MPC860ENZQ66D4557 - PowerQUICC 32-bit MPU, 66 MHz, 357-BGA | NXP
MPN: MPC860ENZQ66D4557 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $108.39 | $108.39 |
| 10 | $102.5 | $1,025.00 |
| 100 | $96.1 | $9,610.00 |
| 500 | $89.25 | $44,625.00 |
| 1,000 | $82.4 | $82,400.00 |
MPC860ENZQ66D4557 Overview
A microprocessor (MPU) is a processor-on-a-chip that integrates a CPU core, memory management, and on-chip peripherals; in the embedded-systems hierarchy the MPC860 sits at the MPU -> integrated communications controller -> PowerQUICC -> PowerPC -> 32-bit embedded processor node. The PowerQUICC family is the lineage that later evolved into the PowerQUICC II/III (MPC82xx/MPC83xx) and ultimately QorIQ communications processors, so the MPC860 remains a recognized reference design for legacy telecom and industrial control boards.
Key features of the MPC860ENZQ66D4557 include four on-chip serial communication controllers (SCCs) supporting Ethernet, HDLC/SDLC, UART, and transparent modes; two serial management controllers (SMCs); one serial peripheral interface (SPI) and one I2C interface; a programmable interrupt controller; a 32-bit address bus supporting up to 4 Gbyte address space; and 3.3 V I/O with 5 V tolerant inputs (per the PBGA device). The 357-PBGA package provides a robust surface-mount thermal envelope for industrial temperature operation from -40 C to +95 C ambient.
Typical applications include industrial routers, ISDN/T1/E1 line cards, ATM switches, Ethernet switches with serial WAN uplinks, point-of-sale terminals, and SCADA controllers. The on-chip CPM dramatically reduces host-CPU load for protocols such as PPP, HDLC, and IEEE 802.3, which is why legacy telecom and factory-floor equipment continue to specify this part.
When designing with the MPC860, ensure signal integrity on the 66 MHz external bus; add series termination if the bus length exceeds 50 mm. Power sequencing between the 3.3 V core and 3.3 V I/O rails must follow the SIU section of the datasheet to avoid latch-up. Decoupling must follow the manufacturer's reference board layout to keep the CPM's PLL within specification.
This page synthesizes distributor inventory, drop-in alternative candidates in the same 357-PBGA package, and practical design notes compiled from the legacy PowerQUICC user manual - information not presented as a single view on DigiKey or the NXP product page.
Drop-in alternatives for MPC860ENZQ66D4557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC860ENZQ50D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860ENZQ66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860ENZQ80D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860ENZQ66D3
✅ Drop-In📋 Reference alternative (not in catalog)
MPC850DSL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC860ENZQ66D4557 Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC (PowerQUICC) |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 66 MHz |
| Cache Memory (Instruction) | 4 Kbyte unified/instruction |
| Cache Memory (Data) | 4 Kbyte |
| I/O Voltage | 3.3 V |
| Package | 357-PBGA (25 mm x 25 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 C to +95 C (industrial ambient) |
| Communications Processor Module (CPM) | Yes (4 SCCs, 2 SMCs, SPI, I2C) |
| Ethernet Support | 10/100 Mbps via SCC channels (Fast Ethernet on EN variants) |
| Address Space | 32-bit physical, up to 4 Gbyte |
| External Memory Controller | Yes (DRAM, SRAM, ROM, Flash) |
| PCMCIA Support | Yes (two slots) |
| UART | Yes (SCC/SMC channels) |
| MSL Level | 3 (per PBGA 25 x 25) |
| Lead-Free | Yes (per PBGA finish) |
MPC860ENZQ66D4557 Pin Configuration
| Pin B1 | VDD — Core + I/O 3.3 V supply |
| Pin B25 | TEXP — Thermal expander / no-connect pad exposed on top side |
| Pin G14 | GND — Common ground (BGA uses multiple GND balls) |
Typical Applications
MPC860ENZQ66D4557 is suitable for 7 applications: Industrial Router and WAN Aggregator, T1 / E1 Line Card and Channel Bank, ISDN PRI Gateway and PBX Backplane, Point-of-Sale and ATM Terminal Controller, SCADA and Industrial Automation Controller, Ethernet Switch with Serial Uplinks, Legacy Aerospace Telemetry Interface.
Industrial Router and WAN Aggregator
The MPC860ENZQ66D4557 fits legacy industrial routers and WAN aggregation devices because its 66 MHz PowerPC core plus on-chip CPM offload Ethernet and HDLC handling without an external protocol ASIC. Its 4-Kbyte I+D cache keeps the T1/E1 ISR deterministic, while the dual PCMCIA slots accept compact wireless or modem cards for cellular failover. Compared to a generic ARM9 router IC, this part still wins where customers want the longest possible service life on a PowerQUICC platform.
Recommended
T1 / E1 Line Card and Channel Bank
MPC860ENZQ66D4557 is a classic choice for T1/E1 channel banks because the four SCC channels can each be framed as an HDLC trunk while the core runs upper-layer stack. Its 66 MHz clock supports DS3-rate framing on a single SCC in transparent mode and supports the IEEE 802.3 mux behind a small external transceiver. The -40 C to +95 C industrial rating and PBGA thermal envelope survive the constrained airflow of telecom equipment cabinets.
Recommended
ISDN PRI Gateway and PBX Backplane
The MPC860ENZQ66D4557 has been a workhorse in legacy ISDN PRI gateways and PBX backplanes because its CPM can simultaneously drive HDLC and PPP stacks without consuming core cycles. The 32-bit address space (up to 4 Gbyte) makes it well suited to large volatile call-record buffers. Same-footprint alternatives like MPC860ENZQ50D4 cover lower-channel-count variants of the same architecture.
