MPC8569ECVJAQLJB - PowerQUICC III SoC, 1.067 GHz | NXP
MPN： MPC8569ECVJAQLJB ✗ 停產MPC8569ECVJAQLJB 概覽
A PowerQUICC III is a system-on-chip (SoC) communications processor family that combines a high-performance Power Architecture CPU core with integrated peripherals and communication accelerators, used widely in networking infrastructure. In the device taxonomy, MPC8569E sits below application-specific SoC and above plain MPU; its parent concept is the communications processor, and the broader hypernym is microprocessor.
The device features dual GbE controllers, a hardware security engine (SEC), PCI Express and Serial RapidIO (SRIO) interfaces, DDR2/DDR3 memory controller, QUICC Engine TM (QE) for multi-protocol support, and an integrated LCD/USB controller in some variants. Operating voltage rails include 1.5 V, 1.8 V, 2.5 V and 3.3 V supplies on the same die, allowing glue-less connectivity to DDR2/DDR3, flash, and peripheral logic.
At the silicon level, the e500v2 core is built on a 0.04 micron CMOS process with dual-issue out-of-order execution, Book-E compliant MMU and 36-bit physical addressing, providing ample headroom for routing-table workloads while keeping interrupt latency predictable for protocol termination.
Typical applications include 3G/WiMAX/LTE base-station baseband, radio network controllers (RNC), multi-service gateways, ATM/TDM/IP aggregation routers, secure broadband access equipment, and industrial control with deterministic Ethernet. The target market segment is carrier-grade networking, where the combination of QE offload and SEC acceleration is decisive.
Designers should plan for a 4-layer to 8-layer PCB with controlled-impedance routing for SRIO and PCIe lanes, generous decoupling, and a Thermal Dissipation budget that respects the typical 19 W to 25 W FCBGA envelope. Use JTAG/COP for bring-up; the BGA does not allow rework of inner balls.
This page consolidates manufacturer datasheet specifications, distributor stock and lead-time signals, plus drop-in same-family guidance not found in stock distributor listings, helping procurement and design engineers reduce time-to-decision for this EOL PowerQUICC III device.
直接替換替代品，適用於 MPC8569ECVJAQLJB — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8569ECVJAQLJB （相同外形與佔位） — 差異在於 Memory Controller, Operating Temperature, Package, Mounting Type, Core Architecture.
MPC8569CVJAQLJB
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572EVJARLE
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8533VTARJA
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MPC8544VJARJA
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MPC8569ECVJAQLJB 最大額定值與電氣特性
| Core Architecture | PowerPC e500v2 (Book-E compliant) |
| Number of Cores | 1 |
| 資料匯流排寬度 | 32-bit |
| Maximum Core Frequency | 1.067 GHz |
| Process Technology | 0.04 micron CMOS |
| Operating Voltage Rails | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 封裝 | 783-ball FCBGA (29x29 mm) |
| 安裝類型 | Surface Mount (BGA) |
| Memory Controller | DDR2 / DDR3 SDRAM |
| Ethernet | Dual Gigabit Ethernet (GMII / RGMII / TBI / RTBI / SGMII-capable controller block) |
| High-Speed Serial I/O | PCI Express + Serial RapidIO (SRIO) |
| Communication Accelerator | QUICC Engine (QE) multi-protocol block |
| Hardware Security Engine | SEC (Security Engine, integrated) |
| 工作溫度 | -40 C to +105 C (industrial/extended) |
| Series | MPC85xx / PowerQUICC III |
| Supplier Device Package | 783-FCPBGA (29x29) |
MPC8569ECVJAQLJB 783-fcpbga (29x29) 腳位配置指南
MPC8569ECVJAQLJB（783-fcpbga (29x29) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8569ECVJAQLJB.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8569ECVJAQLJB 適用於 6 應用s: 3G/WiMAX/LTE Base Station Control-Plane, Radio Network Controller (RNC) Aggregation, Multi-Service Gateway / Edge Router, ATM/TDM/IP Hybrid Aggregation Switch, Industrial Secure Gateway / SCADA Firewall, Secure Broadband Access / CPE Aggregation.
3G/WiMAX/LTE Base Station Control-Plane
The MPC8569ECVJAQLJB is well suited for base-station control-plane and backhaul aggregation where deterministic PowerPC processing, hardware IPsec (SEC) and QUICC Engine multi-protocol offload are required. Its 1.067 GHz e500v2 core sustains routing, QoS policing and SCTP signaling without context-switch jitter, while the integrated dual GbE handles two backhaul uplinks at line rate. Designers pair the device with DDR3-1066 ECC registered memory; power dissipation of approximately 19 W requires a forced-air heatsink + thermal interface material in outdoor enclosures up to 70 C ambient. Compared with a generic ARM Cortex-A9 SoC, the e500v2 still wins on per-packet interrupt latency critical to ATM/TDM interworking at the radio network controller boundary.
推薦
Radio Network Controller (RNC) Aggregation
As a Radio Network Controller aggregation engine, the MPC8569ECVJAQLJB leverages the QUICC Engine to terminate ATM, TDM and Ethernet backhaul from dozens of Node Bs without involving the e500v2 core. The integrated Security Engine handles IPsec tunnels back to the core network, offloading AES/SHA from the CPU. With the 1.067 GHz e500v2 driving control-plane state machines, the BGA's 783 balls (29x29 mm) provide routing room for two GbE, two SRIO and one PCIe link simultaneously, fitting a 4-port RNC line card. Compare this to a software-only approach which would saturate the core and miss the 100-microsecond latency budget for UMTS lub interface frames.
