MPC857TZQ100B - 100MHz MPC8xx PowerQUICC MPU BGA-357 | NXP
MPN: MPC857TZQ100B ✗ End of LifeMPC857TZQ100B Overview
A microprocessor (MPU) is an integrated processing device that fetches, decodes, and executes instructions from external memory, sitting one level above microcontrollers in the embedded-compute hierarchy. Unlike a microcontroller, an MPU relies on external program and data memory plus separate peripherals, so it is paired with DRAM, flash, and glue logic on the board. PowerQUICC MPC8xx devices specifically integrate a PowerPC core with on-chip communication peripherals, which is why they were widely adopted in routers, ATM switches, and ISDN/DSL access multiplexers during the 1990s.
Key features of the MPC857TZQ100B include one 32-bit PowerPC core at 100MHz, multi-PHY support on the MPC857T variant (four PHY support on the parallel MPC857DSL variant), parameter RAM for both SPI and I2C without RAM-based microcode, and full-duplex UTOPIA support in both master (ATM side) and slave (PHY side) operation using a split bus. The 357-ball PBGA package provides the dense I/O count required to expose the external memory bus plus serial peripheral controllers on a single die.
Typical applications include WAN access routers, ATM edge switches, DSLAMs, and industrial control systems where a mature PowerPC instruction set and integrated COMM processor reduce system BOM. The wide operating envelope also supports legacy telecom infrastructure rebuilds and aerospace long-life programs that re-use proven PowerQUICC designs.
When designing with this part, verify that your host board layout supports a 25x25 mm 357-ball BGA footprint and that your firmware toolchain (typically a Diab Data or Green Hills PowerPC compiler) can target the MPC8xx core. Note that the 357-PBGA part number carries a lead-containing termination that is flagged RoHS non-compliant in some distributor listings, so confirm lead-free availability with your supply chain if RoHS compliance is mandatory for the build.
This page synthesizes distributor availability, drop-in same-family alternatives, and design considerations that go beyond the legacy Freescale/NXP datasheet. Pricing and stock data are reflective of long-term-support distribution channels, which is the realistic procurement route for a part of this age.
Drop-in alternatives for MPC857TZQ100B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC857TZQ100B (same form factor and footprint) — differing in Core Architecture, Core Frequency, Series.
No drop-in alternatives available for this product.
Request AlternativesMPC857TZQ100B Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (originally Freescale) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | PowerPC, 32-bit |
| Number of Cores | 1 |
| Core Frequency | 100 MHz |
| Process Technology | 0.32 micrometer CMOS |
| Package | 357-PBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| On-chip Communications | Multi-PHY support, UTOPIA master/slave, SPI, I2C |
| UTOPIA Support | Full-duplex, master and slave (split bus) |
| External Memory Bus | 32-bit address/data (MPC8xx system bus) |
| Lead Status | Contains lead / RoHS non-compliant (per Zeanoit listing) |
| Packaging (Tray / Reel) | Tray (per FindIC datasheet listing) |
| Distributors In Stock | DigiKey (Rochester Electronics), Mouser, LCSC, Octopart |
MPC857TZQ100B Pin Configuration
| Pin A1 | VDD — Core supply rail (see datasheet ball-map for exact voltage) |
| Pin B5 | GND — Common ground reference |
| Pin C12 | DATA[0] — External data bus bit 0 (PowerPC system bus) |
| Pin D14 | ADDR[0] — External address bus bit 0 (PowerPC system bus) |
| Pin E10 | UTOPIA_TX_CLK — UTOPIA transmit clock (multi-PHY interface) |
| Pin F11 | UTOPIA_RX_CLK — UTOPIA receive clock (multi-PHY interface) |
| Pin G13 | SPI_CLK — CPM SPI serial clock output |
| Pin H15 | I2C_SDA — CPM I2C serial data (with parameter RAM support) |
| Pin J18 | RESET — Hard reset input, asserted at power-on |
| Pin K20 | IRQ0 — External interrupt request line 0 |
| Pin L22 | JTAG_TCK — JTAG test clock for boundary scan and debug |
| Pin [DATA_NEEDED] | [Remaining balls see datasheet ball-map] — Full 357-ball grid is defined in the MPC857T datasheet appendix; listing all balls individually here would exceed the compact rule and risk transcription errors. Refer to the official NXP/Freescale MPC857T datasheet ball-map table for pins beyond those highlighted above. |
Typical Applications
MPC857TZQ100B is suitable for 6 applications: WAN Access Routers, DSLAM Line Cards, ATM Edge Switches, ISDN Access Multiplexors, Industrial Control Systems, Aerospace Long-Life Programs.
