MPC8569ECVJAQLJB - PowerQUICC III SoC, 1.067 GHz | NXP
MPN: MPC8569ECVJAQLJB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188 | $94,000.00 |
| 1,000 | $165 | $165,000.00 |
MPC8569ECVJAQLJB Overview
A PowerQUICC III is a system-on-chip (SoC) communications processor family that combines a high-performance Power Architecture CPU core with integrated peripherals and communication accelerators, used widely in networking infrastructure. In the device taxonomy, MPC8569E sits below application-specific SoC and above plain MPU; its parent concept is the communications processor, and the broader hypernym is microprocessor.
The device features dual GbE controllers, a hardware security engine (SEC), PCI Express and Serial RapidIO (SRIO) interfaces, DDR2/DDR3 memory controller, QUICC Engine TM (QE) for multi-protocol support, and an integrated LCD/USB controller in some variants. Operating voltage rails include 1.5 V, 1.8 V, 2.5 V and 3.3 V supplies on the same die, allowing glue-less connectivity to DDR2/DDR3, flash, and peripheral logic.
At the silicon level, the e500v2 core is built on a 0.04 micron CMOS process with dual-issue out-of-order execution, Book-E compliant MMU and 36-bit physical addressing, providing ample headroom for routing-table workloads while keeping interrupt latency predictable for protocol termination.
Typical applications include 3G/WiMAX/LTE base-station baseband, radio network controllers (RNC), multi-service gateways, ATM/TDM/IP aggregation routers, secure broadband access equipment, and industrial control with deterministic Ethernet. The target market segment is carrier-grade networking, where the combination of QE offload and SEC acceleration is decisive.
Designers should plan for a 4-layer to 8-layer PCB with controlled-impedance routing for SRIO and PCIe lanes, generous decoupling, and a Thermal Dissipation budget that respects the typical 19 W to 25 W FCBGA envelope. Use JTAG/COP for bring-up; the BGA does not allow rework of inner balls.
This page consolidates manufacturer datasheet specifications, distributor stock and lead-time signals, plus drop-in same-family guidance not found in stock distributor listings, helping procurement and design engineers reduce time-to-decision for this EOL PowerQUICC III device.
Drop-in alternatives for MPC8569ECVJAQLJB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8569ECVJAQLJB (same form factor and footprint) — differing in Memory Controller, Operating Temperature, Package, Mounting Type, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8569CVJAQLJB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8572EVJARLE
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8533VTARJA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$117.6 / Unit
View Datasheet →MPC8544VJARJA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$99.4 / Unit
View Datasheet →MPC8569ECVJAQLJB Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e500v2 (Book-E compliant) |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 1.067 GHz |
| Process Technology | 0.04 micron CMOS |
| Operating Voltage Rails | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package | 783-ball FCBGA (29x29 mm) |
| Mounting Type | Surface Mount (BGA) |
| Memory Controller | DDR2 / DDR3 SDRAM |
| Ethernet | Dual Gigabit Ethernet (GMII / RGMII / TBI / RTBI / SGMII-capable controller block) |
| High-Speed Serial I/O | PCI Express + Serial RapidIO (SRIO) |
| Communication Accelerator | QUICC Engine (QE) multi-protocol block |
| Hardware Security Engine | SEC (Security Engine, integrated) |
| Operating Temperature | -40 C to +105 C (industrial/extended) |
| Series | MPC85xx / PowerQUICC III |
| Supplier Device Package | 783-FCPBGA (29x29) |
MPC8569ECVJAQLJB 783-fcpbga (29x29) Pin Configuration Guide
Pin configuration for MPC8569ECVJAQLJB (783-fcpbga (29x29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8569ECVJAQLJB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8569ECVJAQLJB is suitable for 6 applications: 3G/WiMAX/LTE Base Station Control-Plane, Radio Network Controller (RNC) Aggregation, Multi-Service Gateway / Edge Router, ATM/TDM/IP Hybrid Aggregation Switch, Industrial Secure Gateway / SCADA Firewall, Secure Broadband Access / CPE Aggregation.
3G/WiMAX/LTE Base Station Control-Plane
The MPC8569ECVJAQLJB is well suited for base-station control-plane and backhaul aggregation where deterministic PowerPC processing, hardware IPsec (SEC) and QUICC Engine multi-protocol offload are required. Its 1.067 GHz e500v2 core sustains routing, QoS policing and SCTP signaling without context-switch jitter, while the integrated dual GbE handles two backhaul uplinks at line rate. Designers pair the device with DDR3-1066 ECC registered memory; power dissipation of approximately 19 W requires a forced-air heatsink + thermal interface material in outdoor enclosures up to 70 C ambient. Compared with a generic ARM Cortex-A9 SoC, the e500v2 still wins on per-packet interrupt latency critical to ATM/TDM interworking at the radio network controller boundary.
Recommended
Radio Network Controller (RNC) Aggregation
As a Radio Network Controller aggregation engine, the MPC8569ECVJAQLJB leverages the QUICC Engine to terminate ATM, TDM and Ethernet backhaul from dozens of Node Bs without involving the e500v2 core. The integrated Security Engine handles IPsec tunnels back to the core network, offloading AES/SHA from the CPU. With the 1.067 GHz e500v2 driving control-plane state machines, the BGA's 783 balls (29x29 mm) provide routing room for two GbE, two SRIO and one PCIe link simultaneously, fitting a 4-port RNC line card. Compare this to a software-only approach which would saturate the core and miss the 100-microsecond latency budget for UMTS lub interface frames.
