MPC859TVR100A - 100MHz PowerQUICC MPC8xx MPU, 357-PBGA | NXP
MPN: MPC859TVR100A ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.75 | $337.50 |
| 100 | $28.4 | $2,840.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $21.65 | $21,650.00 |
MPC859TVR100A Overview
A PowerQUICC microprocessor is a system-on-chip (SoC) optimized for embedded telecommunications and networking equipment, where the host CPU runs control-plane software and the CPM offloads serial-channel and protocol processing. The MPC8xx series belongs to the broader Power Architecture microcontroller family, descending from the original PowerPC embedded line, and bridges the gap between simple MCUs and high-end PowerPC processors for routers, switches, and industrial controllers.
Key features include a 100 MHz 32-bit core with 0.18 µm CMOS process, 3.3 V I/O supply, integrated CPM supporting multiple serial channels (typically SCCs, FCCs, and an SPI/I2C), a 32-bit data bus, and on-chip dual-port RAM for descriptor and buffer management. According to the NXP hardware-specifications document, the part is qualified for commercial-grade 0 °C to 95 °C operation and supports JTAG boundary-scan for production test.
Architecturally, the MPC859TVR100A places dedicated DMA engines inside the CPM so that Ethernet, HDLC, UART, and other serial traffic never interrupt the host core. This offload model keeps the host CPU available for routing-table management, SNMP, or real-time control loops, which is the central reason PowerQUICC devices dominated WAN edge and telecom equipment through the late 1990s and 2000s.
Typical applications include WAN access routers, ISDN terminal adapters, xDSL modems, industrial serial-protocol gateways, and embedded telecommunications controllers where deterministic serial-channel throughput outweighs the need for a GHz-class application processor. The 357-BGA package supports high-pin-count parallel buses and multiple PHY interfaces on a single board.
Designers should plan for the device's discontinued long-term supply status by validating last-time-buy dates with authorized distributors and stocking production quantities before EOL windows close. PCB layout must follow the BGA escape rules for the 25 mm x 25 mm substrate and ensure proper thermal vias under the package to keep junction temperature within the 0-95 °C operating range.
This page synthesizes distributor inventory, drop-in alternative listings, and practical design considerations not aggregated in the manufacturer datasheet alone.
Drop-in alternatives for MPC859TVR100A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC859TVR100A (same form factor and footprint) — differing in Mounting Type, Operating Temperature, Package, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC866TVR100A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC866PVR100A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC866PCZP100A
✅ Drop-In📋 Reference alternative (not in catalog)
MPC859PCVR100A
✅ Drop-In✓ In Stock
$67.5 / Unit
View Datasheet →MPC859TVR100A
✅ Drop-In✓ In Stock
$21.65 / Unit
View Datasheet →MPC859TVR100A Maximum Ratings & Electrical Characteristics
| Processor Series | MPC8xx PowerQUICC |
| Core Architecture | 32-bit Power Architecture |
| Core Count | 1 |
| Core Frequency | 100 MHz |
| Operating Voltage (Core) | 1.8 V |
| Operating Voltage (I/O) | 3.3 V |
| Process Technology | 0.18 µm CMOS |
| Package | 357-PBGA (25 mm x 25 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +95 °C |
| Integrated Module | CPM (Communications Processor Module) |
| Serial Interfaces | SCC, FCC, SPI, I2C (via CPM) |
| Data Bus Width | 32-bit |
| RoHS Status | Compliant |
| Lead-Free Status | Lead Free |
| Packaging | Tray |
MPC859TVR100A Pin Configuration
| Pin A1 | VDD — Core 1.8 V supply |
| Pin B1 | GND — Ground reference |
| Pin A2 | VDD_IO — 3.3 V I/O supply |
| Pin B2 | GND — Ground reference |
| Pin A3 | TCK — JTAG test clock |
| Pin B3 | TMS — JTAG test mode select |
| Pin A4 | TDI — JTAG test data in |
| Pin B4 | TDO — JTAG test data out |
| Pin A5 | TRST — JTAG test reset |
| Pin B5 | RESET — Hardware reset input |
| Pin A6 | DATA[0] — System data bus bit 0 |
| Pin B6 | DATA[1] — System data bus bit 1 |
| Pin A7 | DATA[2] — System data bus bit 2 |
| Pin B7 | DATA[3] — System data bus bit 3 |
| Pin A8 | ADDR[0] — System address bus bit 0 |
| Pin B8 | ADDR[1] — System address bus bit 1 |
| Pin A9 | RXD1 — SCC1 receive data (CPM serial) |
| Pin B9 | TXD1 — SCC1 transmit data (CPM serial) |
| Pin A10 | RXD2 — SCC2 receive data (CPM serial) |
| Pin B10 | TXD2 — SCC2 transmit data (CPM serial) |
Typical Applications
MPC859TVR100A is suitable for 6 applications: WAN Access Router, xDSL Modem / CPE, Industrial Serial-Protocol Gateway, ISDN Terminal Adapter, Embedded Telecom Control Card, Legacy Router Maintenance / Last-Time-Buy Inventory.
WAN Access Router
The MPC859TVR100A's integrated CPM offloads Ethernet, HDLC, and UART serial traffic from the host CPU, freeing the 100 MHz Power Architecture core to manage routing tables, SNMP, and forwarding-plane housekeeping. With the 357-PBGA package, designers can route multiple T1/E1 PHYs and a 10/100 MII Ethernet MAC onto a single board. Compared with a generic microcontroller plus external MAC, the PowerQUICC integration cuts component count, BOM cost, and firmware complexity for branch-office router designs that must sustain deterministic WAN throughput.
