MPC852TCZT50A - 50MHz PowerQUICC MPU, 256-BGA | NXP Semiconductors
MPN: MPC852TCZT50A ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.2 | $242.00 |
| 100 | $19.95 | $1,995.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $13.85 | $13,850.00 |
MPC852TCZT50A Overview
What is an MPU? A microprocessor unit (MPU) is an integrated circuit that contains the central processing unit (CPU) of a computer or embedded system, typically without on-chip flash or large SRAM. MPUs rely on external memory and peripherals for full system operation. Within the hierarchy MPU -> embedded processor -> communications processor -> PowerQUICC -> Power Architecture, the MPC852T occupies the communications-processor node, integrating the CPU with serial-communications controllers to offload the host and reduce system BOM in networking equipment.
Key features of the MPC852TCZT50A include a 32-bit RISC core, integrated CPM (Communications Processor Module) supporting Ethernet, HDLC, UART, and other serial protocols, hardware-accelerated communications offload, and an industrial-grade operating temperature window. The 256-BGA package delivers high I/O density in a footprint roughly 23x23 mm, suitable for high-density line-card and router designs.
The device is built on a 0.18 micrometer CMOS process and is offered in a tray packaging format. Compared with general-purpose MPUs, the MPC852T class targets telecom line cards, routers, and industrial-control boards where deterministic communications handling is required. Designers should note the RoHS Non-Compliant / Contains Lead status, which constrains use in modern Pb-free assembly lines.
Typical applications include Ethernet-to-Ethernet line cards, protocol converters, industrial serial gateways, and legacy networking equipment. The integrated CPM allows the device to terminate multiple serial links without an external communication controller, simplifying board layout.
When designing with this MPU, verify external SDRAM and bus-arbiter compatibility, and account for the non-RoHS / lead-containing termination finish when planning assembly processes. The lack of RoHS compliance often requires a tin-lead solder process or a specific exemption.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, supporting both engineering selection and sourcing decisions.
Drop-in alternatives for MPC852TCZT50A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC852TCZT50A (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Mounting Type, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC852TVR50A
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →MPC852TCZT66A
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →MPC857DSLVR50B
✅ Drop-In✓ In Stock
$23.13 / Unit
View Datasheet →XPC850ZT50B
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5233CVM150
✅ Drop-In✓ In Stock
$61.65 / Unit
View Datasheet →MPC852TCZT50A Maximum Ratings & Electrical Characteristics
| Processor Type | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | Power Architecture (32-bit RISC) |
| Core Clock Speed | 50 MHz |
| Number of Cores | 1 |
| Process Technology | 0.18 micrometer CMOS |
| I/O Voltage | 3.3 V |
| Core Voltage | 1.8 V |
| Package / Case | 256-PBGA (23x23 mm) |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Communications Module | Integrated CPM (Ethernet, HDLC, UART, etc.) |
| Family | PowerQUICC II (MPC8xx) |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
MPC852TCZT50A 256-pbga (23x23 mm) Pin Configuration Guide
Pin configuration for MPC852TCZT50A (256-pbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC852TCZT50A.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC852TCZT50A is suitable for 6 applications: Ethernet-to-Ethernet Line Cards, Protocol Converters and Serial Gateways, Legacy Networking Equipment, Industrial Control Boards, Communications Controllers in Embedded Routers, Test and Measurement Instrumentation.
Ethernet-to-Ethernet Line Cards
The MPC852TCZT50A's 50 MHz PowerQUICC core plus integrated CPM delivers hardware-accelerated Ethernet termination for line cards in carrier-class routers. According to NXP, the on-chip CPM offloads protocol processing (HDLC, Ethernet, UART) from the CPU, freeing the core for routing-table work and SLA enforcement. The 256-PBGA package concentrates 32-bit memory bus plus CPM signals on a single die, ideal for high-density line-card designs. Designers use external SDRAM for buffering and an MII/RMII PHY for physical-layer connectivity, achieving deterministic throughput without an external communication controller.
Recommended
Protocol Converters and Serial Gateways
Industrial protocol-converter designs use the MPC852TCZT50A's CPM to terminate multiple serial protocols (HDLC, UART, SPI) in parallel without external ASICs. The 1.8 V core and 3.3 V I/O allow low-power operation at 50 MHz, and the 256-BGA footprint integrates the full memory bus plus serial controllers on a compact PCB. According to the NXP datasheet, the CPM DMA engine handles protocol framing autonomously, so the CPU only processes payload data - a critical advantage for industrial gateways aggregating Modbus, Profibus, and legacy serial traffic.
Recommended
Legacy Networking Equipment
Telecom and industrial-control products in service for 10+ years often rely on the MPC852TCZT50A because of its deterministic CPM and Power Architecture tool-chain. According to NXP's product longevity program, the PowerQUICC family has assured supply for legacy programs. The 256-BGA's high I/O count lets the MPU connect to legacy bus ASICs and memory chips without glue logic. The -40C to +100C industrial temperature grade supports outdoor cabinet installations, and Rochester Electronics franchises long-term supply for ongoing maintenance contracts.
