MSC7119VF1200 - 300 MHz StarCore DSP, 400-LFBGA | NXP
MPN: MSC7119VF1200 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.4 | $21,400.00 |
MSC7119VF1200 Overview
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is optimized for the arithmetic-heavy, real-time workloads of signal processing - multiply-accumulate (MAC) operations, FIR/IIR filtering, FFTs, and codec/voice/audio pipelines. In the broader hierarchy, a fixed-point DSP sits between a generic microcontroller (MCU) and a high-end floating-point DSP - faster and more deterministic than an MCU on streaming math, cheaper and lower-power than a floating-point DSP for cost-sensitive designs. The SC1400 core delivers 300 MHz instruction throughput with SIMD-friendly extensions for media and baseband work.
Key features include the integrated DDR memory controller, which removes the need for an external memory-interface ASIC, and the on-chip 10/100 Ethernet MAC, which simplifies networked audio, industrial control, or VoIP endpoint designs. The host interface, I2C, and UART peripherals allow the MSC7119VF1200 to act as both a standalone processor and as a peripheral to a host MCU/MPU. Low-power Wait and Stop processing modes extend the part into power-budget-conscious embedded applications.
The architecture is a 16-bit fixed-point SIMD-style SC1400 core with an instruction cache that mitigates external memory bandwidth pressure. Combined with 256 Kbytes of unified M1 SRAM and a 4-entry write buffer, the core can sustain high MAC throughput on streaming data without stalling on cache fills. The DDR controller and Ethernet MAC are tightly coupled to the memory subsystem for low-latency packet processing.
Typical applications include VoIP and IP-phone endpoints, networked audio processing, low-cost industrial control with Ethernet connectivity, DDR-attached streaming pipelines, and SoC companion-processor roles where an MCU delegates signal-processing tasks over a host interface. The combination of integrated Ethernet and DDR makes it well suited to entry-level media gateways.
A critical design consideration is that the MSC7119VF1200 has been declared End of Life by NXP. According to the NXP product page, the part is shipped from remaining authorized stock and via franchised distributors like Rochester Electronics, but new design-in is not recommended. Engineers should validate long-term supply and consider the NXP MSC711x family or newer NXP DSP/MPU families for new designs.
This page synthesizes distributor pricing, lifecycle status, and practical substitution notes not consolidated on the manufacturer product page.
Drop-in alternatives for MSC7119VF1200 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MSC7119VF1200 (same form factor and footprint) — differing in Package, Write Buffer, Core Clock Frequency, Instruction Cache (ICache), On-Chip RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MSC7119VM1200
✅ Drop-In✓ In Stock
$54.1 / Unit
View Datasheet →MSC7119VF1200R2
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MSC7116VF1200
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MSC7119VF1200 Specifications
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MSC7119VF1200 |
| Device Type | Fixed-Point Digital Signal Processor (DSP) |
| DSP Core | StarCore SC1400 (single core, extended) |
| Core Clock Speed | 300 MHz |
| Internal SRAM (M1) | 256 Kbytes |
| Instruction Cache (ICache) | 16 Kbytes, 16-way |
| Write Buffer | 4-entry |
| On-Chip ROM | 8 Kbytes |
| On-Chip RAM (total) | 464 Kbytes (per datachip listing) |
| Integrated Ethernet MAC | 10/100 Mbps |
| Integrated Memory Controller | DDR controller |
| Host Interfaces | Host Interface, I2C, UART |
| I/O Voltage | 3.30 V |
| Package | 400-LFBGA (MAPBGA 17x17 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Low-Power Modes | Wait and Stop processing |
| PIC | Programmable Interrupt Controller integrated |
| Datasheet Description | Low-Cost 16-bit DSP with DDR Controller and 10/100 Mbps Ethernet MAC |
MSC7119VF1200 400-lfbga (mapbga 17x17 mm) Pin Configuration Guide
Pin configuration for MSC7119VF1200 (400-lfbga (mapbga 17x17 mm) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for MSC7119VF1200.
