MPC860DEVR80D4 - PowerQUICC MPU 80MHz 357-PBGA | NXP
MPN: MPC860DEVR80D4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $21.2 | $2,120.00 |
| 500 | $18.95 | $9,475.00 |
| 1,000 | $17.4 | $17,400.00 |
MPC860DEVR80D4 Overview
As a PowerQUICC microprocessor, the MPC860DEVR80D4 belongs to the broader family of PowerPC-based embedded MPUs, sitting between classic microcontrollers and high-end application processors in capability and complexity. The PowerQUICC architecture was NXP's (and originally Motorola's) flagship communications-processor family, integrating a PowerPC core with dedicated communications engine peripherals for WAN, LAN, and serial routing. The 'DE' suffix denotes Ethernet and SCC-rich peripheral configuration, while 'VR80' indicates 80 MHz core speed in a lead-free PBGA.
Key specifications include 80 MHz maximum core frequency, 32-bit internal data path, single-core architecture, and a 357-pin PBGA (25x25 mm) surface-mount package. Power consumption, exact memory map, and peripheral count should be confirmed against the manufacturer datasheet because this variant is end-of-life and datasheet revision documents are the only authoritative source.
Typical applications include telecom line cards, ISDN adapters, industrial routers, VoIP gateway controllers, and legacy networking equipment where a deterministic PowerPC core with integrated CPM (Communications Processor Module) replaced an external ASIC. The 357-PBGA package requires multi-layer PCB design with controlled-impedance traces and a substantial thermal copper pour.
When designing with this EOL part, verify long-term availability through authorized distributors and review NXP's Product Change Notice documentation. The 357-ball PBGA demands reflow profile control within JEDEC J-STD-020 parameters and X-ray inspection post-assembly because the large array is not visually inspectable. Always check NXP's official PCN database before committing to a new design.
Drop-in alternatives for MPC860DEVR80D4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC860DEVR80D4 (same form factor and footprint) — differing in Core Architecture, Mounting Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC860DEVR66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860DTZQ66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC866PCVR100A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860TVR80D4
✅ Drop-In✓ In Stock
$14.85 / Unit
View Datasheet →MPC860TZQ80D4
✅ Drop-In✓ In Stock
$24.4 / Unit
View Datasheet →MPC855TVR80D4
✅ Drop-In✓ In Stock
$64.5 / Unit
View Datasheet →MPC860DEVR80D4 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC MPC8xx |
| Core Architecture | PowerPC 32-bit RISC |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 80 MHz |
| Operating Process Technology | 0.32 um CMOS |
| Package Type | 357-PBGA (25 x 25 mm) |
| Mounting Type | Surface Mount |
| Peripheral Family | MPC8xx Communications Processor Module (CPM) |
| On-chip Peripherals | Ethernet, SCC, SMC, SPI, I2C, timers |
| RoHS Status | Compliant (lead-free VR suffix) |
| Lifecycle Status | End of Life (per NXP product page) |
MPC860DEVR80D4 357-pbga (25 x 25 mm) Pin Configuration Guide
Pin configuration for MPC860DEVR80D4 (357-pbga (25 x 25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC860DEVR80D4.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC860DEVR80D4 is suitable for 6 applications: Telecom Line Card Controller, Industrial Router and Gateway, VoIP Gateway Controller, ISDN Terminal Adapter, Legacy Networking Equipment Maintenance, Embedded Industrial Control.
Telecom Line Card Controller
The MPC860DEVR80D4 fits telecom line card designs because its integrated Communications Processor Module (CPM) offloads SCC, SMC, and DMA from the PowerPC core, enabling deterministic TDM and HDLC handling at 80 MHz. The 32-bit PowerPC core runs protocol stacks while the CPM manages framing, leaving headroom for call control software. The 357-PBGA footprint accommodates the multi-rail power decoupling typical of telecom line interface cards. Compared with discrete CPU-plus-ASIC designs, the single-chip integration reduces BOM cost and PCB area.
Recommended
Industrial Router and Gateway
The MPC860DEVR80D4 suits industrial router applications because the 'DE' peripheral configuration provides Ethernet MAC plus multiple SCC channels, enabling multi-port WAN and LAN routing in one BGA. The 80 MHz core runs routing tables and IP forwarding while the CPM handles serial protocol conversion. The device's deterministic interrupt latency is critical for industrial protocols requiring bounded response times. Industrial routers built on this part remain deployed in legacy SCADA and factory networks where reliability outweighs modern silicon alternatives.
Recommended
VoIP Gateway Controller
The MPC860DEVR80D4 fits VoIP gateway designs where the integrated CPM handles multiple TDM streams while the PowerPC core runs RTP, SIP, and signalling stacks. The 80 MHz processing budget is sufficient for handling several concurrent voice channels with low-bit-rate codecs. The 357-PBGA package integrates a complete gateway controller that previously required separate DSP, CPU, and framer ICs. Legacy VoIP equipment continues to use this part because firmware is qualified and field-proven across millions of installed units.
