MPC8569ECVJAQLJB - PowerQUICC III SoC, 1.067 GHz | NXP
부품 번호: MPC8569ECVJAQLJB ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $248 | $2,480.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188 | $94,000.00 |
| 1,000 | $165 | $165,000.00 |
MPC8569ECVJAQLJB 개요
A PowerQUICC III is a system-on-chip (SoC) communications processor family that combines a high-performance Power Architecture CPU core with integrated peripherals and communication accelerators, used widely in networking infrastructure. In the device taxonomy, MPC8569E sits below application-specific SoC and above plain MPU; its parent concept is the communications processor, and the broader hypernym is microprocessor.
The device features dual GbE controllers, a hardware security engine (SEC), PCI Express and Serial RapidIO (SRIO) interfaces, DDR2/DDR3 memory controller, QUICC Engine TM (QE) for multi-protocol support, and an integrated LCD/USB controller in some variants. Operating voltage rails include 1.5 V, 1.8 V, 2.5 V and 3.3 V supplies on the same die, allowing glue-less connectivity to DDR2/DDR3, flash, and peripheral logic.
At the silicon level, the e500v2 core is built on a 0.04 micron CMOS process with dual-issue out-of-order execution, Book-E compliant MMU and 36-bit physical addressing, providing ample headroom for routing-table workloads while keeping interrupt latency predictable for protocol termination.
Typical applications include 3G/WiMAX/LTE base-station baseband, radio network controllers (RNC), multi-service gateways, ATM/TDM/IP aggregation routers, secure broadband access equipment, and industrial control with deterministic Ethernet. The target market segment is carrier-grade networking, where the combination of QE offload and SEC acceleration is decisive.
Designers should plan for a 4-layer to 8-layer PCB with controlled-impedance routing for SRIO and PCIe lanes, generous decoupling, and a Thermal Dissipation budget that respects the typical 19 W to 25 W FCBGA envelope. Use JTAG/COP for bring-up; the BGA does not allow rework of inner balls.
This page consolidates manufacturer datasheet specifications, distributor stock and lead-time signals, plus drop-in same-family guidance not found in stock distributor listings, helping procurement and design engineers reduce time-to-decision for this EOL PowerQUICC III device.
드롭인 대체품: MPC8569ECVJAQLJB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8569ECVJAQLJB (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, Operating Temperature, Package, Mounting Type, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8569CVJAQLJB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572EVJARLE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8533VTARJA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$117.6 / 개
데이터시트 보기 →MPC8544VJARJA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$99.4 / 개
데이터시트 보기 →MPC8569ECVJAQLJB 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e500v2 (Book-E compliant) |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1.067 GHz |
| Process Technology | 0.04 micron CMOS |
| Operating Voltage Rails | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 패키지 | 783-ball FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Memory Controller | DDR2 / DDR3 SDRAM |
| Ethernet | Dual Gigabit Ethernet (GMII / RGMII / TBI / RTBI / SGMII-capable controller block) |
| High-Speed Serial I/O | PCI Express + Serial RapidIO (SRIO) |
| Communication Accelerator | QUICC Engine (QE) multi-protocol block |
| Hardware Security Engine | SEC (Security Engine, integrated) |
| 동작 온도 | -40 C to +105 C (industrial/extended) |
| Series | MPC85xx / PowerQUICC III |
| Supplier Device Package | 783-FCPBGA (29x29) |
MPC8569ECVJAQLJB 783-fcpbga (29x29) 핀 구성 가이드
MPC8569ECVJAQLJB(783-fcpbga (29x29) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8569ECVJAQLJB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8569ECVJAQLJB 적합 용도: 6 애플리케이션s: 3G/WiMAX/LTE Base Station Control-Plane, Radio Network Controller (RNC) Aggregation, Multi-Service Gateway / Edge Router, ATM/TDM/IP Hybrid Aggregation Switch, Industrial Secure Gateway / SCADA Firewall, Secure Broadband Access / CPE Aggregation.
3G/WiMAX/LTE Base Station Control-Plane
The MPC8569ECVJAQLJB is well suited for base-station control-plane and backhaul aggregation where deterministic PowerPC processing, hardware IPsec (SEC) and QUICC Engine multi-protocol offload are required. Its 1.067 GHz e500v2 core sustains routing, QoS policing and SCTP signaling without context-switch jitter, while the integrated dual GbE handles two backhaul uplinks at line rate. Designers pair the device with DDR3-1066 ECC registered memory; power dissipation of approximately 19 W requires a forced-air heatsink + thermal interface material in outdoor enclosures up to 70 C ambient. Compared with a generic ARM Cortex-A9 SoC, the e500v2 still wins on per-packet interrupt latency critical to ATM/TDM interworking at the radio network controller boundary.
추천
Radio Network Controller (RNC) Aggregation
As a Radio Network Controller aggregation engine, the MPC8569ECVJAQLJB leverages the QUICC Engine to terminate ATM, TDM and Ethernet backhaul from dozens of Node Bs without involving the e500v2 core. The integrated Security Engine handles IPsec tunnels back to the core network, offloading AES/SHA from the CPU. With the 1.067 GHz e500v2 driving control-plane state machines, the BGA's 783 balls (29x29 mm) provide routing room for two GbE, two SRIO and one PCIe link simultaneously, fitting a 4-port RNC line card. Compare this to a software-only approach which would saturate the core and miss the 100-microsecond latency budget for UMTS lub interface frames.