Recommended
Industrial Control Boards
Industrial-control boards in factory automation and process control leverage the MPC852TCZT50A's CPM to drive deterministic serial links to PLCs and field devices. The 0.18 micrometer CMOS process and 1.8 V internal core deliver low power dissipation, while 3.3 V I/O interfaces directly to legacy 3.3 V peripherals without level shifters. According to NXP, the integrated UART, HDLC, and Ethernet controllers make this part ideal for industrial gateways aggregating fieldbus traffic into Ethernet. The 256-BGA's thermal performance supports convection-cooled enclosures up to 100C junction.
Recommended
Communications Controllers in Embedded Routers
Embedded routers and customer-premises equipment (CPE) historically used the MPC852TCZT50A as the main CPU plus communications engine. The integrated CPM handles WAN serial links (T1/E1, HDLC), while the 50 MHz core runs routing protocols and management plane code. The 256-BGA footprint supports the wide external memory bus needed for routing tables and packet buffers. According to the NXP datasheet, the CPM's RISC engine executes microcode for protocol offload, freeing the CPU for application processing - a key advantage over discrete CPU-plus-controller architectures.
Recommended
Test and Measurement Instrumentation
Test and measurement instrumentation uses the MPC852TCZT50A's deterministic CPM behaviour to drive high-speed serial acquisition links in protocol analysers and telecom test sets. The Power Architecture core runs the user-interface code while the CPM manages real-time protocol framing. The 256-BGA's high I/O count exposes the full memory bus plus multiple serial ports, allowing dense instrumentation front-ends on a single board. According to NXP, the industrial-grade temperature range supports lab and field use cases without thermal derating.
Recommended
Recommended Products Summary
Engineering reference data for MPC852TCZT50A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC852TVR50A | MPC852TCZT66A | MPC857DSLVR50B | XPC850ZT50B | MCF5233CVM150 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA - same | 256-PBGA - same | 256-PBGA - same | 256-PBGA - same | 256-MAPBGA - same ball pattern |
| Core Clock Speed | 50 MHz | 50 MHz | 66 MHz | 50 MHz (faster CPM) | 50 MHz | 150 MHz (ColdFire) |
| Core Architecture | Power Architecture (32-bit RISC) | Power Architecture | Power Architecture | Power Architecture | Power Architecture | ColdFire V2 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +100C | -40C to +105C (telecom) | -40C to +100C | -40C to +105C | -40C to +95C | -40C to +85C |
| RoHS Status | Non-Compliant (Contains Lead) | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Pb-free available |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active |
| Integrated CPM | Yes (Ethernet, HDLC, UART) | Yes | Yes | Yes (enhanced) | Reduced | Yes (Fast Ethernet) |
Key Differentiators
- Same PBGA-256 footprint across the entire PowerQUICC II family (vs MCF5233CVM150 (ColdFire))
- Fully integrated CPM with hardware protocol offload (vs XPC850ZT50B)
- Industrial-grade -40C to +100C operating range (vs MCF5233CVM150)
- Power Architecture tool-chain with 20+ years of firmware investment (vs Newer QorIQ Layerscape parts)
Design Notes
Estimated: at 1.8 V core and 50 MHz the MPC852TCZT50A core draws roughly 200-300 mA (~0.5 W), and 3.3 V I/O at typical loads adds another 0.3-0.6 W, yielding ~1 W total in typical designs. The 256-PBGA package dissipates via internal balls; ensure the PCB has a continuous ground plane under the BGA and adequate thermal vias (0.3 mm pitch, 12+ vias) to keep junction below 100C at the high end of the operating range.
The MPC852TCZT50A is RoHS Non-Compliant and Contains Lead per the NXP product page. Do NOT attempt to solder it on a fully Pb-free line unless a documented exemption applies. Use Sn-Pb or Sn-Pb-Ag paste with profile matched to the BGA thermal mass, and ensure the stencil aperture accounts for the 1.0 mm ball pitch to prevent solder bridging.
Route the external SDRAM bus (data, address, byte-enables, clocks) with matched-length traces within the skew budget defined in the MPC852T datasheet. Place SDRAM as close to the BGA as possible on the same PCB layer. The CPM serial signals (Ethernet, HDLC, UART) should be routed over an unbroken reference plane with controlled impedance (50 ohm single-ended) to avoid protocol framing errors at high baud rates.
Boot configuration is determined by the state of BCSR signals at reset. A mistake here is one of the most common reasons prototypes fail to boot. Always double-check the hard-reset configuration word against the application note and use pull-ups/pull-downs rated for the 3.3 V I/O voltage, not 5 V tolerant logic. Confirm MODCK and MODCK1 settings produce the desired clock ratio at 50 MHz.
For the integrated CPM Ethernet interfaces, route the MII/RMII signals with 50 ohm controlled impedance and length-matched within 50 mil. Place the PHY as close as possible to minimise round-trip latency, and isolate the analog PHY supply with a ferrite bead and local decoupling. Failing to do this is a frequent cause of CRC errors in HDLC/Ethernet loops.
Compliance Information
Per DigiKey product page: Contains Lead, RoHS Non-Compliant. REACH, halogen-free, and conflict-minerals status not stated in the verified web data; marked unknown.