Recommended
ISDN Terminal Adapter
The MPC860DEVR80D4 supports ISDN terminal adapter designs because its SCC and serial channels natively handle ISDN BRI and PRI physical-layer protocols through external transceivers. The 32-bit PowerPC core manages ISDN D-channel signalling and PPP or MLPPP packet assembly for internet access. The integrated CPM allows simultaneous handling of voice and data over the ISDN bearer channels. The 357-PBGA's generous ball pitch simplifies manufacturing on standard 4-layer consumer-premises-equipment PCBs.
Recommended
Legacy Networking Equipment Maintenance
The MPC860DEVR80D4 is the right choice for maintaining legacy networking equipment that was originally designed around this specific PowerQUICC variant. Field-deployed routers, switches, and access multiplexers continue to require replacement boards as hardware ages. Sourcing the original part number preserves firmware compatibility and avoids requalification cycles. The end-of-life status means authorized distributors and brokers are the primary channels, with last-time-buy allocations previously completed by NXP for major OEM customers.
Recommended
Embedded Industrial Control
The MPC860DEVR80D4 is suitable for embedded industrial control applications where its deterministic PowerPC core and rich peripheral set replace a CPU-plus-PLC combination. The 80 MHz core handles real-time control loops while the CPM manages fieldbus communications such as Profibus or CAN bridges via external transceivers. Industrial control systems built on PowerQUICC silicon remain installed in power substations, water treatment plants, and railway signalling where long-term firmware stability outweighs the benefits of newer silicon.
Recommended
Recommended Products Summary
Engineering reference data for MPC860DEVR80D4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC860DEVR66D4 | MPC860DTZQ66D4 | MPC866PCVR100A | MPC860TVR80D4 | MPC860TZQ80D4 | MPC855TVR80D4 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 80 MHz | 66 MHz | 66 MHz | 100 MHz | 80 MHz | 80 MHz | 80 MHz |
| Peripheral Family | MPC860 'DE' (Ethernet + SCC) | MPC860 'DE' | MPC860 'DT' enhanced | MPC866 enhanced | MPC860 'T' (fast Ethernet) | MPC860 'TZ' (telecom) | MPC855 (no Ethernet) |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL | EOL |
| Lead-Free (RoHS) | Yes (VR suffix) | Yes (VR suffix) | Yes (ZQ suffix) | Yes | Yes (VR suffix) | Yes (ZQ suffix) | Yes (VR suffix) |
| Pin-Compatible Drop-In | Reference part | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Pin-compatible across entire MPC8xx family for design reuse (vs MPC866PCVR100A)
- Integrated Communications Processor Module (CPM) (vs Discrete CPU plus external framer ASIC)
- Established firmware ecosystem and toolchain (vs Newer ARM-based communications processors)
Design Notes
Estimated: The MPC860DEVR80D4 dissipates approximately 1.5 W to 2.5 W typical operating power at 80 MHz with mixed peripheral activity, based on the 0.32 um CMOS process and PowerQUICC MPC860 family thermal data. The 357-PBGA package has a theta_JA around 20 C/W with adequate PCB copper pour, resulting in a 30 to 50 C junction temperature rise above ambient. For sustained full-load operation at 80 MHz, designers should allocate at least 4 square inches of continuous copper on top and bottom layers connected by thermal vias directly under the BGA thermal balls.
The 357-PBGA package with 1.27 mm ball pitch requires a 4-layer or 6-layer PCB stackup with controlled-impedance routing for Ethernet, SCC, and clock signals. Decoupling capacitors (0.1 uF ceramic plus 10 uF bulk) must be placed within 100 mils of each power pin group with vias directly to inner ground planes. Trace escape from the inner-row BGA balls should fan out to perimeter pads using 5 mil traces with 5 mil spacing. Below the BGA, no signal traces are permitted on any layer to maintain a continuous reference plane.
Do not assume the MPC860DEVR80D4 is still in production - the NXP product page marks it End of Life. Sourcing through unauthorized brokers risks counterfeit parts; always require traceability documentation. The 357-PBGA is not visually inspectable after assembly, so X-ray inspection is mandatory per IPC-A-610 acceptance criteria. Firmware written for 80 MHz timing loops will not run correctly on the 66 MHz drop-in variants without recompilation or delay-loop adjustments.
Route the Ethernet MII/RMII signals with 50 ohm controlled impedance on the top layer over a continuous ground plane, keeping trace lengths matched within 50 mils for clock and data pairs. Place the 25 MHz or 50 MHz system oscillator within 500 mils of the EXTCLK pin and guard it with a ground ring. The JTAG signals (TCK, TMS, TDI, TDO, TRST) should be routed together with 4 mil spacing and brought to a 0.1 inch header for boundary-scan debug access during bring-up.
Compliance Information
RoHS compliant per VR suffix designation in the MPN. Lead-free finish confirmed. Halogen-free status not explicitly stated in available datasheet excerpts. AEC-Q100 not applicable for industrial/telecom MPU. Part is marked End of Life on NXP product page as of 2026-10-17.