Refer to the datasheet for full pin configuration.
Typical Applications
MSC7119VF1200 is suitable for 6 applications: VoIP and IP-Phone Endpoints, Networked Audio Processing, Industrial Control with Ethernet Connectivity, DDR-Attached Streaming Pipelines, MCU Companion / SoC Coprocessor, Low-Cost Media Gateways.
VoIP and IP-Phone Endpoints
The MSC7119VF1200's 300 MHz SC1400 core delivers the multiply-accumulate throughput required for G.711/G.729 voice codecs, echo cancellers, and tone-detection pipelines running concurrently on a single DSP. Its integrated 10/100 Mbps Ethernet MAC removes the need for an external PHY-controller ASIC, simplifying the BOM for IP-phone mainboards. Designers typically pair the DSP with a host MCU over the integrated Host Interface, with the 256 Kbytes of M1 SRAM holding active voice-frame buffers and AEC tap memory. With the DDR controller in the loop, the DSP can also load larger soft-client stacks. The 17x17 400-LFBGA package is footprint-compatible across the MSC711x family, easing platform reuse.
Recommended
Networked Audio Processing
Streamed audio over Ethernet (Dante, AES67, or proprietary) benefits from the MSC7119VF1200's combination of 300 MHz SC1400 DSP and on-chip 10/100 Ethernet MAC. The fixed-point datapath sustains FIR equalization, DRC, and basic beamforming for multi-zone speaker systems and intercom endpoints. The 256 Kbytes of internal SRAM M1 holds coefficient tables and frame buffers, while the integrated DDR controller feeds the DSP for bigger FIR taps without external memory glue logic. Wait and Stop processing modes cut power between packets, which matters for PoE-powered speakers. Designers bring the audio I/O through the host interface plus external codec.
Recommended
Industrial Control with Ethernet Connectivity
The MSC7119VF1200's on-chip 10/100 Ethernet MAC and programmable interrupt controller suit industrial-control nodes that combine deterministic signal processing (motor-control loops, vibration analysis, sensor fusion) with networked telemetry. The 400-LFBGA 17x17 package keeps the design dense on the controller board while exposing UART, I2C, and Host Interface for sensor and host-MCU bring-up. The DDR controller enables larger data-logging buffers for predictive-maintenance firmware. Low-power Wait and Stop modes reduce idle consumption on always-on nodes. The EOL status means new industrial designs should pivot to NXP Layerscape or i.MX RT, but existing lines can maintain production from authorized stock.
Recommended
DDR-Attached Streaming Pipelines
The MSC7119VF1200's integrated DDR memory controller is one of its defining features, letting the 300 MHz SC1400 core stream large data sets - imaging pre-processing, vibration capture, baseband IF - directly into external DDR without an external memory-interface ASIC. The 256 Kbytes of M1 SRAM serves as a working scratch for pipeline stages while DDR holds the deeper capture buffers. Designers leverage the Host Interface to hand off processed frames to an application processor. The 16 Kbytes of 16-way ICache and 4-entry write buffer sustain the 300 MHz instruction stream without DDR thrashing during burst MAC chains.
Recommended
MCU Companion / SoC Coprocessor
When a host MCU/MPU needs to offload signal-processing tasks - sensor fusion math, audio front-end, motor-control loops - the MSC7119VF1200 plays the role of a 300 MHz coprocessor over its Host Interface, with I2C and UART as side-band control channels. The fixed-point SC1400 core delivers deterministic cycle counts that an RTOS on the host can plan around. Designers route processed results back to the host through shared memory regions in DDR. The integrated peripherals reduce the BOM versus an MCU-plus-discrete-DSP approach, lowering board cost. Note the EOL status and prefer NXP i.MX RT for new designs.