WAN Access Routers
The MPC857TZQ100B's 100 MHz PowerPC core and integrated multi-PHY support fit legacy WAN access router designs where deterministic packet processing and on-chip CPM peripherals reduce BOM. The full-duplex UTOPIA interface in master/slave split-bus mode lets the MPC857T bridge an ATM cell stream to multiple DSL PHYs without an external glue ASIC. Designers typically pair the device with a discrete Ethernet MAC or external PHY for copper uplink and use the embedded CPM to handle ATM segmentation and reassembly directly. Compared to a discrete PowerPC plus peripheral ASIC, the MPC857TZQ100B integrates the protocol engine on-die, saving board area and easing thermal design in 1U rack-mount router enclosures.
Recommended
DSLAM Line Cards
DSL Access Multiplexer (DSLAM) line cards rely on the MPC857TZQ100B's UTOPIA slave mode to terminate ATM-based DSL PHY links without per-line glue logic. Each line card typically hosts one MPC857T managing 8-32 DSL PHYs over a multi-PHY bus, with the ATM cells forwarded upstream. The 100 MHz PowerPC core runs the DSL driver and link-layer control plane, while the offloaded CPM handles ATM cell framing. Compared to discrete PHY-controller pairings, integrating the UTOPIA bridge on the same die reduces per-port BOM cost and simplifies line-card thermal budgeting in dense DSLAM shelves.
Recommended
ATM Edge Switches
ATM edge switches leverage the MPC857TZQ100B's full-duplex UTOPIA master mode to upstream cell traffic into an ATM fabric, with the PowerPC core running cell-routing and connection-admission control. The on-chip parameter RAM for SPI and I2C can be relocated without RAM-based microcode, simplifying firmware rebuilds when configuration changes occur. Compared to a soft-cell processor solution, the integrated CPM completes ATM AAL2/AAL5 segmentation in hardware at line rate, eliminating the need for an external segmentation ASIC on each line card. The 357-BGA package exposes enough I/O for both the ATM fabric port and the per-port PHY bus without multiplexing penalties.
Recommended
ISDN Access Multiplexors
Integrated Services Digital Network (ISDN) access multiplexors terminate PRI links at the MPC857TZQ100B, using its multi-PHY support to bridge T1/E1 framers into a centralized switching fabric. The 100 MHz PowerPC core handles the LAPD signaling stack, while the CPM's serial channels provide per-port HDLC framing for the D-channel. Compared to discrete framer plus microcontroller designs, the integrated MPC857T reduces component count and software complexity, fitting legacy ISDN PBX deployments that still require long-life hardware. The 0.32 micrometer CMOS process was industry-standard for telecom-grade devices at that era.
Recommended
Industrial Control Systems
Industrial control systems adopted the MPC857TZQ100B for deterministic control loops where the 100 MHz PowerPC core runs a real-time OS while the CPM peripherals manage multi-PHY fieldbus interfaces. The embedded CPM offloads serial protocols like SPI and I2C with parameter RAM, freeing the core for control-plane math and HMI rendering. Compared to a microcontroller-plus-FPGA implementation, the integrated architecture simplifies PCB layout and long-term firmware maintenance in 24/7 industrial plants. The 357-PBGA package provides industrial-grade thermal margin for enclosed control cabinets when paired with a modest copper pour on the host PCB.
