MPC860PZQ80D4R2518 - PowerQUICC 80MHz SoC | NXP | 357-PBGA
MPN: MPC860PZQ80D4R2518 ✗ End of LifeMPC860PZQ80D4R2518 Overview
A PowerQUICC (Power Architecture Quad Integrated Communications Controller) is a class of system-on-chip (SoC) devices that merges a high-performance Power Architecture processor with on-chip communications peripherals. Within the broader product hierarchy, PowerQUICC sits between general-purpose microcontrollers and dedicated network processors: it is more integrated than a discrete MCU-plus-Ethernet-MAC design yet more flexible than a fixed-function ASIC, making it a canonical building block for routers, bridges, and telecom line cards from the late 1990s and early 2000s.
Key features of the MPC860PZQ80D4R2518 include a single 32-bit PowerPC core, hardware multiply/divide, 4-channel DMA controller, integrated 10/100 Mbps Ethernet MAC with MII, two serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI), one I2C interface, HDLC/SDLC support on all SCCs, ATM SAR capability via the CPM, PCMCIA host adapter, memory controller supporting DRAM, SRAM, Flash, and EDO DRAM, a system integration unit with chip selects and timers, and a JTAG boundary-scan test interface.
Technically, the device achieves its 80MHz core clock from an external oscillator multiplied by an on-chip PLL, and integrates 4KB of instruction cache and data cache, plus a separate CPM RISC engine for protocol acceleration. The CPM offloads protocol processing from the main core, enabling simultaneous Ethernet, HDLC, and ATM traffic without CPU saturation. The 357-pin PBGA package exposes a full 32-bit external address/data bus plus dedicated communications and memory controller pins.
Typical applications include ISDN router control planes, xDSL modem CPE platforms, T1/E1 multiplexer control, industrial serial-to-Ethernet gateways, factory-floor protocol converters, and legacy telecom line-card management. The integrated CPM and Ethernet make the MPC860PZQ80D4R2518 well-suited for designs where a single IC must handle both packet processing and supervisory control.
When designing with this part, allocate generous PCB area around the 357-pin PBGA for fanout, place a 4-layer minimum stackup with dedicated power and ground planes, and follow NXP AN-2120 layout guidance for PowerQUICC BGA thermal management. The device requires a 3.3V core supply plus 5V I/O and a low-jitter system clock for Ethernet PHY synchronization.
Drop-in alternatives for MPC860PZQ80D4R2518 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC860PZQ80D4R2518 (same form factor and footprint) — differing in Core Architecture, Mounting Type, Package, Ethernet MAC, Operating Temperature.
MPC860PZQ50D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860PZQ66D4
✅ Drop-InContact for price
View Datasheet →MPC860PZQ80D4
✅ Drop-InContact for price
View Datasheet →MPC860PZQ80D4R2
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860PZQ80D5
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860PZQ80D4R2518 Maximum Ratings & Electrical Characteristics
| Series | PowerQUICC MPC860 |
| Core Architecture | 32-bit PowerPC (Power Architecture) |
| Core Count | 1 |
| Maximum Core Frequency | 80 MHz |
| On-Chip Communications Module (CPM) | Yes (RISC engine for protocol acceleration) |
| Ethernet MAC | 10/100 Mbps with MII |
| HDLC/SDLC Controllers | Multiple SCCs with HDLC support |
| ATM Support | Yes (via CPM SAR) |
| PCMCIA Interface | Yes |
| Serial Communications Controllers (SCC) | 2 |
| Serial Management Controllers (SMC) | 2 |
| SPI / I2C | 1 SPI, 1 I2C |
| DMA Channels | 4 |
| Package | 357-PBGA (25x25 mm) |
| Operating Temperature | 0C to +95C |
| Mounting Type | Surface Mount (BGA) |
MPC860PZQ80D4R2518 357-pbga (25x25 mm) Pin Configuration Guide
Pin configuration for MPC860PZQ80D4R2518 (357-pbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC860PZQ80D4R2518.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC860PZQ80D4R2518 is suitable for 6 applications: ISDN Router Control Plane, xDSL CPE Modem Platform, Industrial Serial-to-Ethernet Gateway, T1/E1 Multiplexer Control Card, Legacy Telecom Line-Card Management, Factory-Floor Protocol Converter.
ISDN Router Control Plane
The MPC860PZQ80D4R2518 fits ISDN router control plane designs because its integrated CPM can manage HDLC framing on the ISDN BRI/U interface while the 32-bit PowerPC core runs the routing stack. The 80MHz clock provides sufficient throughput for low-Mbps ISDN traffic, and the on-chip 10/100 Ethernet MAC connects to the LAN side without an external MAC device. Designers typically place the device between the ISDN transceiver and the Ethernet PHY, with the CPM offloading HDLC bit-stuffing and CRC computation from the CPU. Compared to a discrete MCU-plus-MAC approach, this integration reduces BOM by 4-6 parts and PCB area by roughly 30%.
Recommended
xDSL CPE Modem Platform
For xDSL customer-premises equipment, the MPC860PZQ80D4R2518 supplies the host-side control and forwarding plane paired with a discrete DSL PHY. The CPM's HDLC and ATM SAR support both legacy PPPoA and PPPoE encapsulation schemes common in early-2000s DSL deployments. The 32-bit PowerPC core handles TCP/IP routing, firewall state tables, and web management. The 357-PBGA package fits inside the typical xDSL CPE enclosure with adequate thermal margin at the 0-95C commercial temperature window. Replacing the MPC860 with this tape-and-reel variant enables high-volume pick-and-place assembly for OEM production lines.