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Multi-Service Gateway / Edge Router
For multi-service gateways that terminate DSL/PON/Ethernet subscribers, the MPC8569ECVJAQLJB's combination of dual GbE, PCI Express for DSL line-card connection and the QUICC Engine TDM block supports T1/E1 circuit aggregation alongside IP. The DDR2/DDR3 controller drives 1 GB or more of DRAM for routing tables, while the SEC handles subscriber IPsec at gigabit rate. The 1.067 GHz e500v2 runs Linux with full forwarding plane in kernel; PoP designs reuse the same 783-FCBGA footprint across gateway, RNC and base-station SKUs, reducing inventory and field-service complexity.
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ATM/TDM/IP Hybrid Aggregation Switch
Hybrid aggregation switches that interwork legacy ATM and TDM traffic with newer IP services benefit directly from the MPC8569ECVJAQLJB's QUICC Engine, which natively handles AAL2, AAL5, HDLC, PPP and multi-channel TDM. The e500v2 at 1.067 GHz runs the central switching policy and configuration; the integrated GbE and SRIO provide lossless fabric uplinks. Designs that previously stacked an MPC8280 + MPC8349 for protocol offload + control can now consolidate onto one MPC8569E BGA, cutting board area 40% and simplifying thermal design. This remains attractive to operators still migrating ATM and leased-line customers.
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Industrial Secure Gateway / SCADA Firewall
Industrial secure gateways and SCADA firewalls leverage the MPC8569ECVJAQLJB's -40 C to +105 C industrial temperature range plus the integrated Security Engine for IPsec VPN termination between RTUs and control centers. The e500v2 at 1.067 GHz runs hardened Linux with deterministic interrupt handling required by IEC 61850 and DNP3 traffic; the SEC accelerates AES-256-GCM for sub-millisecond cipher latency. The 783-FCBGA 29x29 mm footprint with conformal coating and bottom-side thermal pads survives outdoor cabinets and substation enclosures where predictable booting across -40 C cold-start is critical.
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Secure Broadband Access / CPE Aggregation
Secure broadband access platforms, including DSLAM line cards and DOCSIS cable-modem termination systems, fit naturally with the MPC8569ECVJAQLJB's PCI Express link to the upstream line-card ASIC, QUICC Engine for ATM DSL interworking and SEC for per-subscriber IPsec. The e500v2 core at 1.067 GHz provides enough control-plane headroom for TR-069 ACS, QoS scheduling and AAA proxying; the integrated GbE serves as the upstream network-side interface. Per the manufacturer's reference design, this device commonly anchors GbE + 24-port VDSL2 line cards with sub-50 W total board power.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8569ECVJAQLJB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8569CVJAQLJB | MPC8572EVJARLE | MPC8533VTARJA | MPC8544VJARJA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same BGA but different ball map | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) - same | PowerPC e500v2 (2 cores) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) |
| Maximum Frequency | 1.067 GHz | 1.067 GHz - same | up to 1.5 GHz | up to 1.0 GHz | up to 1.0 GHz |
| QUICC Engine (QE) | Yes | No | Yes | No | No |
| Security Engine (SEC) | Yes | Yes (in 8569C) | Yes | No | No |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR1 / DDR2 with ECC |
| Serial RapidIO / PCIe | SRIO + PCIe (integrated) | SRIO + PCIe (integrated) | SRIO + PCIe (integrated) | PCI Express (no SRIO) | PCI Express (no SRIO) |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C - same | 0 C to +90 C (typical) | 0 C to +90 C (typical) | 0 C to +90 C (typical) |
| Process Technology | 0.04 micron CMOS | 0.04 micron CMOS - same | 45 nm CMOS | 90 nm CMOS | 90 nm CMOS |
주요 차별점
- Integrated QUICC Engine + Security Engine (vs MPC8533VTARJA)
- 1.067 GHz e500v2 with single core for deterministic control (vs MPC8572EVJARLE)
- Extended industrial temperature range (vs MPC8572EVJARLE)
설계 노트
Estimated: at typical networking workloads the 783-FCPBGA 29x29 mm package dissipates 19 W to 25 W. Designers must attach a heatsink with thermal-interface material on top of the BGA and reserve 25 mm of clearance above the part for convection. A 4-layer to 8-layer PCB with a top-side copper ground pour beneath the BGA is required to meet the 105 C upper junction temperature on industrial SKUs.
Route the SRIO and PCIe lanes as 100 ohm differential pairs with length matching to within 5 mil; keep SGMII traces strictly length-matched with reference planes intact. Provide at least one 10 uF bulk + four 100 nF decoupling capacitors within 5 mm of the BGA. The bottom side of the BGA requires a thermal land array to evacuate heat and should be stitched with thermal vias on 1 mm pitch.
Do not assume the MPC8572EVJARLE is a true drop-in despite the same BGA pin count; its ball map differs from the MPC8569E. Verify the manufacturer's PCN ball-map diagrams before placing an order. Additionally, the e500v2 core refuses to boot from NAND without a properly configured RCW (Reset Configuration Word) - designers should plan CPLD or GPIO-strap logic to drive CFG signals at power-up.
규정 준수 정보
Lifecycle is EOL per NXP product page; explicit RoHS/REACH statements were not visible in the verified web data and are marked unknown. AEC-Q100 not applicable for this networking-grade MPU.