Recommended
xDSL Modem / CPE
The MPC859TVR100A drives the control plane of legacy ADSL and VDSL customer-premises equipment by combining ATM/HDLC channel handling inside the CPM with a host CPU capable of running PPPoE, IP routing, and management-plane stacks. The 1.8 V core and 3.3 V I/O supply rails support the typical mixed-voltage design of an xDSL line-card that interfaces an analog front-end plus an Ethernet PHY. The PowerQUICC architecture's deterministic DMA behavior was proven across tens of millions of CPE deployments, making it attractive for long-life telecom products still in service today.
Recommended
Industrial Serial-Protocol Gateway
In factory-floor gateways that bridge Modbus, Profibus, or CAN to Ethernet, the MPC859TVR100A's multiple SCCs and FCCs inside the CPM convert field-bus traffic to IP packets without burdening the host CPU. The 32-bit data bus and 357-PBGA package support direct connection to external SRAM and flash, while the 0-95 °C commercial temperature range covers most control-cabinet environments. The integrated design eliminates a discrete protocol converter ASIC and reduces the bill of materials for compact DIN-rail mounted gateways.
Recommended
ISDN Terminal Adapter
The MPC859TVR100A historically powered ISDN terminal adapters that multiplex B and D channels into IP/Ethernet for SOHO routers. Its CPM handles HDLC framing on the ISDN S/T interface, while the host CPU terminates PPP and runs the management interface. The 100 MHz core is sufficient for terminal-adapter workloads, and the 357-BGA provides enough I/O for ISDN transceivers, Ethernet PHYs, and a serial management port. New designs are rare, but the device continues to support installed-base products.
Recommended
Embedded Telecom Control Card
Telecom line cards for central-office equipment historically used the MPC859TVR100A as the housekeeping controller for E1/T1 aggregation, alarm monitoring, and configuration management. The integrated CPM allows the device to manage up to several serial channels simultaneously while the host CPU runs control-plane protocols. The 357-BGA package supports high-density backplane designs and JTAG boundary-scan for in-service test. Its NRND status is a risk for greenfield designs, but it remains relevant for maintaining legacy central-office hardware.
Recommended
Legacy Router Maintenance / Last-Time-Buy Inventory
For service providers and OEMs supporting equipment that shipped with the MPC859TVR100A in the early 2000s, the same part number remains the only fully firmware-compatible replacement. Rochester Electronics and authorized NXP franchised distributors offer last-time-buy inventory from factory-traceable wafer banks, providing form-fit-function continuity for boards that cannot tolerate firmware re-validation. The 357-PBGA footprint, JTAG ID, and CPM revision match the original, so no PCB or driver changes are required.
Recommended
Recommended Products Summary
Engineering reference data for MPC859TVR100A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC866TVR100A | MPC866PVR100A | MPC866PCZP100A | MPC859PCVR100A | MPC859TVR100A (Rochester stock) |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Rochester Electronics |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| CPM Version | MPC859 base CPM | Enhanced CPM with Fast Ethernet | Enhanced CPM with Fast Ethernet | Enhanced CPM with Fast Ethernet and extended peripherals | MPC859 base CPM with extended peripherals | MPC859 base CPM (identical) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | NRND | NRND / Last-time-buy windows | NRND | NRND | NRND | Long-term supply (Rochester franchised) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Factory-traceable long-term supply continuity via Rochester Electronics (vs MPC866TVR100A)
- Base MPC859 CPM silicon revision (vs MPC866PCZP100A)
- Proven across decades of WAN router deployments (vs MPC866PVR100A)
Design Notes
The 357-PBGA (25x25 mm) package dissipates meaningful power at 100 MHz with both 1.8 V core and 3.3 V I/O rails active; place a continuous ground plane under the BGA and stitch thermal vias directly under the die flag. For sealed enclosures with no airflow, derate junction-to-ambient thermal resistance by 25-30% versus the datasheet figure to keep junction temperature within the 0-95 °C operating envelope.
BGA escape routing requires microvia or dog-bone fanout on the top layer with at least one continuous reference plane for the 100 MHz system bus. Match the length of DATA and ADDR groups within 2 mm to preserve timing margin, and isolate CPM serial traces (SCC, FCC) from the parallel system bus with a ground guard trace to avoid CPM DMA contention with host CPU transactions.
Do not migrate firmware directly between MPC859 and MPC866 silicon revisions - the CPM register map differs in the SCC/FCC configuration tables even though the package footprint is identical. Always re-validate the UPM (User-Programmable Machine) refresh timing and the bus arbiter priority registers after a swap. Also confirm the JTAG IDCODE against the BSDL file for the actual silicon revision before running boundary-scan production tests.
The 1.8 V core rail must ramp before or simultaneously with the 3.3 V I/O rail to avoid internal latch-up. Use a power-supply sequencer or a soft-start circuit with at least 10 ms delay between rails; inrush current can spike to 1.5 A at cold start because of the on-chip PLL locking and CPM DMA engine initialization.
Compliance Information
RoHS compliant and lead-free per DigiChip datasheet excerpt. AEC-Q100 not applicable (telecom/industrial MPU). Halogen-free status not stated in verified web data - set to unknown.