Recommended
Industrial Serial-to-Ethernet Gateway
The MPC860PZQ80D4R2518 is well-suited for industrial serial-to-Ethernet gateways because it natively supports multiple SCCs for RS-232/RS-485 and an integrated Ethernet MAC. Engineers wire Modbus RTU devices into the SCC ports and run Modbus TCP translation on the PowerPC core. The device's 0-95C operating window covers most factory-floor cabinets, though outdoor enclosures require additional thermal management. Compared to a microcontroller-only solution, the integrated Ethernet MAC eliminates the need for an external SPI-connected Ethernet controller, simplifying firmware and reducing latency for time-critical control traffic.
Recommended
T1/E1 Multiplexer Control Card
In T1/E1 multiplexer line cards, the MPC860PZQ80D4R2518 manages multiple synchronous serial channels via its SCCs configured for HDLC framing at 1.544 Mbps (T1) or 2.048 Mbps (E1). The CPM offloads per-channel bit-stuffing and flag detection, freeing the main core for higher-layer signaling and management. The on-chip DMA engine moves channelized data to and from external DRAM without CPU intervention. The 357-PBGA package accommodates the dense pinout required for parallel TDM backplane interfaces alongside the serial T1/E1 ports. Designers pair this part with a line-interface unit (LIU) and a framer for a complete channel-bank solution.
Recommended
Legacy Telecom Line-Card Management
Central-office line cards built around the MPC860PZQ80D4R2518 use the part as a management controller that supervises the framer, monitors line quality via on-chip timers, and exposes an Ethernet management interface to the chassis backplane. The integrated PCMCIA interface supports optional modem or memory expansion cards. The 32-bit core runs VxWorks or pSOS+ real-time operating systems commonly deployed in legacy Class-5 switches. The 0-95C window matches central-office environmental specifications, and the 357-PBGA package provides reliable solder-joint reliability for the long-lifecycle telecom equipment this part was originally designed into.
Recommended
Factory-Floor Protocol Converter
The MPC860PZQ80D4R2518 converts between industrial protocols such as Profibus, Modbus, and DF1 by mapping them onto its multi-channel SCC/SMC interfaces while presenting Ethernet/IP or Modbus TCP upstream. The CPM handles deterministic bit-level protocol timing without jitter, and the PowerPC core runs the application-layer translation logic. Its 80MHz clock is sufficient for typical multi-protocol conversion at industrial cycle rates (10-100ms). The 357-PBGA footprint is well-established in legacy factory automation designs, allowing drop-in upgrade of older MPC860-based converter boards that are reaching end-of-life.
Recommended
Recommended Products Summary
Engineering reference data for MPC860PZQ80D4R2518 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC860PZQ50D4 | MPC860PZQ66D4 | MPC860PZQ80D4 | MPC860PZQ80D4R2 | MPC860PZQ80D5 |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Frequency | 80 MHz | 50 MHz (-37.5%) | 66 MHz (-17.5%) | 80 MHz (identical) | 80 MHz (identical) | 80 MHz (identical) |
| Silicon Revision | D4 | D4 | D4 | D4 | D4 | D5 (newer errata fixes) |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| Carrier Format | Tape & Reel (R2518) | Tray (default) | Tray (default) | Tray (default) | Tape & Reel (R2) | Tray (default) |
| PCMCIA Interface | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 Mbps MII | 10/100 Mbps MII | 10/100 Mbps MII | 10/100 Mbps MII | 10/100 Mbps MII | 10/100 Mbps MII |
Key Differentiators
- Highest same-family speed grade at 80MHz (vs MPC860PZQ66D4)
- Integrated PCMCIA host adapter (vs MPC860 (non-P variant))
- Tape-and-reel packaging for high-volume assembly (vs MPC860PZQ80D4 (tray pack))
Design Notes
The 357-ball PBGA at 1.27mm pitch requires a 4-layer minimum PCB stackup with dedicated power and ground planes for VCC (3.3V core), VCCSYN (PLL supply), and VCCL (5V I/O). Place 0.1uF ceramic decoupling capacitors as close as possible to every VCC ball, with bulk 10uF tantalum capacitors on each supply rail. Fanout the BGA using dog-bone or via-in-pad geometry depending on cost targets; via-in-pad requires filled and plated over for reliable assembly.
Estimated: at 80MHz core clock the MPC860PZQ80D4R2518 dissipates approximately 1.5W worst-case, yielding a junction temperature rise of about 35C above ambient with the standard 357-PBGA thermal resistance (theta_JA roughly 23 C/W on a 4-layer board). Ensure the 0-95C operating window is not exceeded in sealed enclosures by derating ambient temperature by at least 15-20C. Add thermal vias under the central BGA balls to spread heat into the inner ground plane.
Do not confuse the MPC860 (no PCMCIA) with the MPC860P (with PCMCIA) when ordering - the suffix P is critical. Verify silicon revision D4 against the latest NXP errata document before committing to production, and consider D5 (MPC860PZQ80D5) for new designs to inherit accumulated errata fixes. Ensure the system clock source meets the 50ppm jitter requirement for Ethernet PHY synchronization, and add a series ferrite bead on analog PLL supply VCCSYN to minimize jitter.
Compliance Information
RoHS/REACH status not present in Verified Web Data; flagged as [DATA_NEEDED] in specs. AEC-Q100 not applicable for this commercial-temperature communications controller.