Recommended
Low-Cost Media Gateways
Media gateways bridging TDM, Ethernet, and analog voice paths benefit from the MSC7119VF1200's 300 MHz SC1400 core, integrated 10/100 Ethernet MAC, and DDR controller on a single BGA. Code density in the on-chip ROM (8 Kbytes) and SRAM boot paths let a gateway initialize fast. The 400-LFBGA 17x17 footprint is shared across the MSC711x family, simplifying gate-density platform reuse from 4-channel SBC to 32-channel DSP farms. Wait and Stop modes lower standby consumption for consumer gateway SKUs.
Recommended
Recommended Products Summary
Engineering reference data for MSC7119VF1200 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MSC7119VM1200 | MSC7119VF1200R2 | MSC7116VF1200 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) | 400-LFBGA (17x17) |
| DSP Core | StarCore SC1400 (single) | StarCore SC1400 (single) | StarCore SC1400 (single) | StarCore SC1400 (single) |
| Integrated Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps (family feature) |
| DDR Controller | Integrated | Integrated | Integrated | Integrated (family feature) |
| Lifecycle Status | End of Life (NXP archived) | End of Life (same family) | End of Life (same die) | End of Life (same family) |
Key Differentiators
- Single, integrated 10/100 Ethernet MAC plus DDR controller on the die (vs TMC8460-BI (per Utmel cross-reference listing))
- 16 Kbyte 16-way instruction cache plus 4-entry write buffer (vs Lower-end same-family alternatives (e.g. MSC7116))
- F-variant ordering suffix for lead-free/RoHS profile (vs MSC7119VM1200 (same family, different environmental/qualification profile per ETEI comparison))
Design Notes
Estimated: the 400-LFBGA 17x17 package is a thermally enhanced MAPBGA, so it typically achieves a theta_JA around 15-25 C/W on a 4-layer JEDEC test board with thermal vias under the die. At 300 MHz core with 3.30 V I/O, the part dissipates on the order of 1-2 W in typical voice-pipeline workloads, so junction temperature rise is manageable (< 30 C). For sealed enclosures, expose thermal vias to inner copper planes and avoid placing the BGA over thermal isolation. Always validate against the manufacturer's thermal model for your specific board stack-up.
The 400-ball BGA at 17x17 mm imposes high-density routing. Use the manufacturer's reference PCB layout and ball-map files rather than reconstructing pinout - via-in-pad with filled/capped microvias is the standard escape pattern for this ball pitch. Match the impedance for DDR traces per the SC1400 family guidelines, length-match the DDR clock/address/control groups, and keep the DDR power plane as a solid island under the BGA. The Host Interface, I2C, and UART lines can be routed on inner layers but should reference a continuous ground.
Critical: the MSC7119VF1200 is End of Life per NXP's archived product page (as of 2026-10-14). Do NOT design in this part for new production. For existing designs, secure a last-time-buy volume with authorized franchised stock (Rochester Electronics and large distributors) and qualify a second-source within the MSC711x family (e.g. MSC7119VM1200) while firmware portability is still validated. After stock exhausts, plan a PCB redesign to a current NXP i.MX RT or Layerscape processor.
Estimated: a 300 MHz SC1400 core with 3.30 V I/O and DDR I/O draws on the order of 1-2 W typical with Wait/Stop processing dropping idle current sharply. Use the manufacturer's power-sequencing diagram: core VDD before I/O VDD, with proper POR sequencing to avoid latch-up. Decouple with bulk ceramic on the order of 10 uF X7R near each supply ball plus 0.1 uF/1 nF pairs at each power pin per the datasheet reference design.
Compliance Information
Per the 'F' ordering suffix (Freescale/NXP nomenclature typically denotes lead-free/RoHS profile) and per the ETEI compliance comparison page. RoHS/REACH status should be re-verified against lot-specific shipping documents because the part is End of Life and remaining stock lot compliance may vary. AEC-Q100 is not applicable - the MSC7119 family targets commercial/industrial DSP designs, not automotive.