Recommended
Point-of-Sale and ATM Terminal Controller
MPC860ENZQ66D4557 powers legacy POS and ATM controllers thanks to the integrated Ethernet SCC, dual PCMCIA slots (for cash-card readers or wireless modems), and the SIU's flexible external memory interface. The 66 MHz PowerPC core handles mod-10 PAN validation and secure-transaction key exchange. The 357-PBGA industrial-temperature rating supports unattended outdoor kiosk deployments.
Recommended
SCADA and Industrial Automation Controller
MPC860ENZQ66D4557 is widely deployed in legacy SCADA RTU controllers because the CPM handles Modbus, DNP3, and IEC 60870 protocol stacks in firmware while the core runs the control loop. Its 66 MHz clock, dual PCMCIA slots, and -40 C to +95 C industrial-temperature rating suit outdoor substation environments with limited cooling. Customers who service industrial lines find the part invaluable for keeping these systems running beyond the original NXP lifecycle.
Recommended
Ethernet Switch with Serial Uplinks
MPC860ENZQ66D4557 is well matched to legacy Ethernet-switch modules that aggregate Ethernet MAC frames into a serial uplink (HDLC, T1/E1). The CPM's Ethernet MAC and SCC channels are tightly coupled for cut-through forwarding, while the 32-bit PowerPC core runs the routing/CLI code. Equivalent 357-PBGA parts include MPC860ENZQ50D4 for lower port-count switches and MPC860ENZQ80D4 for head-end aggregation.
Recommended
Legacy Aerospace Telemetry Interface
MPC860ENZQ66D4557 is sometimes found in older aerospace telemetry interfaces where the part's deterministic interrupt latency and deterministic CPM timing must remain unchanged across the program lifetime. The -40 C to +95 C industrial-temperature rating plus the rugged PBGA package survive extended vibration and thermal cycling. Designers of long-life military platforms keep MPC860ENZQ66D4 as an inventory choice for procurement continuity.
Recommended
Recommended Products Summary
Engineering reference data for MPC860ENZQ66D4557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC860ENZQ50D4 | MPC860ENZQ66D4 | MPC860ENZQ80D4 | MPC860ENZQ66D3 | MPC850DSL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm, ZQ) | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA - same family |
| Core Frequency | 66 MHz | 50 MHz (-24%) | 66 MHz (0%) | 80 MHz (+21%) | 66 MHz (0%) | 50 MHz (-24%) |
| Core Architecture | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC | PowerPC |
| Cache (I+D) | 4 Kbyte unified + 4 Kbyte data | 4 Kbyte unified + 4 Kbyte data - same | 4 Kbyte unified + 4 Kbyte data - same | 4 Kbyte unified + 4 Kbyte data - same | 4 Kbyte unified + 4 Kbyte data - same | 4 Kbyte unified + 4 Kbyte data - same |
| On-chip CPM (SCC/SMC) | Yes (4 SCC + 2 SMC + SPI + I2C) | Yes (identical CPM block) | Yes (identical CPM block) | Yes (identical CPM block) | Yes (identical CPM block) | Yes (reduced SCC count) |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| PCMCIA Slots | 2 | 2 | 2 | 2 | 2 | 1 (reduced) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Customer-specific 66 MHz D4557 variant of the MPC860 family (vs MPC860ENZQ66D4)
- Higher throughput margin over the 50 MHz ZQ variant (vs MPC860ENZQ50D4)
- Better thermal/clock tradeoff than the legacy 80 MHz ZQ variant (vs MPC860ENZQ80D4)
Design Notes
The MPC860ENZQ66D4557's 357-PBGA thermal envelope requires careful board-level thermal management. Estimated: at maximum core + CPM load (66 MHz, all 4 SCCs active) with a 1.05 V core (typical for this generation), dissipation can reach ~1.5 W; design at least four thermal vias to an internal power plane immediately under the die-array region, per the Motorola/Freescale evaluation-board layout recommendations. Avoid placing the part near board edges where airflow is restricted.
Use a low-noise LDO post-regulator on the core rail to keep the CPM PLL within the +/- 50 ppm spec; cost-effective buck switching regulators paired with a ferrite + 10 uF ceramic LC filter work for the 3.3 V I/O rail. Power sequencing between the core and I/O rails must follow the legacy SIU startup procedure in the MPC860 user manual to avoid latch-up. Estimated: hold-time between rail-1 and rail-2 should be at least 1 ms; verify with the in-house schematic.
Route the 32-bit external memory bus with controlled impedance (50 ohm single-ended typical) and keep the bus length under 50 mm if no series termination is used. Match trace lengths within +/- 250 ps across D[0..31] to preserve bus timing margins at 66 MHz. Via-stitch the BGA fanout region with a 1-mm pitch GND cage to minimize crosstalk between SCC and memory signals.
Do not confuse the MPC860ENZQ66D4 (suffix D4) with the MPC860ENZQ66D4557 - both share the ZQ 357-PBGA footprint but D4557 is the customer-specific variant. Confirm boot-mode configuration resistors before each tape-out; the SIU's hard-reset configuration word is sampled on PORESET. Finally, ensure BGA warpage does not exceed JEDEC MSL-3 limits - dry-pack the parts at 10 percent humidity minimum 7 days before reflow.
Compliance Information
RoHS and halogen status pending reel-specific manufacturer certification; Reach and conflict-mineral compliance follow Motorola/Freescale/NXP standard declarations for the legacy PowerQUICC family. AEC-Q100 is not applicable.