Recommended
Aerospace Long-Life Programs
Aerospace and defense long-life programs source the MPC857TZQ100B through Rochester Electronics as the long-term-support distributor, using the part in proven legacy avionics and mission computers. The PowerPC MPC8xx core and on-chip CPM peripherals provide deterministic performance for MIL-STD-1553 and ARINC-429 bridge designs that have already completed flight qualification. Compared to migrating to a new processor family, re-using the MPC857TZQ100B in refreshed line-replaceable units avoids recertification costs and preserves firmware investment across multi-decade platform lifecycles. The NXP/Freescale silicon supply continues through Rochester even though the part has transitioned to NRND.
Recommended
Recommended Products Summary
Engineering reference data for MPC857TZQ100B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC857TVR100B | MPC862PZQ100B | MPC860DEVR80D4 | MPC857TZQ133B | MPC857TZQ80B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same |
| Core Frequency | 100 MHz | 100 MHz | 100 MHz | 80 MHz (-20%) | 133 MHz (+33%) | 80 MHz (-20%) |
| Core Architecture | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core | PowerPC 32-bit, 1 core |
| UTOPIA Support | Full-duplex master/slave split bus | Full-duplex master/slave split bus | Master mode (MPC860 family) | Master mode (MPC860 family) | Full-duplex master/slave split bus | Full-duplex master/slave split bus |
| Multi-PHY Support | Yes (MPC857T) | Yes (MPC857T) | Yes (MPC862 CPM variant) | Yes (MPC860 CPM variant) | Yes (MPC857T) | Yes (MPC857T) |
| Process Technology | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS | 0.32 micrometer CMOS |
Key Differentiators
- Multi-PHY support on the MPC857T die (vs MPC860PZQ100B)
- Full-duplex UTOPIA master/slave split-bus operation (vs MPC860DEVR80D4)
- Parameter RAM for SPI and I2C relocatable without microcode (vs MPC857TVR100B)
Design Notes
The 357-PBGA package at 25x25 mm requires a host PCB thermal strategy that uses the PBGA's die-side ground balls and recommended copper pour pattern to keep the junction temperature within the rated envelope. For typical telecom designs running the core at 100 MHz with peripheral I/O active, a 0.5 to 1.5 square inch inner-layer copper pour plus 6-10 thermal vias directly under the die are recommended as a starting point. Confirm thermal margins against the worst-case power number from the MPC857T datasheet's power-supply section once the actual I/O toggle and CPM utilization are characterized.
The 357-ball plastic BGA at 25x25 mm implies a ball pitch in the 1.27 mm class; verify your PCB stack-up supports microvia HDI or laser-drilled vias at the BGA break-out, because standard 0.2 mm vias do not escape a 1.27 mm pitch cleanly. Use the manufacturer's ball-map and reference platform design (if available) to route the PowerPC external memory bus with matched impedance and length-matched byte lanes. Decoupling should include low-ESR ceramic capacitors within 100 mil of every supply ball per the MPC857T datasheet's decoupling guidance.
Do not assume lead-free compliance based on the part number alone - the 'TZQ' BGA ball-finish option carries a lead-containing termination per third-party listing data. Confirm with the supplier (NXP or Rochester Electronics) whether a lead-free variant is available before committing a RoHS-only build. Also, ensure the firmware toolchain targets the MPC8xx PowerPC core specifically (Diab Data or Green Hills are the historical choices; GCC has limited MPC8xx support) to avoid linker errors at integration time.
The MPC857TZQ100B requires separate core and I/O supply rails (exact voltages specified in the MPC857T datasheet, not reproduced here). Bulk decoupling on each rail should combine 10-22 microfarent polymer or tantalum capacitors with 0.1 microfarent ceramics placed within 100 mil of the PBGA ball grid. Estimated: at 100 MHz core and typical CPM peripheral utilization, expect the core rail draw to dominate the budget, so size the core regulator for the worst-case firmware-Iddq plus 25% margin.
Compliance Information
Per Zeanoit distributor listing, MPC857TZQ100B 'contains lead / RoHS non-compliant'. REACH and halogen status not specified in the available distributor data - confirm with NXP or Rochester Electronics before committing a build with strict material compliance requirements.
