MPC860PZQ80D4R2518 vs MPC860PZQ66D4 Comparison
Detailed side-by-side comparison of MPC860PZQ80D4R2518 by NXP Semiconductors and MPC860PZQ66D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC860PZQ80D4R2518 - PowerQUICC 80MHz SoC | NXP | 357-PBGA
MPC860PZQ80D4R2518 NrndSpecification Comparison
| Parameter | MPC860PZQ80D4R2518 | MPC860PZQ66D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | End of Life |
| Series | PowerQUICC MPC860 | PowerQUICC |
| Core Architecture | 32-bit PowerPC (Power Architecture) | 32-bit PowerPC |
| Core Count | 1 | 1 |
| Maximum Core Frequency | 80 MHz | — |
| On-Chip Communications Module (CPM) | Yes (RISC engine for protocol acceleration) | — |
| Ethernet MAC | 10/100 Mbps with MII | — |
| HDLC/SDLC Controllers | Multiple SCCs with HDLC support | — |
| ATM Support | Yes (via CPM SAR) | — |
| PCMCIA Interface | Yes | — |
| Serial Communications Controllers (SCC) | 2 | — |
| Serial Management Controllers (SMC) | 2 | — |
| SPI / I2C | 1 SPI, 1 I2C | — |
| DMA Channels | 4 | — |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| Operating Temperature | 0C to +95C | -40C to +95C (industrial, per D4 revision) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status] | Non-Compliant (Contains Lead) |
| Supply Voltage | [DATA_NEEDED: core and I/O voltage rails] | — |
| Processor Family | — | PowerQUICC MPC8xx |
| Maximum CPU Clock | — | 66 MHz |
| Operating Supply Voltage | — | 3.3 V |
| Lead Status | — | Contains Lead (non-RoHS) |
| Packaging | — | Tray |
| On-chip Communications Module | — | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | — | DRAM, SRAM, Flash, EPROM |
| Timers | — | 4 x 16-bit |
| Process Technology | — | 0.32 um CMOS |
| MSL Level | — | 3 |