推薦
Multi-Service Gateway / Edge Router
For multi-service gateways that terminate DSL/PON/Ethernet subscribers, the MPC8569ECVJAQLJB's combination of dual GbE, PCI Express for DSL line-card connection and the QUICC Engine TDM block supports T1/E1 circuit aggregation alongside IP. The DDR2/DDR3 controller drives 1 GB or more of DRAM for routing tables, while the SEC handles subscriber IPsec at gigabit rate. The 1.067 GHz e500v2 runs Linux with full forwarding plane in kernel; PoP designs reuse the same 783-FCBGA footprint across gateway, RNC and base-station SKUs, reducing inventory and field-service complexity.
推薦
ATM/TDM/IP Hybrid Aggregation Switch
Hybrid aggregation switches that interwork legacy ATM and TDM traffic with newer IP services benefit directly from the MPC8569ECVJAQLJB's QUICC Engine, which natively handles AAL2, AAL5, HDLC, PPP and multi-channel TDM. The e500v2 at 1.067 GHz runs the central switching policy and configuration; the integrated GbE and SRIO provide lossless fabric uplinks. Designs that previously stacked an MPC8280 + MPC8349 for protocol offload + control can now consolidate onto one MPC8569E BGA, cutting board area 40% and simplifying thermal design. This remains attractive to operators still migrating ATM and leased-line customers.
推薦
Industrial Secure Gateway / SCADA Firewall
Industrial secure gateways and SCADA firewalls leverage the MPC8569ECVJAQLJB's -40 C to +105 C industrial temperature range plus the integrated Security Engine for IPsec VPN termination between RTUs and control centers. The e500v2 at 1.067 GHz runs hardened Linux with deterministic interrupt handling required by IEC 61850 and DNP3 traffic; the SEC accelerates AES-256-GCM for sub-millisecond cipher latency. The 783-FCBGA 29x29 mm footprint with conformal coating and bottom-side thermal pads survives outdoor cabinets and substation enclosures where predictable booting across -40 C cold-start is critical.
推薦
Secure Broadband Access / CPE Aggregation
Secure broadband access platforms, including DSLAM line cards and DOCSIS cable-modem termination systems, fit naturally with the MPC8569ECVJAQLJB's PCI Express link to the upstream line-card ASIC, QUICC Engine for ATM DSL interworking and SEC for per-subscriber IPsec. The e500v2 core at 1.067 GHz provides enough control-plane headroom for TR-069 ACS, QoS scheduling and AAA proxying; the integrated GbE serves as the upstream network-side interface. Per the manufacturer's reference design, this device commonly anchors GbE + 24-port VDSL2 line cards with sub-50 W total board power.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8569ECVJAQLJB — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8569CVJAQLJB | MPC8572EVJARLE | MPC8533VTARJA | MPC8544VJARJA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same BGA but different ball map | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) - same | PowerPC e500v2 (2 cores) | PowerPC e500v2 (1 core) | PowerPC e500v2 (1 core) |
| Maximum Frequency | 1.067 GHz | 1.067 GHz - same | up to 1.5 GHz | up to 1.0 GHz | up to 1.0 GHz |
| QUICC Engine (QE) | Yes | No | Yes | No | No |
| Security Engine (SEC) | Yes | Yes (in 8569C) | Yes | No | No |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR1 / DDR2 with ECC |
| Serial RapidIO / PCIe | SRIO + PCIe (integrated) | SRIO + PCIe (integrated) | SRIO + PCIe (integrated) | PCI Express (no SRIO) | PCI Express (no SRIO) |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C - same | 0 C to +90 C (typical) | 0 C to +90 C (typical) | 0 C to +90 C (typical) |
| Process Technology | 0.04 micron CMOS | 0.04 micron CMOS - same | 45 nm CMOS | 90 nm CMOS | 90 nm CMOS |
主要差異化特點
- Integrated QUICC Engine + Security Engine (對比MPC8533VTARJA)
- 1.067 GHz e500v2 with single core for deterministic control (對比MPC8572EVJARLE)
- Extended industrial temperature range (對比MPC8572EVJARLE)
設計說明
Estimated: at typical networking workloads the 783-FCPBGA 29x29 mm package dissipates 19 W to 25 W. Designers must attach a heatsink with thermal-interface material on top of the BGA and reserve 25 mm of clearance above the part for convection. A 4-layer to 8-layer PCB with a top-side copper ground pour beneath the BGA is required to meet the 105 C upper junction temperature on industrial SKUs.
Route the SRIO and PCIe lanes as 100 ohm differential pairs with length matching to within 5 mil; keep SGMII traces strictly length-matched with reference planes intact. Provide at least one 10 uF bulk + four 100 nF decoupling capacitors within 5 mm of the BGA. The bottom side of the BGA requires a thermal land array to evacuate heat and should be stitched with thermal vias on 1 mm pitch.
Do not assume the MPC8572EVJARLE is a true drop-in despite the same BGA pin count; its ball map differs from the MPC8569E. Verify the manufacturer's PCN ball-map diagrams before placing an order. Additionally, the e500v2 core refuses to boot from NAND without a properly configured RCW (Reset Configuration Word) - designers should plan CPLD or GPIO-strap logic to drive CFG signals at power-up.
合規資訊
Lifecycle is EOL per NXP product page; explicit RoHS/REACH statements were not visible in the verified web data and are marked unknown. AEC-Q100 not applicable for this networking-grade MPU.