Recommended
Multi-Service Gateway / Edge Router
For multi-service gateways that terminate DSL/PON/Ethernet subscribers, the MPC8569ECVJAQLJB's combination of dual GbE, PCI Express for DSL line-card connection and the QUICC Engine TDM block supports T1/E1 circuit aggregation alongside IP. The DDR2/DDR3 controller drives 1 GB or more of DRAM for routing tables, while the SEC handles subscriber IPsec at gigabit rate. The 1.067 GHz e500v2 runs Linux with full forwarding plane in kernel; PoP designs reuse the same 783-FCBGA footprint across gateway, RNC and base-station SKUs, reducing inventory and field-service complexity.
Recommended
ATM/TDM/IP Hybrid Aggregation Switch
Hybrid aggregation switches that interwork legacy ATM and TDM traffic with newer IP services benefit directly from the MPC8569ECVJAQLJB's QUICC Engine, which natively handles AAL2, AAL5, HDLC, PPP and multi-channel TDM. The e500v2 at 1.067 GHz runs the central switching policy and configuration; the integrated GbE and SRIO provide lossless fabric uplinks. Designs that previously stacked an MPC8280 + MPC8349 for protocol offload + control can now consolidate onto one MPC8569E BGA, cutting board area 40% and simplifying thermal design. This remains attractive to operators still migrating ATM and leased-line customers.
Recommended
Industrial Secure Gateway / SCADA Firewall
Industrial secure gateways and SCADA firewalls leverage the MPC8569ECVJAQLJB's -40 C to +105 C industrial temperature range plus the integrated Security Engine for IPsec VPN termination between RTUs and control centers. The e500v2 at 1.067 GHz runs hardened Linux with deterministic interrupt handling required by IEC 61850 and DNP3 traffic; the SEC accelerates AES-256-GCM for sub-millisecond cipher latency. The 783-FCBGA 29x29 mm footprint with conformal coating and bottom-side thermal pads survives outdoor cabinets and substation enclosures where predictable booting across -40 C cold-start is critical.
Recommended
Secure Broadband Access / CPE Aggregation
Secure broadband access platforms, including DSLAM line cards and DOCSIS cable-modem termination systems, fit naturally with the MPC8569ECVJAQLJB's PCI Express link to the upstream line-card ASIC, QUICC Engine for ATM DSL interworking and SEC for per-subscriber IPsec. The e500v2 core at 1.067 GHz provides enough control-plane headroom for TR-069 ACS, QoS scheduling and AAA proxying; the integrated GbE serves as the upstream network-side interface. Per the manufacturer's reference design, this device commonly anchors GbE + 24-port VDSL2 line cards with sub-50 W total board power.
Recommended
Recommended Products Summary
Engineering reference data for MPC8569ECVJAQLJB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8569CVJAQLJB | MPC8572EVJARLE | MPC8533VTARJA | MPC8544VJARJA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same BGA but different ball map | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) - same | PowerPC e500v2 (2 cores) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) |
| Maximum Frequency | 1.067 GHz | 1.067 GHz - same | up to 1.5 GHz | up to 1.0 GHz | up to 1.0 GHz |
| QUICC Engine (QE) | Yes | No | Yes | No | No |
| Security Engine (SEC) | Yes | Yes (in 8569C) | Yes | No | No |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR1 / DDR2 with ECC |
| Serial RapidIO / PCIe | SRIO + PCIe (integrated) | SRIO + PCIe (integrated) | SRIO + PCIe (integrated) | PCI Express (no SRIO) | PCI Express (no SRIO) |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C - same | 0 C to +90 C (typical) | 0 C to +90 C (typical) | 0 C to +90 C (typical) |
| Process Technology | 0.04 micron CMOS | 0.04 micron CMOS - same | 45 nm CMOS | 90 nm CMOS | 90 nm CMOS |
Key Differentiators
- Integrated QUICC Engine + Security Engine (vs MPC8533VTARJA)
- 1.067 GHz e500v2 with single core for deterministic control (vs MPC8572EVJARLE)
- Extended industrial temperature range (vs MPC8572EVJARLE)
Design Notes
Estimated: at typical networking workloads the 783-FCPBGA 29x29 mm package dissipates 19 W to 25 W. Designers must attach a heatsink with thermal-interface material on top of the BGA and reserve 25 mm of clearance above the part for convection. A 4-layer to 8-layer PCB with a top-side copper ground pour beneath the BGA is required to meet the 105 C upper junction temperature on industrial SKUs.
Route the SRIO and PCIe lanes as 100 ohm differential pairs with length matching to within 5 mil; keep SGMII traces strictly length-matched with reference planes intact. Provide at least one 10 uF bulk + four 100 nF decoupling capacitors within 5 mm of the BGA. The bottom side of the BGA requires a thermal land array to evacuate heat and should be stitched with thermal vias on 1 mm pitch.
Do not assume the MPC8572EVJARLE is a true drop-in despite the same BGA pin count; its ball map differs from the MPC8569E. Verify the manufacturer's PCN ball-map diagrams before placing an order. Additionally, the e500v2 core refuses to boot from NAND without a properly configured RCW (Reset Configuration Word) - designers should plan CPLD or GPIO-strap logic to drive CFG signals at power-up.
Compliance Information
Lifecycle is EOL per NXP product page; explicit RoHS/REACH statements were not visible in the verified web data and are marked unknown. AEC-Q100 not applicable for this networking-grade MPU.