the connection-tracking tables of stateful firewalls. The TBGA-672 package exposes the full peripheral set on a single board layer stack, simplifying FCC/EMC certification versus multi-chip designs. Industrial temperature rating allows deployment in non-climate-controlled wiring closets.
Recommended
VoIP Media Gateway
Carrier and enterprise VoIP media gateways can leverage the MPC8349VVAGDB as a control-plane processor because the e300 core handles SIP/H.323 signaling stacks while the integrated GbE MAC carries RTP media streams. Dual PCI slots allow TDM (E1/T1) interface cards for PSTN trunking, and the DDR2 controller manages DSP firmware and audio buffer pools. The 0 to 105 C junction rating supports carrier-grade NEBS-compliant chassis. The non-E variant is preferred here when the QUICC Engine is not needed for TDM offload (using external DSP cards instead), keeping firmware complexity and cost lower. Existing PowerPC BSPs and telephony middleware speed certification.
Recommended
Recommended Products Summary
Engineering reference data for MPC8349VVAGDB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8349EVVAJDB | MPC8349CVVAJDB | MPC8349EVVAJFB | MPC8349VVAGD | MPC8347CVRAGDB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 672-LBGA (TBGA) 35x35 | 672-LBGA (TBGA) 35x35 | 672-LBGA (TBGA) 35x35 | 672-LBGA (TBGA) 35x35 | 672-LBGA (TBGA) 35x35 | 620-PBGA (different) |
| Ethernet MAC | 1 x 10/100/1000 Mbps | 1 x 10/100/1000 Mbps | 1 x 10/100/1000 Mbps | 1 x 10/100/1000 Mbps | 1 x 10/100/1000 Mbps | Dual 10/100 Mbps |
| Memory Controller | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C (C grade) |
| Supply Voltage | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Lifecycle Status | NRND | NRND | NRND | Obsolete | NRND | NRND |
Key Differentiators
- Integrated GbE + dual PCI in a single SoC (vs MPC8347CVRAGDB)
- Pin-compatible upgrade path to 533 MHz with QUICC Engine (vs MPC8349EVVAJDB)
- Lower cost, simpler firmware without QUICC Engine (vs MPC8349EVVAJDB)
Design Notes
The TBGA-672 package has a thermal resistance (theta_JA) in the 15-20 C/W range when mounted on a standard 4-layer JEDEC test board with thermal vias under the die-attached pad. At full load with both PCI slots active and GbE running, internal dissipation can reach 3-5 W. A thermal pad with multiple stitching vias to inner ground planes and a moderate copper pour on the top side is essential for keeping junction temperature below 105 C in sealed enclosures. For fanless SOHO routers, design with at least 4 cm^2 of top-side copper plus a via array to inner planes. Always validate with a thermal probe on a production board.
Layout the DDR2 memory controller traces with 50-ohm controlled impedance and matched lengths within the byte lanes; data, strobe, and clock skew must be within the tolerances listed in the MPC8349 Reference Manual. Place at least 4 decoupling capacitors (0.1 uF, 10 uF, 1 uF) within 5 mm of each power pin. The TBGA-672 1.0 mm ball pitch demands 4-layer stack-up at minimum with microvia-in-pad recommended for the inner rows of balls; standard through-hole vias on inner balls create solder voids and reliability issues. Keep high-speed GbE and PCI traces on inner layers with continuous reference planes.
Do not confuse MPC8349 (no QUICC Engine) with MPC8349E (with QUICC Engine): they share the same datasheet family and pinout, but firmware written for one will not run unchanged on the other. Verify the silicon revision ('V' indicates Rev 2.0) before bringing up custom bootloader code. The 'C' temperature grade (-40 C to +105 C) is NOT the same silicon as the standard 'V' grade (0 C to +105 C) - parts are not unconditionally interchangeable in cold-start applications. For new designs, NXP recommends migrating to QorIQ or Layerscape families given the NRND status of this part.
Compliance Information
NO-PB (no lead) per Mouser SKU description, indicating lead-free assembly compliance. Not AEC-Q100 qualified (industrial/consumer grade, not automotive). Halogen-free status not stated in provided data; flagged as unknown.
